JP2015018992A - Component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component mounting device capable of improving productivity of a substrate by improving imaging accuracy when an image of each component sucked by each suction nozzle in two nozzle rows of a mounting head is picked up from a side, and reducing an imaging time.SOLUTION: The component mounting device comprises: a first side imaging camera 26a for focusing on a first position P1 through which a component 3 sucked by each suction nozzle 22 constituting one of two front and rear nozzle rows of a mounting head 21 moving toward a first component recognition camera 24a passes, and picking up the image of the component 3 passing through the first position P1 from the side; and a second side imaging camera 27a for focusing on a second position P2 through which the component 3 sucked by each suction nozzle 2 constituting the other of the two nozzle rows passes, and picking up the image of the component 3 passing through the second position P2 from the side.

Description

  The present invention relates to a component mounting apparatus that sucks a component supplied from a component supply unit by a suction nozzle provided in a mounting head and mounts the component on a substrate.

  Conventionally, in order to improve the mounting accuracy of a component, when mounting a micro component such as a chip component on a board, the component mounting apparatus captures the component not only from below but also from the side, and based on the imaging result. The correction at the time of mounting on the substrate is performed (for example, Patent Document 1). In this case, the side imaging of the component is performed in parallel with the downward imaging of the component by the component recognition camera, and the mounting head in which the component is sucked by the suction nozzle is moved relative to the component recognition camera. The parts are continuously imaged by the side imaging camera with the imaging field of view directed to the side.

JP 2009-054820 A

  However, in the above-mentioned conventional one, all the parts sucked by the suction nozzles of the two nozzle rows are imaged by one side imaging camera, and the position of the focus of one side imaging camera is determined. Since it cannot be set so as to be optimal for all the components sucked by the suction nozzles of the two nozzle rows, it is difficult to obtain high imaging accuracy. In addition, in order to be able to pick up images of all the parts sucked by the suction nozzles of the two nozzle rows with a single side imaging camera, the imaging optical axis of the camera is parallel to the moving path of the mounting head. Since it is configured to be in a close posture, the scanning distance of the mounting head with respect to the side imaging camera becomes long, and the imaging from the side ends significantly exceeding the imaging time from below the part by the part recognition camera As a result, the imaging time becomes longer and the productivity of the substrate decreases.

  Therefore, the present invention aims to improve the imaging accuracy and improve the productivity of the substrate by shortening the imaging time when imaging each part adsorbed by each adsorbing nozzle of the two nozzle rows of the mounting head from the side. It is an object of the present invention to provide a component mounting apparatus that can perform such a process.

  The component mounting apparatus according to claim 1, wherein a substrate transport mechanism that transports a substrate and positions the substrate at a predetermined position, and a plurality of suction nozzles that constitute two nozzle rows extending in the substrate transport direction by the substrate transport mechanism A mounting head that sucks the component supplied from the component supply unit by each suction nozzle and mounts it on the substrate positioned by the substrate transport mechanism; and the mounting head that sucks the component to the suction nozzle is above Constituting one nozzle row of two nozzle rows of a component recognition camera that picks up an image of the component from below when moving in the substrate transport direction and a mounting head that moves relative to the component recognition camera A first side imaging camera that focuses on the first position through which the part sucked by each suction nozzle passes and images the part that passes through the first position from the side. The part passing through the second position is focused on the second position through which the part sucked by each of the suction nozzles constituting the other nozzle row of the two nozzle rows passes. And a second side imaging camera for imaging.

  A component mounting apparatus according to a second aspect of the present invention is the component mounting apparatus according to the first aspect, wherein the component supply unit is provided on two feeder bases arranged in the transport direction of the substrate by the substrate transport mechanism. The component recognition camera, the first side imaging camera, and the second side imaging camera are integrally provided in a region between the two feeder bases.

  In the present invention, when a component corresponding to one nozzle row of the two nozzle rows of the mounting head that moves relative to the component recognition camera passes through the first position where the first side imaging camera is focused. The second side imaging camera captures an image with the first side imaging camera, and the part corresponding to the other nozzle row passes through the second position where the second side imaging camera is focused. Since the first side imaging camera and the second side imaging camera each perform imaging at a single focal point, the imaging accuracy of the components can be improved. In addition, since the first side imaging camera and the second side imaging camera perform imaging of components independently of each other, imaging of components corresponding to one nozzle row and imaging of components corresponding to the other nozzle row are performed. Can be done in parallel. For this reason, the scanning distance of the mounting head can be shortened, the imaging time can be shortened, and the productivity of the substrate can be improved.

