JP2015050468A5 - - Google Patents

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Publication number
JP2015050468A5
JP2015050468A5 JP2014180001A JP2014180001A JP2015050468A5 JP 2015050468 A5 JP2015050468 A5 JP 2015050468A5 JP 2014180001 A JP2014180001 A JP 2014180001A JP 2014180001 A JP2014180001 A JP 2014180001A JP 2015050468 A5 JP2015050468 A5 JP 2015050468A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
portions
step portion
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014180001A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015050468A (ja
JP6442199B2 (ja
Filing date
Publication date
Priority claimed from KR1020130105865A external-priority patent/KR102076243B1/ko
Application filed filed Critical
Publication of JP2015050468A publication Critical patent/JP2015050468A/ja
Publication of JP2015050468A5 publication Critical patent/JP2015050468A5/ja
Application granted granted Critical
Publication of JP6442199B2 publication Critical patent/JP6442199B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014180001A 2013-09-04 2014-09-04 発光素子パッケージ Expired - Fee Related JP6442199B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2013-0105865 2013-09-04
KR1020130105865A KR102076243B1 (ko) 2013-09-04 2013-09-04 발광 소자 패키지

Publications (3)

Publication Number Publication Date
JP2015050468A JP2015050468A (ja) 2015-03-16
JP2015050468A5 true JP2015050468A5 (enExample) 2017-09-28
JP6442199B2 JP6442199B2 (ja) 2018-12-19

Family

ID=51429137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014180001A Expired - Fee Related JP6442199B2 (ja) 2013-09-04 2014-09-04 発光素子パッケージ

Country Status (5)

Country Link
US (1) US9929329B2 (enExample)
EP (1) EP2846368B1 (enExample)
JP (1) JP6442199B2 (enExample)
KR (1) KR102076243B1 (enExample)
CN (1) CN104425690B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9437793B2 (en) * 2014-02-21 2016-09-06 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package support, fabrication method and LED package
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
JP6118437B1 (ja) * 2015-12-21 2017-04-19 ルーメンス カンパニー リミテッド Ｌｅｄモジュール
JP1566953S (enExample) * 2016-04-28 2017-01-16
CN108533981A (zh) * 2017-03-02 2018-09-14 展晶科技(深圳)有限公司 发光元件
US10020426B1 (en) 2017-04-10 2018-07-10 Advanced Optoelectronic Technology, Inc Light emitting device
JP7257247B2 (ja) * 2019-05-16 2023-04-13 スタンレー電気株式会社 発光装置
JP7300089B2 (ja) * 2019-10-08 2023-06-29 日本電気硝子株式会社 保護キャップ、発光装置および保護キャップの製造方法
US11119862B2 (en) 2019-10-11 2021-09-14 Seagate Technology Llc Delta information volumes to enable chained replication of data by uploading snapshots of data to cloud
CN113302757B (zh) * 2021-03-03 2023-12-05 泉州三安半导体科技有限公司 Led封装器件及其制备方法
JP2025152239A (ja) 2024-03-28 2025-10-09 日亜化学工業株式会社 発光装置、および面状光源

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2632462A1 (de) * 1976-07-19 1978-01-26 Siemens Ag Leuchtdiode
JP3789747B2 (ja) * 2000-11-15 2006-06-28 三洋電機株式会社 発光装置の製造方法
JP4100155B2 (ja) * 2002-12-05 2008-06-11 オムロン株式会社 発光光源、発光光源アレイ及び当該発光光源を用いた機器
JP2005277139A (ja) * 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd 半導体発光装置
JP2006012918A (ja) * 2004-06-22 2006-01-12 Harison Toshiba Lighting Corp 発光装置
TWI277223B (en) * 2004-11-03 2007-03-21 Chen-Lun Hsingchen A low thermal resistance LED package
JP2007042749A (ja) * 2005-08-01 2007-02-15 Matsushita Electric Ind Co Ltd 発光装置とこれを用いた表示装置及び照明装置、並びに発光装置の製造方法
KR20070033801A (ko) 2005-09-22 2007-03-27 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
JP4965858B2 (ja) * 2005-12-26 2012-07-04 株式会社東芝 レンズ付発光ダイオード装置
KR100819883B1 (ko) 2006-02-17 2008-04-07 삼성전자주식회사 발광소자 패키지 및 그 제조방법
KR100820529B1 (ko) * 2006-05-11 2008-04-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법, 면 발광 장치
EP2087563B1 (en) * 2006-11-15 2014-09-24 The Regents of The University of California Textured phosphor conversion layer light emitting diode
DE102009018088A1 (de) * 2008-04-30 2009-12-24 Ledon Lighting Jennersdorf Gmbh Modul zur Homogenisierung von Licht, das von einer Festkörper-Lichtquelle (z.B. einer LED) emittiert wird
JP2010171379A (ja) * 2008-12-25 2010-08-05 Seiko Instruments Inc 発光デバイス
JP2010182809A (ja) * 2009-02-04 2010-08-19 Stanley Electric Co Ltd 半導体発光装置
JP2011009143A (ja) 2009-06-29 2011-01-13 Sony Corp 照明装置およびバックライト
EP2450613B1 (en) * 2010-11-08 2015-01-28 LG Innotek Co., Ltd. Lighting device
JP5814947B2 (ja) * 2011-01-20 2015-11-17 シャープ株式会社 発光装置、照明装置、表示装置及び発光装置の製造方法
KR20120084526A (ko) 2011-01-20 2012-07-30 삼성엘이디 주식회사 발광소자 패키지
US8513693B2 (en) * 2011-08-08 2013-08-20 Intellectual Discovery Co., Ltd. Miniature leadless surface mount lamp with dome and reflector cup

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