JP6438241B2 - 静電結合した電極を有する直接静電組立体 - Google Patents

静電結合した電極を有する直接静電組立体 Download PDF

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Publication number
JP6438241B2
JP6438241B2 JP2014179288A JP2014179288A JP6438241B2 JP 6438241 B2 JP6438241 B2 JP 6438241B2 JP 2014179288 A JP2014179288 A JP 2014179288A JP 2014179288 A JP2014179288 A JP 2014179288A JP 6438241 B2 JP6438241 B2 JP 6438241B2
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Prior art keywords
substrate
micro
micro object
electric field
field generator
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JP2014179288A
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Japanese (ja)
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JP2015142901A5 (enExample
JP2015142901A (ja
Inventor
ジェイソン・トムソン
ユージン・エム・チャウ
ジェンピン・ルー
グレゴリー・エル・ホワイティング
デイヴィッド・ケイ・ビーゲルセン
ジャノス・ベレス
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Palo Alto Research Center Inc
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Palo Alto Research Center Inc
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
    • B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
    • H10P72/70—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00—Magnets
    • H01F7/06—Electromagnets; Actuators including electromagnets
    • H01F7/20—Electromagnets; Actuators including electromagnets without armatures
    • H01F7/206—Electromagnets for lifting, handling or transporting of magnetic pieces or material
    • H10P72/72—
    • H10W72/0198—

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Micromachines (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)
JP2014179288A 2013-09-19 2014-09-03 静電結合した電極を有する直接静電組立体 Active JP6438241B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/031,468 US9431283B2 (en) 2013-09-19 2013-09-19 Direct electrostatic assembly with capacitively coupled electrodes
US14/031,468 2013-09-19

Publications (3)

Publication Number Publication Date
JP2015142901A JP2015142901A (ja) 2015-08-06
JP2015142901A5 JP2015142901A5 (enExample) 2017-10-12
JP6438241B2 true JP6438241B2 (ja) 2018-12-12

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JP2014179288A Active JP6438241B2 (ja) 2013-09-19 2014-09-03 静電結合した電極を有する直接静電組立体

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US (1) US9431283B2 (enExample)
EP (1) EP2851337B1 (enExample)
JP (1) JP6438241B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9473047B2 (en) 2013-09-19 2016-10-18 Palo Alto Research Center Incorporated Method for reduction of stiction while manipulating micro objects on a surface
US10141285B2 (en) 2013-09-19 2018-11-27 Palo Alto Research Center Incorporated Externally induced charge patterning using rectifying devices
US10134803B2 (en) 2015-01-23 2018-11-20 Vuereal Inc. Micro device integration into system substrate
US20160219702A1 (en) 2015-01-23 2016-07-28 Gholamreza Chaji Selective micro device transfer to receiver substrate
US12402466B2 (en) 2015-01-23 2025-08-26 Vuereal Inc. Micro device integration into system substrate
US10700120B2 (en) 2015-01-23 2020-06-30 Vuereal Inc. Micro device integration into system substrate
US10519037B2 (en) 2016-01-18 2019-12-31 Palo Alto Research Center Incorporated Multipass transfer surface for dynamic assembly
US20170215280A1 (en) 2016-01-21 2017-07-27 Vuereal Inc. Selective transfer of micro devices
CN115966503A (zh) 2016-10-04 2023-04-14 维耶尔公司 施体衬底中的微装置布置
US10043687B2 (en) * 2016-12-27 2018-08-07 Palo Alto Research Center Incorporated Bumped electrode arrays for microassemblers
US11302554B2 (en) * 2018-12-17 2022-04-12 Palo Alto Research Center Incorporated Micro assembler with fine angle control
US11203525B2 (en) * 2018-12-31 2021-12-21 Palo Alto Research Center Incorporated Method of controlling the placement of micro-objects
KR20240008681A (ko) * 2022-07-12 2024-01-19 에스케이하이닉스 주식회사 반도체 장치

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04159920A (ja) * 1990-10-24 1992-06-03 Mitsubishi Kasei Corp 物品搬送機構
JPH05116757A (ja) * 1991-10-24 1993-05-14 Ricoh Co Ltd 搬送機構
JPH05184163A (ja) * 1991-12-27 1993-07-23 Masafumi Yano 静電アクチュエータ
JPH07203689A (ja) * 1993-12-31 1995-08-04 Toshiro Higuchi 静電アクチュエータ
JPH07213077A (ja) * 1994-01-18 1995-08-11 Nippon Telegr & Teleph Corp <Ntt> 光制御型静電気駆動アクチュエータ
JP3215335B2 (ja) * 1996-10-29 2001-10-02 株式会社富士電機総合研究所 リニア電磁型マイクロアクチュエータ
JPH10271850A (ja) * 1997-03-26 1998-10-09 Oki Electric Ind Co Ltd 媒体搬送装置
JPH1155963A (ja) * 1997-08-01 1999-02-26 Oki Electric Ind Co Ltd 媒体搬送装置
JP2000143024A (ja) * 1998-11-10 2000-05-23 Oki Electric Ind Co Ltd 媒体搬送装置
JP2000209877A (ja) * 1999-01-13 2000-07-28 Dainippon Printing Co Ltd 静電アクチュエ―タにおける電極配線板、及びその製造方法
US6923979B2 (en) * 1999-04-27 2005-08-02 Microdose Technologies, Inc. Method for depositing particles onto a substrate using an alternating electric field
GB2354114A (en) * 1999-09-13 2001-03-14 Gareth John Monkman Micro-scale electrostatic gripper
WO2001095375A1 (en) 2000-06-06 2001-12-13 The Penn State Research Foundation An electro-fluidic assembly process for integration of electronic devices onto a substrate
JP2002068477A (ja) * 2000-08-30 2002-03-08 Hitachi Metals Ltd 微小粒体搬送装置
US7629026B2 (en) 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US7332361B2 (en) 2004-12-14 2008-02-19 Palo Alto Research Center Incorporated Xerographic micro-assembler
US7728427B2 (en) * 2007-12-07 2010-06-01 Lctank Llc Assembling stacked substrates that can form cylindrical inductors and adjustable transformers
US7861405B2 (en) 2008-03-03 2011-01-04 Palo Alto Research Center Incorporated System for forming a micro-assembler
US8581167B2 (en) 2010-11-16 2013-11-12 Palo Alto Research Center Incorporated Optically patterned virtual electrodes and interconnects on polymer and semiconductive substrates
US10014261B2 (en) 2012-10-15 2018-07-03 Palo Alto Research Center Incorporated Microchip charge patterning
US10141285B2 (en) 2013-09-19 2018-11-27 Palo Alto Research Center Incorporated Externally induced charge patterning using rectifying devices
US9473047B2 (en) 2013-09-19 2016-10-18 Palo Alto Research Center Incorporated Method for reduction of stiction while manipulating micro objects on a surface

Also Published As

Publication number Publication date
US20150262856A1 (en) 2015-09-17
JP2015142901A (ja) 2015-08-06
US9431283B2 (en) 2016-08-30
EP2851337A3 (en) 2015-04-29
EP2851337A2 (en) 2015-03-25
EP2851337B1 (en) 2016-05-04

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