JP2015019016A - 基板乾燥装置、基板処理装置及び基板乾燥方法 - Google Patents

基板乾燥装置、基板処理装置及び基板乾燥方法 Download PDF

Info

Publication number
JP2015019016A
JP2015019016A JP2013146732A JP2013146732A JP2015019016A JP 2015019016 A JP2015019016 A JP 2015019016A JP 2013146732 A JP2013146732 A JP 2013146732A JP 2013146732 A JP2013146732 A JP 2013146732A JP 2015019016 A JP2015019016 A JP 2015019016A
Authority
JP
Japan
Prior art keywords
substrate
gas
drying
target surface
dry gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2013146732A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015019016A5 (enExample
Inventor
晃一 樋口
Koichi Higuchi
晃一 樋口
尊彦 和歌月
Takahiko Wakatsuki
尊彦 和歌月
菊池　勉
Tsutomu Kikuchi
勉 菊池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2013146732A priority Critical patent/JP2015019016A/ja
Publication of JP2015019016A publication Critical patent/JP2015019016A/ja
Publication of JP2015019016A5 publication Critical patent/JP2015019016A5/ja
Withdrawn legal-status Critical Current

Links

Images

Landscapes

  • Drying Of Solid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2013146732A 2013-07-12 2013-07-12 基板乾燥装置、基板処理装置及び基板乾燥方法 Withdrawn JP2015019016A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013146732A JP2015019016A (ja) 2013-07-12 2013-07-12 基板乾燥装置、基板処理装置及び基板乾燥方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013146732A JP2015019016A (ja) 2013-07-12 2013-07-12 基板乾燥装置、基板処理装置及び基板乾燥方法

Publications (2)

Publication Number Publication Date
JP2015019016A true JP2015019016A (ja) 2015-01-29
JP2015019016A5 JP2015019016A5 (enExample) 2016-08-25

Family

ID=52439745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013146732A Withdrawn JP2015019016A (ja) 2013-07-12 2013-07-12 基板乾燥装置、基板処理装置及び基板乾燥方法

Country Status (1)

Country Link
JP (1) JP2015019016A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017056971A1 (ja) * 2015-09-29 2017-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN111668096A (zh) * 2020-06-22 2020-09-15 徐文凯 第三代半导体的刻蚀方法和装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017056971A1 (ja) * 2015-09-29 2017-04-06 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
US10720320B2 (en) 2015-09-29 2020-07-21 SCREEN Holdings Co., Ltd. Substrate processing method and substrate processing device
CN111668096A (zh) * 2020-06-22 2020-09-15 徐文凯 第三代半导体的刻蚀方法和装置

Similar Documents

Publication Publication Date Title
JP6212066B2 (ja) 塗布処理方法、コンピュータ記憶媒体及び塗布処理装置
JP6740028B2 (ja) 基板処理装置、基板処理方法および記憶媒体
JP4760516B2 (ja) 塗布装置及び塗布方法
US10406566B2 (en) Substrate processing device and substrate processing method
US10276406B2 (en) Substrate processing device and substrate processing method
US20150090296A1 (en) Substrate processing device and substrate processing method
JP2008060578A (ja) 基板処理装置および基板処理方法
JP2012074564A (ja) 基板処理装置及び基板処理方法
JP7378556B2 (ja) 基板処理装置
JP2010056534A (ja) 基板の洗浄方法、基板の洗浄装置及び記憶媒体
JP2007088398A (ja) 洗浄装置、この洗浄装置を用いた洗浄システム、及び被洗浄基板の洗浄方法
KR102709048B1 (ko) 기판 건조 장치, 기판 건조 방법 및 기억 매체
JP4079212B2 (ja) 塗布膜形成装置およびスピンチャック
JP6811675B2 (ja) 基板処理方法および基板処理装置
JP6865008B2 (ja) 基板処理装置及び基板処理方法
JP2014179489A (ja) 基板処理装置
JP2018056529A (ja) 基板処理装置
JP2015019016A (ja) 基板乾燥装置、基板処理装置及び基板乾燥方法
JP2009238793A (ja) 基板処理方法および基板処理装置
JP2014110404A (ja) 基板処理装置および基板処理方法
US9607865B2 (en) Substrate processing device and substrate processing method
JP5461107B2 (ja) 基板処理装置
JP2014187253A (ja) 基板処理装置および基板処理方法
JP3682172B2 (ja) 基板乾燥装置及び基板乾燥方法
JP7138493B2 (ja) 基板液処理方法、記憶媒体および基板液処理装置

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20150601

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160711

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160711

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20170321

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170407