JP2015023163A5 - - Google Patents

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Publication number
JP2015023163A5
JP2015023163A5 JP2013150480A JP2013150480A JP2015023163A5 JP 2015023163 A5 JP2015023163 A5 JP 2015023163A5 JP 2013150480 A JP2013150480 A JP 2013150480A JP 2013150480 A JP2013150480 A JP 2013150480A JP 2015023163 A5 JP2015023163 A5 JP 2015023163A5
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JP
Japan
Prior art keywords
optical film
film layer
solid
imaging device
state imaging
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Application number
JP2013150480A
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English (en)
Japanese (ja)
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JP6120075B2 (ja
JP2015023163A (ja
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Application filed filed Critical
Priority to JP2013150480A priority Critical patent/JP6120075B2/ja
Priority claimed from JP2013150480A external-priority patent/JP6120075B2/ja
Priority to CN201410331473.XA priority patent/CN104299945A/zh
Priority to US14/330,270 priority patent/US9461082B2/en
Publication of JP2015023163A publication Critical patent/JP2015023163A/ja
Publication of JP2015023163A5 publication Critical patent/JP2015023163A5/ja
Priority to US15/260,821 priority patent/US10461111B2/en
Application granted granted Critical
Publication of JP6120075B2 publication Critical patent/JP6120075B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013150480A 2013-07-19 2013-07-19 固体撮像装置および固体撮像装置の製造方法。 Expired - Fee Related JP6120075B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013150480A JP6120075B2 (ja) 2013-07-19 2013-07-19 固体撮像装置および固体撮像装置の製造方法。
CN201410331473.XA CN104299945A (zh) 2013-07-19 2014-07-11 固态成像设备及其制造方法
US14/330,270 US9461082B2 (en) 2013-07-19 2014-07-14 Solid state imaging apparatus and method of producing the same
US15/260,821 US10461111B2 (en) 2013-07-19 2016-09-09 Solid state imaging apparatus and method of producing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013150480A JP6120075B2 (ja) 2013-07-19 2013-07-19 固体撮像装置および固体撮像装置の製造方法。

Publications (3)

Publication Number Publication Date
JP2015023163A JP2015023163A (ja) 2015-02-02
JP2015023163A5 true JP2015023163A5 (enExample) 2016-03-17
JP6120075B2 JP6120075B2 (ja) 2017-04-26

Family

ID=52319615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013150480A Expired - Fee Related JP6120075B2 (ja) 2013-07-19 2013-07-19 固体撮像装置および固体撮像装置の製造方法。

Country Status (3)

Country Link
US (2) US9461082B2 (enExample)
JP (1) JP6120075B2 (enExample)
CN (1) CN104299945A (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6295983B2 (ja) * 2015-03-05 2018-03-20 ソニー株式会社 半導体装置およびその製造方法、並びに電子機器
JP2018011018A (ja) * 2016-07-15 2018-01-18 ソニー株式会社 固体撮像素子および製造方法、並びに電子機器
US11676929B2 (en) 2016-10-21 2023-06-13 Sony Semiconductor Solutions Corporation Electronic substrate and electronic apparatus
US10910289B2 (en) * 2016-10-21 2021-02-02 Sony Semiconductor Solutions Corporation Electronic substrate and electronic apparatus
US11217615B2 (en) 2017-01-30 2022-01-04 Sony Semiconductor Solutions Corporation Imaging element, fabrication method, and electronic equipment
JP7060835B2 (ja) * 2017-09-26 2022-04-27 カシオ計算機株式会社 回路基板、電子機器、および回路基板の製造方法
US11770627B1 (en) 2019-10-04 2023-09-26 Ball Aerospace & Technologies Corp. Systems and methods for direct measurement of photon arrival rate
EP3911132B1 (en) * 2020-05-12 2024-07-03 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Component carrier with a solid body protecting a component carrier hole from foreign material ingression

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002124654A (ja) * 2000-10-13 2002-04-26 Mitsubishi Electric Corp 固体撮像装置
JP2003234362A (ja) * 2002-02-12 2003-08-22 Yokogawa Electric Corp 半導体装置
US7122874B2 (en) * 2004-04-12 2006-10-17 Optopac, Inc. Electronic package having a sealing structure on predetermined area, and the method thereof
JP2007067317A (ja) 2005-09-02 2007-03-15 Seiko Epson Corp 半導体装置の実装構造、及び半導体装置の実装方法
JP2009239258A (ja) * 2008-03-05 2009-10-15 Panasonic Corp 光学デバイス及びその製造方法
JP2009251249A (ja) * 2008-04-04 2009-10-29 Sharp Corp ウエハ状光学装置およびその製造方法、電子素子ウエハモジュール、センサウエハモジュール、電子素子モジュール、センサモジュール、電子情報機器
US8426959B2 (en) * 2009-08-19 2013-04-23 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
JP2011054794A (ja) * 2009-09-02 2011-03-17 Panasonic Corp 光学デバイス及びその製造方法
JP2011243612A (ja) * 2010-05-14 2011-12-01 Sony Corp 半導体装置及びその製造方法並びに電子機器
JP5924017B2 (ja) * 2011-02-16 2016-05-25 株式会社リコー 可逆性感熱記録媒体及びその製造方法

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