JP2015037165A - Wiring board and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board and a manufacturing method of the same, which has less incidence of migration between conductor layers adjacent to each other on a surface of a substrate body composed of a single insulation layer even when a plurality of conductor layers are formed on the surface of the substrate body with high density are formed and through conductors which pierce the conductor layers and the insulation layer to connect the conductor layers and the insulation layer, and which can successfully connect the conductor layers and the through conductors.SOLUTION: A wiring board 1a comprises: a substrate body 2 which is composed of a single insulation layer r and has a pair of surfaces 3 and 4; conductor layers 10 formed on at least one surface 3 of the insulation layer r which composes the substrate body 2; and through conductors 6 which pierce the insulation layer r having the conductor layers 10 on the surface 3 and continuously pierce the conductor layers 10. The wiring board 1a further comprises a flange part 8 which is formed on a top face of each conductor layer 10 and prevails from an end 7 side of the through conductor 6 along a radial direction of the through conductor 6, in which conductivity of the flange part 8 at least on an outer edge 9 side is lower than conductivity of the through conductor 6.

Description

  The present invention, for example, has a plurality of conductor layers close to each other on the surface of a substrate body composed of one or a plurality of insulating layers, and the end portions of the through conductors that penetrate the insulating layers penetrate through the conductor layers. It is related with the wiring board connected in this way, and its manufacturing method.

  For example, in order to enable via-on-via and chip-on-via and high-density mounting, a copper-clad resin film with a copper foil and adhesive layer provided separately on each side of the resin film is prepared. Then, the copper foil is formed in lands (conductor layers) of a predetermined pattern, and the conductive paste is filled in the through holes penetrating the resin film including the lands by screen printing, and a part of the conductive paste Has been disclosed as a method of manufacturing a multilayer wiring substrate that forms a brim that extends to a radial intermediate position on the upper surface of the land (see, for example, Patent Document 1).

However, in the multilayer wiring substrate manufactured by the method as described above, the metal atoms contained in the conductive paste constituting the collar portion are easily ionized and moved from the outer edge side of the collar portion located on the land. Become. Therefore, on the surface of the resin film, the ionized metal atoms ooze out so as to approach another land formed at a relatively high density and another brim portion located on the upper surface thereof. So-called migration may occur. As a result, there is a problem that the conductive pastes formed in the through holes including the lands adjacent to each other on the surface of the resin film may short-circuit each other.
Furthermore, in order to prevent the short circuit, it is possible to connect the rod-shaped conductive paste filled in the through-hole and the land only between the inner and outer peripheral surfaces without providing the collar portion. . However, in the case of such a connection structure, there is a problem that the contact area between the conductive paste and the land becomes small and the adhesive strength between the two becomes insufficient, leading to poor electrical connection.

JP 2002-353621 A (pages 1 to 17, FIGS. 4 to 6)

  The present invention solves the problems described in the background art, and forms a plurality of conductor layers at a high density on the surface or inside of a substrate body composed of an arbitrary number of insulating layers, and the conductor layers and the insulating layers are formed. Even if a continuous through-penetrating conductor is formed, migration between adjacent conductive layers on the surface or the like is unlikely to occur, and the wiring board and the through-conductor can be reliably connected, and a method for manufacturing the same It is an issue to provide.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problem, the present invention provides an upper surface of the conductor layer from the peripheral side of the through conductor that continuously penetrates the insulating layer constituting the substrate body and the conductor layer formed on the surface of the substrate body. It is conceived that a flange portion that extends along the surface is provided, and at least the outer edge side of the flange portion has a resin-containing composition.
That is, the wiring board according to the present invention (Claim 1) is composed of a single insulating layer or a plurality of insulating layers, and has a substrate body having a pair of surfaces, and at least one of the substrate bodies. A wiring board comprising: a conductor layer formed on at least one surface of an insulating layer; and a penetrating conductor that penetrates the insulating layer having the conductor layer on the surface and continuously penetrates the conductor layer. Further, a flange portion is formed on the upper surface of the conductor layer so as to extend from the end portion side of the through conductor along the radial direction of the through conductor, and the conductivity on at least the outer edge side of the flange portion is as described above. It is characterized by being lower than the conductivity of the through conductor.

According to this, since the conductivity at least on the outer edge side of the flange portion is lower than the conductivity of the through conductor, the flange portion is formed adjacent to the conductor layer formed on the upper surface and the conductor layer. It is possible to eliminate or suppress the migration caused by the movement of the metal atoms described above between another conductor layer and the flange portion positioned on the upper surface of the other conductor layer. As a result, even if a plurality of conductor layers are formed at a high density between the surface of the substrate main body and the same internal layer, it is possible to reliably prevent or suppress an inadvertent short circuit between them.
In addition, since the flange portion is integral with the through conductor, the contact area between the through layer and the conductor layer through which the through conductor penetrates is relatively large, so that the adhesion strength between the conductor layer and the through conductor is increased. In addition, electrical connection can be easily ensured.
Therefore, for example, a wiring board that can mount electronic components on the surface of the substrate body at high density, or a wiring board for inspection for accurately inspecting a large number of electronic components formed on the same surface of a Si wafer. A suitable wiring board can be provided.

