JP2015142901A5 - - Google Patents
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- Publication number
- JP2015142901A5 JP2015142901A5 JP2014179288A JP2014179288A JP2015142901A5 JP 2015142901 A5 JP2015142901 A5 JP 2015142901A5 JP 2014179288 A JP2014179288 A JP 2014179288A JP 2014179288 A JP2014179288 A JP 2014179288A JP 2015142901 A5 JP2015142901 A5 JP 2015142901A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electric field
- field generator
- micro
- micro object
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 28
- 230000005684 electric field Effects 0.000 claims 22
- 238000000034 method Methods 0.000 claims 7
- 230000005291 magnetic effect Effects 0.000 claims 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 239000012777 electrically insulating material Substances 0.000 claims 1
- 238000004049 embossing Methods 0.000 claims 1
- 230000005294 ferromagnetic effect Effects 0.000 claims 1
- 239000003302 ferromagnetic material Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000002907 paramagnetic material Substances 0.000 claims 1
- 108091008695 photoreceptors Proteins 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/031,468 US9431283B2 (en) | 2013-09-19 | 2013-09-19 | Direct electrostatic assembly with capacitively coupled electrodes |
| US14/031,468 | 2013-09-19 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015142901A JP2015142901A (ja) | 2015-08-06 |
| JP2015142901A5 true JP2015142901A5 (enExample) | 2017-10-12 |
| JP6438241B2 JP6438241B2 (ja) | 2018-12-12 |
Family
ID=51625788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014179288A Active JP6438241B2 (ja) | 2013-09-19 | 2014-09-03 | 静電結合した電極を有する直接静電組立体 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9431283B2 (enExample) |
| EP (1) | EP2851337B1 (enExample) |
| JP (1) | JP6438241B2 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9473047B2 (en) | 2013-09-19 | 2016-10-18 | Palo Alto Research Center Incorporated | Method for reduction of stiction while manipulating micro objects on a surface |
| US10141285B2 (en) | 2013-09-19 | 2018-11-27 | Palo Alto Research Center Incorporated | Externally induced charge patterning using rectifying devices |
| US10134803B2 (en) | 2015-01-23 | 2018-11-20 | Vuereal Inc. | Micro device integration into system substrate |
| US20160219702A1 (en) | 2015-01-23 | 2016-07-28 | Gholamreza Chaji | Selective micro device transfer to receiver substrate |
| US12402466B2 (en) | 2015-01-23 | 2025-08-26 | Vuereal Inc. | Micro device integration into system substrate |
| US10700120B2 (en) | 2015-01-23 | 2020-06-30 | Vuereal Inc. | Micro device integration into system substrate |
| US10519037B2 (en) | 2016-01-18 | 2019-12-31 | Palo Alto Research Center Incorporated | Multipass transfer surface for dynamic assembly |
| US20170215280A1 (en) | 2016-01-21 | 2017-07-27 | Vuereal Inc. | Selective transfer of micro devices |
| CN115966503A (zh) | 2016-10-04 | 2023-04-14 | 维耶尔公司 | 施体衬底中的微装置布置 |
| US10043687B2 (en) * | 2016-12-27 | 2018-08-07 | Palo Alto Research Center Incorporated | Bumped electrode arrays for microassemblers |
| US11302554B2 (en) * | 2018-12-17 | 2022-04-12 | Palo Alto Research Center Incorporated | Micro assembler with fine angle control |
| US11203525B2 (en) * | 2018-12-31 | 2021-12-21 | Palo Alto Research Center Incorporated | Method of controlling the placement of micro-objects |
| KR20240008681A (ko) * | 2022-07-12 | 2024-01-19 | 에스케이하이닉스 주식회사 | 반도체 장치 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04159920A (ja) * | 1990-10-24 | 1992-06-03 | Mitsubishi Kasei Corp | 物品搬送機構 |
| JPH05116757A (ja) * | 1991-10-24 | 1993-05-14 | Ricoh Co Ltd | 搬送機構 |
| JPH05184163A (ja) * | 1991-12-27 | 1993-07-23 | Masafumi Yano | 静電アクチュエータ |
| JPH07203689A (ja) * | 1993-12-31 | 1995-08-04 | Toshiro Higuchi | 静電アクチュエータ |
| JPH07213077A (ja) * | 1994-01-18 | 1995-08-11 | Nippon Telegr & Teleph Corp <Ntt> | 光制御型静電気駆動アクチュエータ |
| JP3215335B2 (ja) * | 1996-10-29 | 2001-10-02 | 株式会社富士電機総合研究所 | リニア電磁型マイクロアクチュエータ |
| JPH10271850A (ja) * | 1997-03-26 | 1998-10-09 | Oki Electric Ind Co Ltd | 媒体搬送装置 |
| JPH1155963A (ja) * | 1997-08-01 | 1999-02-26 | Oki Electric Ind Co Ltd | 媒体搬送装置 |
| JP2000143024A (ja) * | 1998-11-10 | 2000-05-23 | Oki Electric Ind Co Ltd | 媒体搬送装置 |
| JP2000209877A (ja) * | 1999-01-13 | 2000-07-28 | Dainippon Printing Co Ltd | 静電アクチュエ―タにおける電極配線板、及びその製造方法 |
| US6923979B2 (en) * | 1999-04-27 | 2005-08-02 | Microdose Technologies, Inc. | Method for depositing particles onto a substrate using an alternating electric field |
| GB2354114A (en) * | 1999-09-13 | 2001-03-14 | Gareth John Monkman | Micro-scale electrostatic gripper |
| WO2001095375A1 (en) | 2000-06-06 | 2001-12-13 | The Penn State Research Foundation | An electro-fluidic assembly process for integration of electronic devices onto a substrate |
| JP2002068477A (ja) * | 2000-08-30 | 2002-03-08 | Hitachi Metals Ltd | 微小粒体搬送装置 |
| US7629026B2 (en) | 2004-09-03 | 2009-12-08 | Eastman Kodak Company | Thermally controlled fluidic self-assembly |
| US7332361B2 (en) | 2004-12-14 | 2008-02-19 | Palo Alto Research Center Incorporated | Xerographic micro-assembler |
| US7728427B2 (en) * | 2007-12-07 | 2010-06-01 | Lctank Llc | Assembling stacked substrates that can form cylindrical inductors and adjustable transformers |
| US7861405B2 (en) | 2008-03-03 | 2011-01-04 | Palo Alto Research Center Incorporated | System for forming a micro-assembler |
| US8581167B2 (en) | 2010-11-16 | 2013-11-12 | Palo Alto Research Center Incorporated | Optically patterned virtual electrodes and interconnects on polymer and semiconductive substrates |
| US10014261B2 (en) | 2012-10-15 | 2018-07-03 | Palo Alto Research Center Incorporated | Microchip charge patterning |
| US10141285B2 (en) | 2013-09-19 | 2018-11-27 | Palo Alto Research Center Incorporated | Externally induced charge patterning using rectifying devices |
| US9473047B2 (en) | 2013-09-19 | 2016-10-18 | Palo Alto Research Center Incorporated | Method for reduction of stiction while manipulating micro objects on a surface |
-
2013
- 2013-09-19 US US14/031,468 patent/US9431283B2/en active Active
-
2014
- 2014-09-03 JP JP2014179288A patent/JP6438241B2/ja active Active
- 2014-09-15 EP EP14184825.9A patent/EP2851337B1/en not_active Not-in-force
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