KR102076243B1 - 발광 소자 패키지 - Google Patents

발광 소자 패키지 Download PDF

Info

Publication number
KR102076243B1
KR102076243B1 KR1020130105865A KR20130105865A KR102076243B1 KR 102076243 B1 KR102076243 B1 KR 102076243B1 KR 1020130105865 A KR1020130105865 A KR 1020130105865A KR 20130105865 A KR20130105865 A KR 20130105865A KR 102076243 B1 KR102076243 B1 KR 102076243B1
Authority
KR
South Korea
Prior art keywords
light emitting
emitting device
lead frame
device package
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020130105865A
Other languages
English (en)
Korean (ko)
Other versions
KR20150027480A (ko
Inventor
이흥주
민봉걸
김원중
임창만
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020130105865A priority Critical patent/KR102076243B1/ko
Priority to EP14183043.0A priority patent/EP2846368B1/en
Priority to US14/476,404 priority patent/US9929329B2/en
Priority to CN201410448543.XA priority patent/CN104425690B/zh
Priority to JP2014180001A priority patent/JP6442199B2/ja
Publication of KR20150027480A publication Critical patent/KR20150027480A/ko
Application granted granted Critical
Publication of KR102076243B1 publication Critical patent/KR102076243B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Planar Illumination Modules (AREA)
KR1020130105865A 2013-09-04 2013-09-04 발광 소자 패키지 Expired - Fee Related KR102076243B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020130105865A KR102076243B1 (ko) 2013-09-04 2013-09-04 발광 소자 패키지
EP14183043.0A EP2846368B1 (en) 2013-09-04 2014-09-01 Light emitting device package
US14/476,404 US9929329B2 (en) 2013-09-04 2014-09-03 Light emitting device package
CN201410448543.XA CN104425690B (zh) 2013-09-04 2014-09-04 发光器件封装
JP2014180001A JP6442199B2 (ja) 2013-09-04 2014-09-04 発光素子パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020130105865A KR102076243B1 (ko) 2013-09-04 2013-09-04 발광 소자 패키지

Publications (2)

Publication Number Publication Date
KR20150027480A KR20150027480A (ko) 2015-03-12
KR102076243B1 true KR102076243B1 (ko) 2020-02-12

Family

ID=51429137

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020130105865A Expired - Fee Related KR102076243B1 (ko) 2013-09-04 2013-09-04 발광 소자 패키지

Country Status (5)

Country Link
US (1) US9929329B2 (enExample)
EP (1) EP2846368B1 (enExample)
JP (1) JP6442199B2 (enExample)
KR (1) KR102076243B1 (enExample)
CN (1) CN104425690B (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9437793B2 (en) * 2014-02-21 2016-09-06 Xiamen Sanan Optoelectronics Technology Co., Ltd. Package support, fabrication method and LED package
USD778848S1 (en) * 2015-04-07 2017-02-14 Cree, Inc. Solid state light emitter component
JP6118437B1 (ja) * 2015-12-21 2017-04-19 ルーメンス カンパニー リミテッド Ｌｅｄモジュール
JP1566953S (enExample) * 2016-04-28 2017-01-16
CN108533981A (zh) * 2017-03-02 2018-09-14 展晶科技(深圳)有限公司 发光元件
US10020426B1 (en) 2017-04-10 2018-07-10 Advanced Optoelectronic Technology, Inc Light emitting device
JP7257247B2 (ja) * 2019-05-16 2023-04-13 スタンレー電気株式会社 発光装置
JP7300089B2 (ja) * 2019-10-08 2023-06-29 日本電気硝子株式会社 保護キャップ、発光装置および保護キャップの製造方法
US11119862B2 (en) 2019-10-11 2021-09-14 Seagate Technology Llc Delta information volumes to enable chained replication of data by uploading snapshots of data to cloud
CN113302757B (zh) * 2021-03-03 2023-12-05 泉州三安半导体科技有限公司 Led封装器件及其制备方法
JP2025152239A (ja) 2024-03-28 2025-10-09 日亜化学工業株式会社 発光装置、および面状光源

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186092A (ja) 2002-12-05 2004-07-02 Omron Corp 発光光源、発光光源アレイ及び当該発光光源を用いた機器
JP2005277139A (ja) 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd 半導体発光装置
US20130037837A1 (en) 2011-08-08 2013-02-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniature leadless surface mount lamp with dome and reflector cup