The insulating layer constituting the substrate body is made of resin (for example, polyimide) or ceramic (for example, alumina, glass-ceramic).
Further, the pair of front surfaces in the substrate body are relative names, for example, refer to the front and back surfaces facing each other in one insulating layer.
Further, the conductor layer is made of, for example, Cu, and is bonded to an electrode of an electronic component (for example, an IC chip) to be mounted on the surface of the substrate body by brazing or a probe that is in contact with the electrode of the electronic component is bonded. Or a back surface (front surface) terminal to which a conductor pin for electrically connecting to an electrode of a mother board (for example, a printed circuit board) on which the board body is mounted is brazed, The back terminal etc. which are attached are illustrated.
Moreover, the said flange part exhibits the substantially circular shape centering on the said through-conductor or non-circular arbitrary shapes (deformation polygon etc.) in planar view.
Furthermore, the thickness of the flange portion is about several μm to 10 μm.
In addition, the conductivity of at least the outer edge side of the flange portion and the conductivity of the through conductor are at least 10 mS / cm lower than the latter in the former. Alternatively, the difference in electrical conductivity between at least the former and the latter is at least 10 mS / cm.

In the present invention, at least the outer edge side of the flange portion contains a resin, and the water absorption rate of the resin constituting the outer edge side of the flange portion is smaller than the water absorption rate of the insulating layer. A substrate (claim 2) is also included.
According to this, in addition to the low conductivity, the water absorption rate of the resin contained at least on the outer edge side of the flange portion is smaller than the water absorption rate of the insulating layer. It is possible to prevent or suppress migration. Therefore, a short circuit between adjacent conductor layers can be more reliably suppressed.
When the water absorption rate of the resin constituting the outer edge side of the flange portion is compared with the water absorption rate of the insulating layer, at least the former is about 5 to 50% of the latter. As a combination that matches this, there is a combination in which the insulating layer is made of polyimide and the resin included on the outer edge side of the flange portion is made of an epoxy resin.

Furthermore, the present invention includes a wiring board (Claim 3) in which the conductor layer having the flange portion formed on the upper surface is a surface conductor layer formed on at least one surface of the substrate body.
According to this, since the conductor layer is a surface conductor layer or a back conductor layer (surface conductor layer) formed on one or both surfaces of the substrate body, for example, high density electronic components are formed on the surface of the substrate body. It is possible to provide a wiring board that can be mounted on the board, or a wiring board that can provide accurate electrical continuity with a large number of electrodes formed on the surface of a mother board such as a printed board to be mounted.

The present invention also includes a wiring board (Claim 4) in which the end portion of the through conductor protrudes upward from the upper surface of the flange portion.
According to this, the end of the through conductor and the electrode of the electronic component to be mounted on the surface of the substrate body are in direct contact with each other, or through a thin film of brazing material sandwiched between the two. Thus, the electronic component can be mounted by brazing. As a result, with a relatively small amount of brazing material, it is possible to reliably and easily establish electrical continuity between the electrode of the electronic component and the end portion of the through conductor.
The end portion of the through conductor protrudes upward by at least several tens of μm from the upper surface of the conductor layer.

In addition, the present invention includes a wiring board (Claim 5) in which the flange portion covers only the peripheral side of the through conductor on the upper surface of the conductor layer.
According to this, the flange portion covers only the peripheral side of the through conductor on the upper surface of the conductor layer, and does not cover the peripheral side including the peripheral side on the upper surface of the conductor layer. As a result, in addition to the end portion of the through conductor, it is further brazed between the peripheral side of the upper surface of the conductor layer and the electrode of the electronic component to be mounted, thereby further ensuring electrical conduction. Can be secured.

  On the other hand, a method of manufacturing a wiring board according to the present invention (Claim 6) comprises a substrate body comprising a single insulating layer or a plurality of insulating layers, and having a pair of surfaces. A conductor layer formed on at least one surface of at least one insulating layer; and a through conductor penetrating the insulating layer having the conductor layer on the surface and continuously penetrating the conductor layer. A method for manufacturing a wiring board, comprising: preparing a conductive insulating layer in which a conductive layer is formed on at least one surface of the insulating layer; and forming a through hole that continuously penetrates the insulating layer and the conductive layer Filling a conductive paste containing a resin into the through hole and the through hole in a state where a mask having a through hole surrounding the opening of the through hole is placed on the upper surface of the conductor layer; mask And removing the resin contained in the conductive paste filled in the through hole and the through hole from the periphery of the through hole along the upper surface of the conductor layer to the outer peripheral side of the through hole. The method includes a step of forming a flange portion including a resin, and a step of curing the conductive paste and the flange portion.

  According to this, with the mask having a through hole surrounding the opening of the through hole being placed on the upper surface of the conductor layer, the mask is removed after the through hole and the through hole are filled with the conductive paste. At substantially the same time, the liquid resin flows out from the periphery of the conductive paste having a thickness corresponding to the mask thickness so as to expand in the radial direction of the through hole along the upper surface of the conductor layer, thereby forming a flange portion. Then, by curing the flange portion together with the conductive paste, the wiring board including the through conductor having the flange and the conductor layer through which the through conductor penetrates is reliably manufactured. It becomes possible to do.

