JP2015043420A5 - - Google Patents
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- Publication number
- JP2015043420A5 JP2015043420A5 JP2014159292A JP2014159292A JP2015043420A5 JP 2015043420 A5 JP2015043420 A5 JP 2015043420A5 JP 2014159292 A JP2014159292 A JP 2014159292A JP 2014159292 A JP2014159292 A JP 2014159292A JP 2015043420 A5 JP2015043420 A5 JP 2015043420A5
- Authority
- JP
- Japan
- Prior art keywords
- sealing plate
- movable sealing
- plasma processing
- application example
- valve assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/965,796 US20150047785A1 (en) | 2013-08-13 | 2013-08-13 | Plasma Processing Devices Having Multi-Port Valve Assemblies |
| US13/965,796 | 2013-08-13 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015043420A JP2015043420A (ja) | 2015-03-05 |
| JP2015043420A5 true JP2015043420A5 (enExample) | 2015-04-23 |
| JP6508895B2 JP6508895B2 (ja) | 2019-05-08 |
Family
ID=52465964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014159292A Active JP6508895B2 (ja) | 2013-08-13 | 2014-08-05 | マルチポート弁アセンブリを備えるプラズマ処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20150047785A1 (enExample) |
| JP (1) | JP6508895B2 (enExample) |
| KR (1) | KR20150020120A (enExample) |
| TW (1) | TWI659444B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10049862B2 (en) * | 2015-04-17 | 2018-08-14 | Lam Research Corporation | Chamber with vertical support stem for symmetric conductance and RF delivery |
| US12106946B2 (en) * | 2019-03-15 | 2024-10-01 | Lam Research Corporation | Turbomolecular pump and cathode assembly for etching reactor |
| US11199267B2 (en) * | 2019-08-16 | 2021-12-14 | Applied Materials, Inc. | Symmetric flow valve for higher flow conductance |
| JP2021039880A (ja) | 2019-09-03 | 2021-03-11 | 株式会社日立ハイテク | 荷電粒子線装置 |
| US20230162950A1 (en) * | 2021-11-22 | 2023-05-25 | Applied Materials, Inc. | Plasma chamber with a multiphase rotating gas cross-flow and peripheral conductance control rings |
Family Cites Families (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57198261A (en) * | 1981-05-29 | 1982-12-04 | Fuji Xerox Co Ltd | Vapor depositing device |
| US4516606A (en) * | 1983-02-16 | 1985-05-14 | Exxon Research And Engineering Co. | Variable orifice valve assembly |
| JPH0751756B2 (ja) * | 1985-11-09 | 1995-06-05 | 日電アネルバ株式会社 | 集塵装置付薄膜処理装置 |
| US5000225A (en) * | 1989-11-17 | 1991-03-19 | Applied Materials, Inc. | Low profile, combination throttle/gate valve for a multi-pump chamber |
| JPH043927A (ja) * | 1990-04-20 | 1992-01-08 | Mitsubishi Electric Corp | 半導体処理装置 |
| JPH07106307A (ja) * | 1993-10-07 | 1995-04-21 | Mitsubishi Electric Corp | プラズマ処理装置およびプラズマ処理方法 |
| JP2978974B2 (ja) * | 1996-02-01 | 1999-11-15 | キヤノン販売株式会社 | プラズマ処理装置 |
| JPH10321604A (ja) * | 1997-05-22 | 1998-12-04 | Nec Kyushu Ltd | プラズマ処理装置 |
| JPH1154496A (ja) * | 1997-08-07 | 1999-02-26 | Tokyo Electron Ltd | 熱処理装置及びガス処理装置 |
| US5997589A (en) * | 1998-07-09 | 1999-12-07 | Winbond Electronics Corp. | Adjustment pumping plate design for the chamber of semiconductor equipment |
| JP3579278B2 (ja) * | 1999-01-26 | 2004-10-20 | 東京エレクトロン株式会社 | 縦型熱処理装置及びシール装置 |
| JP4330703B2 (ja) * | 1999-06-18 | 2009-09-16 | 東京エレクトロン株式会社 | 搬送モジュール及びクラスターシステム |
| US6261408B1 (en) * | 2000-02-16 | 2001-07-17 | Applied Materials, Inc. | Method and apparatus for semiconductor processing chamber pressure control |
| IT1314504B1 (it) * | 2000-03-02 | 2002-12-18 | Cozzani Mario S R L | Valvola per il controllo di flussi di grande sezione, in particolareper compressori o simili. |
| US6531069B1 (en) * | 2000-06-22 | 2003-03-11 | International Business Machines Corporation | Reactive Ion Etching chamber design for flip chip interconnections |
| US20060162656A1 (en) * | 2002-07-31 | 2006-07-27 | Tokyo Electron Limited | Reduced volume, high conductance process chamber |
| TWI261313B (en) * | 2005-07-29 | 2006-09-01 | Ind Tech Res Inst | A method for a large dimension plasma enhanced atomic layer deposition cavity and an apparatus thereof |
| JP4847136B2 (ja) * | 2006-01-17 | 2011-12-28 | 株式会社アルバック | 真空処理装置 |
| WO2008038940A1 (en) * | 2006-09-27 | 2008-04-03 | Ats Engineering Co., Ltd. | Gate valve |
| US8043430B2 (en) * | 2006-12-20 | 2011-10-25 | Lam Research Corporation | Methods and apparatuses for controlling gas flow conductance in a capacitively-coupled plasma processing chamber |
| KR20110022036A (ko) * | 2008-06-02 | 2011-03-04 | 맷슨 테크놀로지, 인크. | 기판 처리방법 |
| JP5102706B2 (ja) * | 2008-06-23 | 2012-12-19 | 東京エレクトロン株式会社 | バッフル板及び基板処理装置 |
| US20100075488A1 (en) * | 2008-09-19 | 2010-03-25 | Applied Materials, Inc. | Cvd reactor with multiple processing levels and dual-axis motorized lift mechanism |
| JP2010186891A (ja) * | 2009-02-12 | 2010-08-26 | Tokyo Electron Ltd | プラズマ処理装置、プラズマ処理装置のメンテナンス方法及びプラズマ処理装置の組み立て方法 |
| EP2659507B1 (en) * | 2010-12-29 | 2022-09-14 | Evatec AG | Vacuum treatment apparatus |
-
2013
- 2013-08-13 US US13/965,796 patent/US20150047785A1/en not_active Abandoned
-
2014
- 2014-08-05 JP JP2014159292A patent/JP6508895B2/ja active Active
- 2014-08-12 TW TW103127657A patent/TWI659444B/zh active
- 2014-08-13 KR KR20140105086A patent/KR20150020120A/ko not_active Ceased
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