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2632462A1 (de) * 1976-07-19 1978-01-26 Siemens Ag Leuchtdiode
JP3789747B2 (ja) * 2000-11-15 2006-06-28 三洋電機株式会社 発光装置の製造方法
JP2006012918A (ja) * 2004-06-22 2006-01-12 Harison Toshiba Lighting Corp 発光装置
TWI277223B (en) * 2004-11-03 2007-03-21 Chen-Lun Hsingchen A low thermal resistance LED package
JP2007042749A (ja) * 2005-08-01 2007-02-15 Matsushita Electric Ind Co Ltd 発光装置とこれを用いた表示装置及び照明装置、並びに発光装置の製造方法
KR20070033801A (ko) 2005-09-22 2007-03-27 삼성전기주식회사 발광 다이오드 패키지 및 그 제조 방법
JP4965858B2 (ja) * 2005-12-26 2012-07-04 株式会社東芝 レンズ付発光ダイオード装置
KR100819883B1 (ko) 2006-02-17 2008-04-07 삼성전자주식회사 발광소자 패키지 및 그 제조방법
KR100820529B1 (ko) * 2006-05-11 2008-04-08 엘지이노텍 주식회사 발광 장치 및 그 제조방법, 면 발광 장치
EP2843716A3 (en) * 2006-11-15 2015-04-29 The Regents of The University of California Textured phosphor conversion layer light emitting diode
DE102009018088A1 (de) * 2008-04-30 2009-12-24 Ledon Lighting Jennersdorf Gmbh Modul zur Homogenisierung von Licht, das von einer Festkörper-Lichtquelle (z.B. einer LED) emittiert wird
JP2010171379A (ja) * 2008-12-25 2010-08-05 Seiko Instruments Inc 発光デバイス
JP2010182809A (ja) * 2009-02-04 2010-08-19 Stanley Electric Co Ltd 半導体発光装置
JP2011009143A (ja) 2009-06-29 2011-01-13 Sony Corp 照明装置およびバックライト
EP2450613B1 (en) * 2010-11-08 2015-01-28 LG Innotek Co., Ltd. Lighting device
KR20120084526A (ko) 2011-01-20 2012-07-30 삼성엘이디 주식회사 발광소자 패키지
JP5814947B2 (ja) * 2011-01-20 2015-11-17 シャープ株式会社 発光装置、照明装置、表示装置及び発光装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186092A (ja) 2002-12-05 2004-07-02 Omron Corp 発光光源、発光光源アレイ及び当該発光光源を用いた機器
JP2005277139A (ja) 2004-03-25 2005-10-06 Matsushita Electric Ind Co Ltd 半導体発光装置
US20130037837A1 (en) 2011-08-08 2013-02-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniature leadless surface mount lamp with dome and reflector cup

Also Published As

Publication number Publication date
KR20150027480A (ko) 2015-03-12
JP2015050468A (ja) 2015-03-16
US20150060897A1 (en) 2015-03-05
US9929329B2 (en) 2018-03-27
EP2846368A1 (en) 2015-03-11
JP6442199B2 (ja) 2018-12-19
CN104425690A (zh) 2015-03-18
EP2846368B1 (en) 2019-04-24
CN104425690B (zh) 2019-03-15

Similar Documents

Publication Publication Date Title
KR102076243B1 (ko) 발광 소자 패키지
KR101064036B1 (ko) 발광 소자 패키지 및 조명 시스템
KR101659357B1 (ko) 발광소자패키지
CN102130109B (zh) 发光器件和使用发光器件的灯单元
US20080231772A1 (en) Flat panel display and fabrication method thereof
KR101830717B1 (ko) 발광 소자 패키지
EP2355194A2 (en) Light emitting device package
CN102418865A (zh) 光源模块、面发光组件以及面发光装置
KR101655463B1 (ko) 발광소자 패키지 및 이를 구비한 라이트 유닛
KR102107526B1 (ko) 발광 소자 패키지
KR20150109591A (ko) 발광 소자 패키지
CN102034916A (zh) 半导体发光装置、半导体发光模块及照明装置
KR20120045539A (ko) 발광소자 패키지
KR102160775B1 (ko) 발광 소자 패키지
KR20140061574A (ko) Led 조명모듈, 및 이를 포함하는 백라이트 장치 및 이의 제조방법
KR101998762B1 (ko) 발광 소자 패키지
KR102101367B1 (ko) 발광 소자
KR20140089765A (ko) 발광 소자 패키지
KR20190076935A (ko) 발광 소자 패키지
KR20130007276A (ko) 발광 소자 패키지
KR20120124186A (ko) 발광소자 패키지 및 이를 포함하는 조명 시스템
KR101797596B1 (ko) 발광소자 패키지 및 이를 포함하는 조명 시스템
KR101877410B1 (ko) 발광소자 패키지
KR102402259B1 (ko) 발광 소자 패키지
KR101735310B1 (ko) 발광소자 패키지

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20250206

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20250206