The through hole is formed by laser processing or punching, and the maximum opening diameter in the case of laser processing is, for example, about 40 to 50 μm.
The conductive paste is made of, for example, Ag particles (about 90 wt%, average particle size of several μm (less than 5 μm)), epoxy resin (about 10 wt%), and a solvent.
Furthermore, the insulating layer and the conductor layer are formed by, for example, using an insulating layer with a conductor in which a copper foil is bonded in advance on one side of a sheet made of polyimide resin, and applying a photolithography technique to the Cu foil. The said conductor layer which exhibits a required pattern visually is shape | molded.
In addition, the flange portion is mainly composed of a liquid epoxy resin and a solvent, and immediately after the mask is removed, a through hole is formed on the upper surface of the conductor layer from a position adjacent to the through hole of the mask. Is a resin-based composition that has flowed out substantially along the radial direction, and is substantially circular or non-circular (for example, petals) in a plan view by being cured (a so-called curing process that is heated to about 100 to 200 ° C.). Shape, amoeba, etc.) and cured.

Further, in the present invention, the inner diameter of the through hole opened in the mask is the same as or larger than the inner diameter of the through hole opened on the upper surface of the conductor layer. (Claim 7) is also included.
According to this, when the inner diameter of the through hole opened in the mask is the same as the inner diameter of the through hole opened on the upper surface of the conductor layer, the through conductor has an end portion having an outer diameter substantially the same as the diameter. Can be formed. On the other hand, when the inner diameter of the through hole is larger than the inner diameter of the upper through hole, an end portion having a diameter larger than the diameter can be formed on the through conductor. As a result, for example, an electrical component that is electrically connected to an electrode of an electronic component that mainly mounts the end portion of the through conductor, or is mounted by both the end portion of the through conductor and the peripheral side on the upper surface of the conductor layer. It is possible to easily design and establish the conduction with the electrodes.

Furthermore, the present invention includes a method for manufacturing a wiring board (Claim 8) in which the flange portion covers only the peripheral side of the through conductor on the upper surface of the conductor layer.
According to this, since the peripheral side including the peripheral side on the upper surface of the conductor layer is not covered with the flange portion, the conductive layer can be electrically connected to the new parts to be mounted including the peripheral side of the conductor layer. It is possible to easily cope with the case of taking electrical conductivity with another through conductor formed in an insulating layer adjacent in the thickness direction.

The vertical sectional view showing the important section of the wiring board of one form by the present invention. The top view of the principal part of the wiring board shown in FIG. The vertical sectional view showing the important section of the wiring board which is an application form of the wiring board. The vertical sectional view which shows the principal part of the wiring board of a different form by this invention. The elements on larger scale of the dashed-dotted line part X in FIG. (A), (B) is the schematic which shows the manufacturing process for obtaining the wiring board of FIG. (A), (B) is the schematic which shows the manufacturing process following FIG. (A), (B) is the schematic which shows the manufacturing process following FIG. (A), (B) is the schematic which shows the manufacturing process following FIG. 8, and the obtained wiring board. (A), (B) is the schematic which shows the manufacturing process for obtaining the wiring board of FIG. (A), (B) is the schematic which shows the manufacturing process for obtaining the wiring board of another form. (A), (B) is the schematic which shows the manufacturing process following FIG. Schematic which shows one manufacturing process for obtaining the wiring board shown in FIG. Schematic which shows the manufacturing process following FIG. 13, and the principal part of the obtained wiring board.

Hereinafter, modes for carrying out the present invention will be described.
FIG. 1 is a vertical sectional view showing an essential part of a wiring board 1a according to an embodiment of the present invention, and FIG. 2 is a plan view of FIG.
As shown in FIGS. 1 and 2, the wiring board 1 a is composed of a single-layer insulating layer r made of polyimide, a substrate body 2 having a front surface 3 and a back surface (front surface) 4, and a surface 3 of the substrate body 2. A plurality of surface conductor layers (conductor layers) 10 formed at a relatively high density, and between the front surface 3 and the back surface 4 of the substrate body 2, and also continuously penetrate the surface conductor layer 10. And a through conductor 6 formed in the through hole 5. A flange portion 8 extending in the radial direction of the through conductor 6 along the upper surface of the surface conductor layer 10 is integrally connected to the upper end side of the through conductor 6. The flange portion 8 has a thickness of about several μm to 10 μm. Above the upper surface of the flange portion 8 (outside), an end portion 7 of the penetrating conductor 6 protruding at a height of about several tens of μm (for example, 20 to 30 μm) is provided upright.
The through-hole 5 has a cylindrical shape with a linear axial direction by punching by punching. For example, when the through-hole 5 is formed by laser processing in which laser is irradiated from the surface 3 side of the substrate body 2, 3 has a substantially conical shape with a taper that gradually decreases in diameter from the back surface 4 toward the back surface 4, and the through conductor 6 also has a similar shape to the shape.
Further, a back surface terminal 12 is formed on the back surface 4 of the substrate body 2 so as to be individually connected to the lower end portion of each through conductor 6.

As shown in FIGS. 1 and 2, the outer edge 9 of the flange portion 8 covers only the peripheral side of the through conductor 6 on the upper surface of the surface conductor layer 10, in other words, the periphery on the upper surface of the surface conductor layer 10. The peripheral side surrounding the side is not covered with the flange portion 8.
The through conductor 6 is mainly made of Ag, and the front conductor layer 10 and the back terminal 12 are made of Cu. On the other hand, the flange portion 8 is mainly made of an epoxy resin, and has a composition of a composite material in which the content of Ag powder increases in an inclined manner as it approaches the periphery of the through conductor 6.
Therefore, at least the conductivity on the outer edge 9 side of the flange portion 8 is about 10 mS / cm lower than the conductivity of the through conductor 6 (roughly about 30 to 50%). Further, the water absorption rate of the epoxy resin constituting the flange portion 8 is about 10% smaller than the water absorption rate of the polyimide forming the insulating layer r.

