JP6120075B2 - 固体撮像装置および固体撮像装置の製造方法。 - Google Patents
固体撮像装置および固体撮像装置の製造方法。 Download PDFInfo
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
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- 229910052814 silicon oxide Inorganic materials 0.000 description 1
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Description
図1は、固体撮像装置に用いられる一般的な固体撮像素子チップの構成を模した側面断面を示している。
図2は、本技術を適用した固体撮像装置に用いられる固体撮像素子チップの一実施の形態の構成例を示したものである。すなわち、上述したようなことから、本技術を適用した固体撮像素子チップにおいては、図2で示されるように、凸型流れ止め構造33に代えて、凹型流れ止め構造41を設ける構成としている。尚、図2において、図1と同様の機能を備えた構成については、同一の名称および符号を付すものとし、その説明は適宜省略するものとする。
また、凹型流れ止め構造41を採用することにより、多機能チップ31の端部から凹型流れ止め構造41の位置までの距離を縮小することが可能となる。すなわち、図4の上部で示されるように、封止樹脂層32を構成するために、凹型流れ止め構造41を設けた場合、図4の下部で示されるように、凹型流れ止め構造41の端部である部位41a(以降、堀込段差のかど41aと称する)における、周辺回路領域21aの表面と、硬化する前の(液状の)封止樹脂との成す角を、接触角θで表すものとすると、以下のような関係が成立する。すなわち、接触角θにおける周辺回路領域21aの表面張力γは、堀込段差のかど41aの摩擦力γ1と、硬化する前の封止樹脂の表面張力γ2×cosθとの和となる。従って、接触角θ=90°の場合、cosθ=0となることから、硬化する前の封止樹脂の表面張力γ2は0となり、周辺回路領域21aの表面張力γと、堀込段差のかど41aの摩擦力γ1とが一致することで、硬化前の封止樹脂は、凹型流れ止め構造41内に流れ込まない。
図6の上段で示されるように、光学画素領域21bに隣接するように周辺回路領域21aが存在し、周辺回路領域21a内に多機能チップ31が積層される場合の凸型流れ止め構造33および凹型流れ止め構造41のそれぞれにおける、光学画素領域21bの迷い光の光強度分布(放射照度分布)が図7の上段および下段にそれぞれ示されている。
次に、図8のフローチャートを参照して、凹型流れ止め構造41を備えた固体撮像素子チップの製造処理について説明する。
Claims (5)
- 固体撮像素子が搭載された光学膜層と、
前記光学膜層において前記固体撮像素子の周辺領域に、前記光学膜層と金属体を介して電気的に接続された状態で積層される多機能チップと、
前記光学膜層上で、前記多機能チップが積層される周辺領域を封止する封止樹脂層と、
前記封止樹脂層の周辺領域において、前記封止樹脂層が形成される際の液状の封止樹脂の流れ止め用の凹型流れ止め構造とを含み、
前記凹型流れ止め構造は、前記多機能チップの周囲を多重に囲むようにウェハ工程のドライエッチングにより前記光学膜層のみが堀込まれて構成される堀込段差である
固体撮像装置。 - 前記凹型流れ止め構造を構成する前記堀込段差の内壁は、前記光学膜層の表面に対して略60乃至90°の傾斜角範囲で、前記多機能チップの周囲を囲むように堀込段差加工される
請求項1に記載の固体撮像装置。 - 前記光学膜層の配線上と配線間上では、前記光学膜層の前記堀込段差加工により形成される形状が異なる
請求項2に記載の固体撮像装置。 - 前記光学膜層の前記堀込段差加工は、積層される前記多機能チップの周辺を囲むパターンである
請求項3のいずれかに記載の固体撮像装置。 - 固体撮像素子が搭載された光学膜層と、
前記光学膜層において前記固体撮像素子の周辺領域に、前記光学膜層と金属体を介して電気的に接続された状態で積層される多機能チップと、
前記光学膜層上で、前記多機能チップが積層される周辺領域を封止する封止樹脂層と、
前記封止樹脂層の周辺領域において、前記封止樹脂層が形成される際の液状の封止樹脂の流れ止め用の凹型流れ止め構造とを含み、
前記凹型流れ止め構造は、前記多機能チップの周囲を多重に囲むようにウェハ工程のドライエッチングにより前記光学膜層のみが堀込まれて構成される堀込段差である固体撮像装置の製造方法において、
前記光学膜層を形成し、
前記光学膜層の前記多機能チップが積層される周辺に、前記多機能チップの周囲を多重に囲むようにウェハ工程のドライエッチングにより前記光学膜層のみが堀込まれて構成される堀込段差からなる前記凹型流れ止め構造を形成し、
前記多機能チップを前記光学膜層上に積層し、
前記凹型流れ止め構造で囲まれた範囲内において、前記封止樹脂を塗布供与し、硬化させて、前記多機能チップの周辺に前記封止樹脂層を形成する
工程を含む固体撮像素子の製造方法。
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JP2013150480A JP6120075B2 (ja) | 2013-07-19 | 2013-07-19 | 固体撮像装置および固体撮像装置の製造方法。 |
CN201410331473.XA CN104299945A (zh) | 2013-07-19 | 2014-07-11 | 固态成像设备及其制造方法 |
US14/330,270 US9461082B2 (en) | 2013-07-19 | 2014-07-14 | Solid state imaging apparatus and method of producing the same |
US15/260,821 US10461111B2 (en) | 2013-07-19 | 2016-09-09 | Solid state imaging apparatus and method of producing the same |
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JP5924017B2 (ja) * | 2011-02-16 | 2016-05-25 | 株式会社リコー | 可逆性感熱記録媒体及びその製造方法 |
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