JP2015061509A - 表面上でマイクロ物体を操作する間に静摩擦を抑える方法 - Google Patents
表面上でマイクロ物体を操作する間に静摩擦を抑える方法 Download PDFInfo
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- JP2015061509A JP2015061509A JP2014179275A JP2014179275A JP2015061509A JP 2015061509 A JP2015061509 A JP 2015061509A JP 2014179275 A JP2014179275 A JP 2014179275A JP 2014179275 A JP2014179275 A JP 2014179275A JP 2015061509 A JP2015061509 A JP 2015061509A
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Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N1/00—Electrostatic generators or motors using a solid moving electrostatic charge carrier
- H02N1/002—Electrostatic motors
- H02N1/004—Electrostatic motors in which a body is moved along a path due to interaction with an electric field travelling along the path
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0005—Apparatus specially adapted for the manufacture or treatment of microstructural devices or systems, or methods for manufacturing the same
- B81C99/002—Apparatus for assembling MEMS, e.g. micromanipulators
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K1/00—Details of the magnetic circuit
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
Abstract
Description
Claims (10)
- マイクロ物体を操作するシステムであって、
その上で前記マイクロ物体が操作される表面と、
電界生成器であって
前記マイクロ物体と前記表面の間の静摩擦に少なくとも部分的に打ち勝つための周波数および振幅で駆動力を生成し、
2次元の前記表面上で前記マイクロ物体を操作する、空間的にプログラム可能な操作力を生成するよう設定される電界生成器と、
を含むシステム。 - 前記電界生成器が、前記駆動力を前記操作力の上に重ね合わせて、前記マイクロ物体の動きを実現するようさらに設定される、請求項1に記載のシステム。
- 前記操作力の一部の間だけ、前記駆動力が前記操作力に重なり合う、請求項2に記載のシステム。
- 前記駆動力の前記周波数および前記振幅が、部分的にだけ前記マイクロ物体と前記表面の間の静摩擦に打ち勝つ、請求項2に記載のシステム。
- 前記駆動力が前記操作力に重なり合うとき、前記駆動力の前記周波数および前記振幅により減衰量が制御される、請求項4に記載のシステム。
- 前記駆動力が、繰り返される力の段階変化または繰り返される段階パルスである、請求項1に記載のシステム。
- 前記電界生成器が
前記駆動力を前記マイクロ物体にかけ、
前記駆動力を前記マイクロ物体にかけた後に、前記操作力を前記マイクロ物体にかけるようさらに設定される、請求項1に記載のシステム。 - マイクロ物体を操作する方法であって、
マイクロ物体と、その上に前記マイクロ物体が操作される表面との間の静摩擦に少なくとも部分的に打ち勝つための周波数および振幅で駆動力を生成するステップと
2次元の前記表面上で前記マイクロ物体を操作するための空間的にプログラム可能な操作力を生成するステップと、を含む方法。 - 前記駆動力を前記操作力に重ね合わせて、前記マイクロ物体の動きを実現するステップをさらに含む、請求項8に記載の方法。
- 前記マイクロ物体の一部にのみ前記駆動力をかけるステップをさらに含む請求項8に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/031,392 | 2013-09-19 | ||
US14/031,392 US9473047B2 (en) | 2013-09-19 | 2013-09-19 | Method for reduction of stiction while manipulating micro objects on a surface |
Publications (3)
Publication Number | Publication Date |
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JP2015061509A true JP2015061509A (ja) | 2015-03-30 |
JP2015061509A5 JP2015061509A5 (ja) | 2017-10-12 |
JP6313169B2 JP6313169B2 (ja) | 2018-04-18 |
Family
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JP2014179275A Active JP6313169B2 (ja) | 2013-09-19 | 2014-09-03 | 表面上でマイクロ物体を操作する間に静摩擦を抑える方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9473047B2 (ja) |
EP (1) | EP2851336B1 (ja) |
JP (1) | JP6313169B2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160108549A (ko) * | 2014-01-21 | 2016-09-19 | 퍼시몬 테크놀로지스 코포레이션 | 기판 이송 진공 플랫폼 |
JP2018107436A (ja) * | 2016-12-27 | 2018-07-05 | パロ アルト リサーチ センター インコーポレイテッド | マイクロアセンブラのためのバンプ電極アレイ |
JP2020099182A (ja) * | 2018-12-17 | 2020-06-25 | パロ アルト リサーチ センター インコーポレイテッド | 精細な角度制御を備えたマイクロアセンブラ |
Families Citing this family (7)
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---|---|---|---|---|
US9431283B2 (en) | 2013-09-19 | 2016-08-30 | Palo Alto Research Center Incorporated | Direct electrostatic assembly with capacitively coupled electrodes |
US10141285B2 (en) | 2013-09-19 | 2018-11-27 | Palo Alto Research Center Incorporated | Externally induced charge patterning using rectifying devices |
US10558204B2 (en) * | 2016-09-19 | 2020-02-11 | Palo Alto Research Center Incorporated | System and method for scalable real-time micro-object position control with the aid of a digital computer |
CN108675023B (zh) * | 2018-05-02 | 2019-12-27 | 孝感量子机电科技有限公司 | 书写纸传送装置及书写装置 |
KR20220010710A (ko) | 2019-02-14 | 2022-01-26 | 퍼시몬 테크놀로지스 코포레이션 | 기계적으로 안내되는 자재 취급 로봇 |
US11893327B2 (en) | 2020-12-14 | 2024-02-06 | Xerox Corporation | System and method for machine-learning enabled micro-assembly control with the aid of a digital computer |
US11921488B2 (en) | 2020-12-15 | 2024-03-05 | Xerox Corporation | System and method for machine-learning-enabled micro-object density distribution control with the aid of a digital computer |
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JP2020099182A (ja) * | 2018-12-17 | 2020-06-25 | パロ アルト リサーチ センター インコーポレイテッド | 精細な角度制御を備えたマイクロアセンブラ |
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JP6313169B2 (ja) | 2018-04-18 |
EP2851336B1 (en) | 2016-11-30 |
EP2851336A2 (en) | 2015-03-25 |
US20150076961A1 (en) | 2015-03-19 |
EP2851336A3 (en) | 2015-04-22 |
US9473047B2 (en) | 2016-10-18 |
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