The water absorption rate of the resin contained on the outer edge 9 side of the flange portion 8 was measured by the following methods (1) and (2).
(1) The composition of the resin contained on the outer edge 9 side of the flange portion 8 is specified by either EDS (energy dispersive X-ray spectroscopy) analysis or FT-IR (Fourier transform infrared spectroscopy) analysis.
(2) Prepare a sample that is the same material as the resin specified in (1) and has a sufficient size for measuring the water absorption, and conforms to the standard of IPC-TM-650 2.6.2. Further, the water absorption is measured by the following procedures (a) to (c).
(a) The weight W1 of the sample at the time of drying is measured.
(b) The weight W2 of the sample after being immersed in water is measured.
(c) The water absorption rate (%) is calculated by the formula “(W1−W2) / W1 × 100”.
Moreover, the water absorption rate of the insulating layer r and an insulating layer r1 described later was also measured by the above method.

  As shown in the upper right in FIG. 1, on the peripheral side on the upper surface of the surface conductor layer 10, the upper surface of the flange portion 8, and the end portion 7 of the through conductor 6, for example, via a brazing material 13 made of Au brazing. When an electronic component 14 such as an IC chip is mounted, an electrode (not shown) located on the bottom surface of the electronic component 14 and the end portion 7 are in direct surface contact with each other, or a thin Ag wax film is formed. Get close together. On the other hand, the electrode and the peripheral side on the upper surface of the surface conductor layer 10 are joined via the brazing material 13. Since the end portion 7 protrudes upward, the amount of the brazing material 13 used can be reduced.

In the wiring board 1a as described above, the conductivity of at least the outer edge 9 side of the flange portion 8 is lower than the conductivity of the through conductor 6, and the water absorption rate of the epoxy resin contained in the flange portion 8 is It is smaller than the water absorption rate of the polyimide constituting the insulating layer r. Therefore, the surface conductor layer 10 having the flange portion 8 formed on the upper surface, another surface conductor layer 10 formed adjacent to the surface conductor layer 10, and another surface conductor layer 10 positioned on the upper surface of the other surface conductor layer 10. The migration caused by the movement of the metal atoms described above can be eliminated or suppressed. As a result, an inadvertent short circuit between adjacent surface conductor layers 10 or between adjacent through conductors 6 can be prevented.
In addition, since the flange portion 8 is integral with the through conductor 6 and the contact area with the surface conductor layer 10 through which the through conductor 6 penetrates is relatively large, the surface conductor layer 10 and the through conductor 6 Adhesion strength and electrical connection can be easily ensured. Therefore, the electronic components 14 can be mounted on the surface 3 of the board body 2 with high density.

FIG. 3 is a vertical sectional view showing a main part of a wiring board 1b which is an applied form of the wiring board 1a.
As shown in FIG. 3, the wiring board 1 b includes a substrate body 2 made of only the insulating layer r, and the same surface conductor layer 10 and back surface conductor layer that are individually formed on the front surface 3 and the back surface 4 of the substrate body 2. (Surface conductor layer, conductor layer) 11 and a through conductor 6 formed in a through hole 5 that continuously penetrates the insulating layer r, the surface conductor layer 10, and the back conductor layer 11. On the upper surface of the front surface conductor layer 10 and the lower surface (upper surface) of the back surface conductor layer 11, flange portions 8 extending in the radial direction from the through conductor 6 are formed substantially symmetrically. In addition, the end portion 7 of the through conductor 6 protrudes also on the back surface 4 side.
As shown in FIG. 3, the flange portion 8 includes an outer region 8 b on the outer edge 9 side and an inner region 8 a on the peripheral side of the through conductor 6. Among these, the outer region 8 b on the outer edge 9 side is mainly made of an epoxy resin, and therefore its conductivity is lower than the conductivity of the through conductor 6. On the other hand, the inner region 8a contains a relatively larger amount of Ag powder than the outer region 8b.

As shown in the lower right in FIG. 3, the backside conductor layer 11 formed on the backside 4 of the substrate body 2, the flange portion 8, and the lower side of the end portion 7 of the through conductor 6 are similar to the above and compared. The base flange 17 of the conductor pin 16 including the pin body 18 extending downward is joined via a small amount of brazing material 13.
According to the wiring board 1b as described above, the same effect as that of the wiring board 1a can be obtained, and the conductor pins 16 can be joined via a relatively small amount of the brazing material 13, so that the wiring board 1b can be mounted on the motherboard. It is also possible to easily and surely take the electrical connection.
The insulating layer r in the wiring boards 1a and 1b may be made of a ceramic mainly composed of alumina, for example. However, it is desirable that the water absorption rate of the resin contained in the flange portion is smaller than the water absorption rate of the ceramic.

FIG. 4 is a vertical cross-sectional view showing the main part of the wiring board 20 of a different form, and FIG. 5 is a partially enlarged view of a one-dot chain line part X in FIG.
As shown in FIG. 4, the wiring board 20 includes an upper resin insulating portion 2a in which the same insulating layers r1 and r2 made of polyimide are laminated, and ceramic insulating layers c1 to c3 mainly composed of alumina, for example. A substrate body 22 having a front surface 23 and a back surface (front surface) 24 is provided.
As shown in FIGS. 4 and 5, the resin insulating portion 2a on the upper layer side has a plurality of surface conductor layers 10 formed relatively close to the surface 23, and penetrates through the surface conductor layer 10 and the insulating layer r1. On the upper end side of the conductor 6, the same flange portion 8 extending along the radial direction of the through conductor 6 on the upper surface of the conductor layer 10, and the same end portion protruding upward from the upper surface of the flange portion 8. 7 are formed.

In addition, a plurality of interlayer conductor layers (conductor layers) 19 are formed between the insulating layers r1 and r2, and the plurality of through conductors 6 continuously passing through the conductor layer 19 and the insulating layer r2 are formed on the uppermost layer. It is formed so that the interval between the through conductors 6 penetrating the insulating layer r1 is larger along the horizontal direction in FIG. As shown in FIG. 5, the flange which extends along the radial direction of the through conductor 6 also on the upper surface of each of the plurality of interlayer conductor layers 19 located between the insulating layers r1 and r2 and includes the same regions 8a and 8b as described above. Part 8 is formed. The outer edge 9 of the flange portion 8 is located between the periphery of the through conductor 6 and the outer edge of the interlayer conductor layer 19 on the upper surface of the interlayer conductor layer 19. In other words, the flange portion 8 covers only the peripheral side of the through conductor 6 on the upper surface of the interlayer conductor layer 19.
Note that the upper end of the through conductor 6 that penetrates the insulating layer r2 does not have the end portion 7 protruding upward from the upper surface of the flange portion 8, and is connected almost directly to the lower end of the through conductor 6 that penetrates the insulating layer r1. ing. The absence of the end portion 7 is due to compression by contact between the upper and lower through conductors 6 in the laminating and crimping steps of the manufacturing method described later. Moreover, the code | symbol w in FIG. 5 shows an adhesive bond layer.

Further, as shown in FIG. 4, the ceramic insulating portion 2b on the lower layer side is formed on the surface of the uppermost insulating layer c1 and is connected to the lower ends of the through conductors 6 penetrating the insulating layer r2. A wiring layer 25, a plurality of back surface terminals 27 formed on the back surface 24 of the lowermost insulating layer c3, and a plurality of the insulating layers c1 to c3 that are individually connected and linearly penetrate therebetween. Via conductor 26. The wiring layer 25, the back terminal 27, and the via conductor 26 are made of W or Mo.
As shown in FIGS. 4 and 5, a plurality of probe pins 29 are disposed above the end portions 7 of the plurality of through conductors 6 positioned on the surface 23 of the substrate body 22 via the brazing material 13 similar to the above. The base flanges 28 are individually joined. The probe pins 29 are used for inspecting the electrical characteristics of a large number of electronic components formed on the surface of a Si wafer (not shown).
That is, the wiring board 20 is a wiring board for inspection of electronic components, and is for arranging a plurality of probe pins 29 at a high density on the surface 23 side of the board body 22.

In the wiring board 20 as described above, the conductivity of at least the outer edge 9 side of each flange portion 8 formed on the surface 23 of the substrate body 22 and between the insulating layers r1 and r2 is greater than the conductivity of the through conductor 6. And the water absorption of the epoxy resin contained in the flange portion 8 is smaller than the water absorption of the polyimide forming the insulating layers r1 and r2. Therefore, the surface conductor layer 10 or the interlayer conductor layer 19 having the flange portion 8 formed on the upper surface, and another surface conductor layer 10 or the interlayer conductor formed adjacent to the surface conductor layer 10 or the interlayer conductor layer 19. Migration is less likely to occur between the layer 19, another surface conductor layer 10, or each flange portion 8 located on the upper surface of another interlayer conductor layer 19 as described above. As a result, an inadvertent short circuit between the conductor layers 10 and 19 adjacent between the surface 3 and the insulating layers r1 and r2 and between the adjacent through conductors 6 can be reliably prevented.
Further, in the same manner as described above, the adhesion strength and electrical connection between the conductor layers 10 and 19 and the through conductor 6 can be easily ensured. Accordingly, the wiring board 20 can accurately measure the electrical characteristics of a large number of electronic components to be inspected.

Below, the manufacturing method for obtaining the said wiring board 1a is demonstrated.
As shown in FIG. 6A, an insulating layer Z1 with a conductor in which a conductor layer 10a made of copper foil was laminated on the surface 3 of an insulating layer r made of polyimide was prepared in advance.
Next, as indicated by an arrow in FIG. 6A, the laser L was irradiated from the conductor layer 10a side of the insulating layer with conductor Z1 at a predetermined position. For the laser L, a UV laser was used. As a result, as shown in FIG. 6B, a through hole 5 having an opening diameter of about 40 μm at the upper end and a slight taper on the inner surface is provided between the conductor layer 10a and the back surface 4 of the insulating layer r. Formed for each position.
Next, as shown in FIG. 7A, a screen mask (mask) 30 that surrounds the opening of the through hole 5 and has a through hole 32 having the same inner diameter as the opening and has a thickness of several tens of μm, The through hole 5 and the through hole 32 were placed on the conductor layer 10a of the insulating layer with conductor Z1 such that the through hole 5 and the through hole 32 were concentric. In this state, as shown in FIG. 7B, the through hole 32 and the through hole 5 were filled with a conductive paste 34 containing Ag powder and an epoxy resin. The conductive paste 34 includes a through portion 36 that fills the through hole 5 and an upper end portion 37 in the through hole 32.

The conductive paste 34 is made of, for example, Ag particles (about 90 wt%, average particle size of several μm (less than 5 μm)), epoxy resin (about 10 wt%), and some solvent.
Subsequently, as shown in FIG. 8A, the mask 30 was removed from above the conductor layer 10a. At substantially the same time as the removal, as shown by the arrow in FIG. 8B, the liquid epoxy resin contained in the conductive paste 34 passes the upper surface of the conductor layer 10a along the radial direction of the through hole 5. Then, it flowed from the peripheral edge of the through hole 5 toward the outer peripheral side. As a result, a flange portion 38 containing the resin as a main component and having a substantially circular shape in plan view was formed integrally with the upper end side of the conductive paste 34.
In addition, a conductive pattern similar to the above is formed in a predetermined pattern via a screen mask at each position where the lower end surface of the through conductor 6 is exposed on the back surface 4 of the insulating layer r, and a plurality of uncured states are formed. Back terminal 12 (not shown) was formed.

Furthermore, the resin binder in the paste 12 was cured by performing a so-called curing process (curing process) in which the conductive paste 34 including the flange portion 38 and the back surface terminal 12 were heated to about 100 to 200 ° C.
As a result, as shown in FIG. 9A, the penetrating portion 36 becomes a penetrating conductor 6 mainly made of Ag, and an end portion 7 which is the upper end of the penetrating portion projects upward from the upper surface of the flange portion 8 described below. A flange 8 having a thickness of about several μm to 10 μm, which is mainly composed of an epoxy resin that spreads and hardens along the radial direction of the through conductor 6 on the upper surface of the conductor layer 10a, is formed around the end 7. It was done.
In the flange portion 8, a slight amount of Ag powder remained in the inner region (8 a) on the peripheral side of the through conductor 6. A plurality of back terminals 12 (not shown) may be cured on the back surface 4 of the insulating layer r.
The copper foil forming the conductor layer 10a is coated with a photosensitive resin on its upper surface, irradiated with an ultraviolet pattern on the resin, contacted with a developing (corrosion) solution, and peeling of the resin. Patterning using a lithography technique was performed.

As a result, as shown in FIG. 9B, the conductor layer 10a has a circular shape in a plan view, and the through conductor 6 penetrates through the center of the conductor layer 10a, and the flange is formed around the through conductor 6 on the upper surface. The surface conductor layer 10 in which 8 is located was obtained.
Finally, the end portion 7 of the through conductor 6 exposed to the outside, the surface conductor layer 10 and the surface of the back terminal 12 were subjected to electrolytic plating to sequentially coat the Ni plating film and the Au plating film. As a result, the wiring board 1a shown in FIGS. 1 and 2 was obtained.
The through hole 5 may be formed by punching by punching, etching, or irradiation with a carbon dioxide laser or excimer laser.
The insulating layer with conductor Z1 may be an insulating layer with conductor Z2 in which conductor layers 10a and 10b made of copper foil are formed in advance on both the front and back surfaces 3 and 4 of the insulating layer r.

  According to the method for manufacturing the wiring board 1a as described above, the mask 30 having the through hole 32 surrounding the opening of the through hole 5 is placed on the upper surface of the conductor layer 10a and is passed through the through hole 5. After filling the hole 32 with the conductive paste 34, the mask 30 is removed, and at the same time, from the periphery of the conductive paste 34 having a thickness corresponding to the thickness of the mask 30 along the upper surface of the conductor layer 10 a. The liquid resin flowed out so that the flange portion 38 was formed so as to expand in the radial direction of the through hole 5. Further, the flange portion 38 is cured together with the conductive paste 34 to include the through conductor 6 having the flange 8 and the surface conductor layer 10 through which the through conductor 6 penetrates, and a short circuit due to the migration hardly occurs. The wiring board 1a could be reliably manufactured.

FIG. 10 is a schematic view illustrating a method for manufacturing the wiring board 1b.
As shown in FIG. 10 (A), a step of preparing an insulating layer Z2 with a conductor in which conductor layers 10a and 10b made of copper foil are previously formed on both the front and back surfaces 3 and 4 of the insulating layer r; A step of punching the insulating layer Z2 to form the through-hole 5, and a closing rod (not shown) is inserted from the opening on the conductor layer 10b side to the middle position of the through-hole 5 and the opening side of the conductor layer 10a In the state where the mask 30 is disposed, the step of filling the conductive paste 34 and the step of forming the through conductor 6a by curing the paste 34 were sequentially performed. Then, the insulating layer Z2 was turned upside down to obtain the state shown in FIG.
Next, as shown in FIG. 10B, the step of filling the conductive paste 34 from the opening on the conductor layer 10b side of the through hole 5 and the curing treatment of the conductive paste 34 and the like. Then, the process of forming the conductor 36 was sequentially performed. Further, the same plating process as described above was performed. As a result, the wiring board 1b shown in FIG. 3 was obtained.
Also by the method for manufacturing the wiring substrate 1b as described above, the same effects as those of the method for manufacturing the wiring substrate 1a could be achieved.

11 and 12 relate to a method of manufacturing a wiring board having a slightly different form.
As shown in FIG. 11A, a through hole 5 is formed by laser processing from the conductor layer 10a side of the insulating layer with conductor Z1 prepared in the same manner as described above, and then the opening of the through hole 5 is surrounded and penetrated. A screen mask 31 having a through hole 33 having an inner diameter larger than the inner diameter of the hole 5 on the conductor layer 10a side was placed on the upper surface of the conductor layer 10a so that the through hole 33 and the through hole 5 were concentric. .
In this state, as shown in FIG. 11B, the same conductive paste 34a as described above was filled in the through hole 5 and the through hole 33.
Next, as shown in FIG. 12A, the mask 31 was removed. As a result, an end portion 37a having a diameter larger than the inner diameter of the through hole 5 in plan view was formed at the upper end of the through portion 36 in the filled conductive paste 34a.

Further, immediately after the removal of the mask 31, as shown by the arrow in FIG. 12A, it spreads from the periphery of the conductive paste 34a along the radial direction of the through hole 5 on the upper surface of the conductor layer 10a, and is liquid. A flange portion 38 made of an epoxy resin and having a substantially circular shape in plan view was formed integrally with the upper end side of the paste 34a.
Then, as shown in FIG. 12B, the conductive paste 34a and the flange portion 38 are cured to form the same through conductor 6 and flange portion 8, respectively, and then the conductor layer 10a is formed in the same manner as described above. It formed in the surface conductor layer 10 of the pattern.
According to the method of manufacturing a wiring board using the mask 31, as shown in FIG. 12B, the through conductor 6 having an end 7a having a larger diameter than the end 7 and the same flange as described above. 8 and a wiring board having the same effect as the previous period was obtained.
Furthermore, in the wiring board obtained by the above method, the conductor pin 16 or the probe pin 29 can be easily and firmly joined above the large-diameter end portion 7a.

13 and 14 are partial schematic views showing a method for manufacturing the wiring board 20.
A step of preparing two insulating layers with conductor Z1 in which a conductor layer 10a is formed for each surface 3 of the insulating layers r1 and r2 in advance, and through holes 5 by laser processing from the conductor layer 10a side of each insulating layer Z1. A step of forming, a step of filling the same conductive paste 34 in each of the through holes 5 and the through holes 32 of the mask 30, and a step of removing the mask 30 and forming the same flange portion 8 Then, the step of hardening the flange portion 8 and the paste 34 and the step of forming a plurality of the surface conductor layers 10 or the interlayer conductor layers 19 by applying a photolithography technique to each conductor layer 10a were sequentially performed. . An adhesive layer w was previously formed on the back surface 4 side of the insulating layers r1 and r2.
As a result, as shown in FIG. 13, it has insulation layers r1 and r2 and a plurality of the conductor layers 10 and 19 formed for each surface 3, and the conductor layers 10 and 19 and the insulation layer r1 or Two unit substrates k1 and k2 having a through conductor 6 that continuously penetrates the insulating layer r2 and a flange portion 8 that covers only the peripheral side of the through conductor 6 on the upper surface of each of the conductor layers 10 and 19 are obtained. It was.

Separately, three green sheets containing alumina powder are prepared, a plurality of via holes are formed by punching or laser processing at predetermined positions for each green sheet, and a conductive paste containing W powder is formed in the via holes. A plurality of via conductors 26 that were filled and unfired were formed (none shown). Of the green sheets, the same conductive paste as described above is screen-printed on the surface of the green sheet that will be the uppermost layer, and the upper end surface of the via conductor 26 penetrating the green sheet is exposed. A plurality of wiring layers 25 for firing were formed. On the other hand, on the back surface of the green sheet that will be the lowermost layer later, the same conductive paste as described above is screen-printed for each position where the lower end surface of the via conductor 26 that penetrates the green sheet is exposed, and a plurality of unfired Back terminal 27 was formed.
Next, after laminating and pressing the three green sheets in a predetermined order, the green sheet laminate is fired to fire the ceramic insulating layers c1 to c3 in which each green sheet is fired, and simultaneously fire these. The ceramic insulating portion 2b having the wiring layer 25, the linear via conductor 26 having a slight taper, and the back terminal 27 was formed.

Further, as indicated by the white arrows in FIG. 13, the unit substrates k1 and k2 are stacked via the adhesive w along their thickness direction, and these are positioned as the uppermost layer in the ceramic insulating portion 2b. The surface of the ceramic layer c1 to be bonded was pressed and adhered.
As a result, as shown in FIG. 14, the substrate body 22 composed of the resin insulating layer 2a composed of the insulating layers r1 and r2 of the unit substrates k1 and k2 and the ceramic insulating portion 2b, and the insulating layers r1 and r2 are formed. A wiring board 20 including two upper and lower through conductors 6 penetrating therethrough and linear via conductors 26 penetrating the ceramic insulating layers c1 to c3 along the thickness direction was obtained. The end portion 7 of the through conductor 6 on the insulating layer r2 side was compressed along the thickness direction during the crimping.
In the wiring substrate 20, migration between adjacent surface conductor layers 10 on the surface 23 of the substrate body 22 or between the through conductors 6 covers only the peripheral side of the through conductor 6 on the upper surface of each conductor layer 10. The flange portion 8 to be removed was slightly suppressed. Furthermore, migration between the adjacent interlayer conductor layers 19 between the insulating layers r1 and r2 and between the through conductors 6 penetrating them covers only the peripheral side of the through conductor 6 on the upper surface of each conductor layer 19. The flange portion 8 to be removed was slightly suppressed.

According to the manufacturing method of the wiring board 20 as described above, a short circuit between the conductor layers 10 and 19 formed at a relatively high density between the surface 23 of the substrate body 22 and the insulating layers r1 and r2 is almost eliminated. In addition, the conductor layers 10 and 19 and the through conductor 6 penetrating them could be connected with high adhesion strength.
Therefore, the probe pins 29 are joined and erected on the end portions 7 for the respective through conductors 6 protruding above the surface 23 of the substrate body 22, so that each of the numerous electronic components formed on the Si wafer is provided. It has become possible to reliably provide the inspection wiring board 20 capable of accurately measuring the electrical characteristics.
The conductor pin 16 may be erected on the end 7 of each through conductor 6.

The present invention is not limited to the embodiments described above.
For example, the insulating layer r may be made of a resin other than polyimide or various ceramics.
Further, the conductive paste 34 is not limited to a metal component containing Ag particles, and other conductive pastes such as those containing Cu particles or containing both Ag particles and Cu particles may be used.
Further, the substrate main body may have a form in which three or more insulating layers r are laminated, or a form in which one, two, or four or more ceramic insulating layers c are laminated.
The step of forming the surface conductor layer 10 and the interlayer conductor layer 19 in a predetermined pattern may be performed immediately after the step of preparing the insulating layers Z1 and Z2 or immediately after the step of forming the through hole 5. .
Further, a thin metal plate metal mask, a resin film, a ceramic green sheet or the like may be used as the mask.
In addition, the method of manufacturing the wiring boards 1a, 1b, 20 and the like can be performed in a multi-cavity form.

  According to the present invention, a plurality of conductor layers are formed at a high density on the surface or inside of a substrate body made up of a required number of insulating layers, and through conductors that continuously penetrate the conductor layers and the insulating layers are formed. Even so, there is provided a wiring board that is less likely to cause migration between adjacent conductor layers between the surfaces and between the insulating layers, and that can reliably connect the conductor layer and the through conductor, and a method for manufacturing the same. be able to.

1a, 1b, 20 ... wiring board 2,22 ......... board body 3,23 ......... front side 4,24 ......... back side (front side)
5 …………………… Through hole 6 …………………… Penetration conductor 7, 7a …………… End of penetration conductor 8 …………………… Flange portion 9 ……… …………… Outer edge of flange 10, 11, ………… Front / back conductor layer (conductor layer)
10a, 10b …… Conductor layer 19 ……………… Interlayer conductor layer (conductor layer)
30, 31 ………… Screen mask (mask)
32, 33 ………… Through hole 34, 34a ……… Conductive paste r, r1, r2 …… Insulating layer c1 to c3 ………… Insulating layer Z1, Z2 ………… Insulating layer with conductor

Claims (8)

A substrate body made of a single insulating layer or laminated with a plurality of insulating layers and having a pair of surfaces;
In the substrate body, a conductor layer formed on at least one surface of at least one insulating layer;
A wiring board comprising a through conductor penetrating through the insulating layer having the conductor layer on the surface and penetrating through the conductor layer continuously,
On the upper surface of the conductor layer, a flange portion that extends from the end side of the through conductor along the radial direction of the through conductor is formed,
The conductivity on at least the outer edge side of the flange portion is lower than the conductivity of the through conductor,
A wiring board characterized by that. At least the outer edge side of the flange portion contains resin, and the water absorption rate of the resin constituting the outer edge side of the flange portion is smaller than the water absorption rate of the insulating layer.
The wiring board according to claim 1. The conductor layer having the flange portion formed on the upper surface is a surface conductor layer formed on at least one surface of the substrate body.
The wiring board according to claim 1 or 2, wherein The end portion of the through conductor protrudes upward from the upper surface of the flange portion,
The wiring board according to any one of claims 1 to 3, wherein The flange portion covers only the peripheral side of the through conductor on the upper surface of the conductor layer.
The wiring board according to any one of claims 1 to 4, wherein the wiring board is provided. A substrate body made of a single insulating layer or laminated with a plurality of insulating layers and having a pair of surfaces;
In the substrate body, a conductor layer formed on at least one surface of at least one insulating layer;
A method of manufacturing a wiring board comprising: a through conductor penetrating through the insulating layer having the conductor layer on a surface thereof and continuously penetrating through the conductor layer;
Preparing an insulating layer with a conductor in which a conductive layer is formed on at least one surface of the insulating layer;
Forming a through-hole that continuously penetrates the insulating layer and the conductor layer;
Filling the through hole and the through hole with a conductive paste containing a resin with a mask having a through hole surrounding the opening of the through hole placed on the upper surface of the conductor layer;
The mask is removed, and the resin contained in the conductive paste filled in the through hole and the through hole is caused to flow from the periphery of the through hole to the outer peripheral side of the through hole along the upper surface of the conductor layer. And forming a flange portion containing the resin,
Curing the conductive paste and the flange portion,
A method for manufacturing a wiring board. The inner diameter of the through hole established in the mask is the same as or larger than the inner diameter of the through hole that opens on the upper surface of the conductor layer,
The method for manufacturing a wiring board according to claim 6. The flange portion covers only the peripheral side of the through conductor on the upper surface of the conductor layer.
The method for manufacturing a wiring board according to claim 6 or 7, wherein:

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