The top view of the component mounting apparatus in one embodiment of this invention The side view of the component mounting apparatus in one embodiment of this invention (A) Perspective view (b) Side view of a tape feeder mounted on a front feeder base provided in a component mounting apparatus according to an embodiment of the present invention (A) Side view of a tape feeder mounted on a rear feeder base included in a component mounting apparatus according to an embodiment of the present invention (b) Side view of a manual tray feeder (A) Perspective view of rear feeder base in one embodiment of the present invention (b) Perspective view showing rear feeder base together with tape feeder (A) (b) The perspective view which shows the back feeder base in one embodiment of this invention with a manual placement tray feeder The perspective view of the mounting head with which the component mounting apparatus in one embodiment of this invention is provided The top view which shows the 1st component recognition camera with which the component mounting apparatus in one embodiment of this invention is equipped, and a thickness detection part with a mounting head Timing chart of component imaging operation performed by component mounting apparatus in one embodiment of the present invention in first component recognition camera and thickness detection unit (A) (b) The top view which shows the 1st component recognition camera with which the component mounting apparatus in one embodiment of this invention is equipped, and a thickness detection part with a mounting head The figure which shows an example of the image of the components which the 1st side imaging camera with which the thickness detection part of the component mounting apparatus in one embodiment of this invention is equipped, or the 2nd side imaging camera acquired The block diagram which shows the control system of the component mounting apparatus in one embodiment of this invention

  Embodiments of the present invention will be described below with reference to the drawings. 1 and 2, the component mounting apparatus 1 carries in and positions the board 2 sent from the apparatus on the upstream process side, and mounts the part 3 on an electrode portion (not shown) on the board 2. It is an apparatus that repeatedly executes a component mounting operation that is carried out to an apparatus on the downstream process side. Hereinafter, for convenience of explanation, the transport direction of the substrate 2 is defined as the X-axis direction (left-right direction as viewed from the operator OP), and the horizontal plane direction orthogonal to the X-axis direction is defined as the Y-axis direction (front-back direction as viewed from the operator OP). And Also, the vertical direction is the Z-axis direction.

  1 and 2, the component mounting apparatus 1 includes a pair of board conveyance conveyors 12 as a board conveyance mechanism that conveys the board 2 in the X-axis direction and positions the board 2 at a predetermined position at the center of a base 11. A front area 11A (first area) and a rear area 11B (second area) are provided at positions (sides) sandwiching the substrate transport conveyor 12 on the base 11 in the front-rear direction.

  A plurality of (here, two on the left and right) feeder bases 13 (a front feeder base 13a as a first feeder base) are provided side by side in the X-axis direction in the front region 11A of the base 11. In the rear region 11B, a plurality of (here, two on the left and right) feeder bases 13 (a rear feeder base 13b as a second feeder base) are provided side by side in the X-axis direction. A tape feeder 14 is attached to the front feeder base 13a (see also FIGS. 3A and 3B), and the tape feeder 14 or the manual tray feeder 15 is selectively used as a component supply unit for the rear feeder base 13b. (See also FIGS. 4A and 4B). FIG. 1 shows an example of a state in which the tape feeder 14 is mounted on the left rear feeder base 13b and the manual tray feeder 15 is mounted on the right rear feeder base 13b.

  3A, 3B, and 4A, the tape feeder 14 supplies the component 3 held on the carrier tape CT to the component supply port 14a by the conveying operation of the carrier tape CT. The tape feeder 14 is attached to the feeder base 13 (the front feeder base 13a or the rear feeder base 13b). A slot 13S (FIG. 13) is formed by connecting a connecting portion 14R provided on the lower surface of the tape feeder 14 on the upper surface of the feeder base 13. 3 (a) and FIG. 5 (a)) are engaged and slid toward the substrate transfer conveyor 12 (arrow A shown in FIGS. 3 (a) and 5 (b)).

  6 (a) and 6 (b), the manually placed tray feeder 15 is configured by placing a pallet 15p on a flat table portion 15a, and the tray 15T is held on the pallet 15p. Components 3 (mainly relatively large components such as BGA) are accommodated in the tray 15T in an aligned state. For mounting the manual tray feeder 15 on the rear feeder base 13b, the connecting portion 15R provided on the lower surface of the manual tray feeder 15 is engaged with the slot 13S of the rear feeder base 13b and slid to the substrate transport conveyor 12 side. (FIG. 6 (a) → FIG. 6 (b). Arrow B shown in FIG. 6 (a)). As a result, the component 3 in the tray 15T is positioned within a component suction possible range of the mounting head 21 described later. That is, the manually placed tray feeder 15 supplies the component 3 placed on the tray 15T.

  1 and 2, a chute 16 is provided in a region between each feeder base 13 and the substrate transport conveyor 12. The chute 16 has a carrier tape CT (empty tape) that is discharged after the tape feeder 14 mounted on the feeder base 13 supplies the components 3 disposed below the base 11 from the opening 11K provided on the base 11. It is a member which guides to the discarded part (not shown), and is attached to the base 11 in an upright state (see also FIGS. 3A, 5A and 5B). A chute 16 provided in a region between the front feeder base 13a and the substrate transfer conveyor 12 is a fixed chute 16a provided on the base 11 in the above-mentioned standing posture, and the rear feeder base 13b A chute 16 provided in a region between the substrate transfer conveyor 12 is a swinging chute 16b that can be swung from an upright posture to a lying posture that has fallen to the substrate transfer conveyor 12 side.

  As shown in FIGS. 5A and 5B and FIGS. 6A and 6B, the swinging chute 16b is fixed to the fixed portion 16A fixed on the base 11, and to the fixed portion 16A. The movable portion 16B is configured to be swingable around the swing shaft 16J, and the movable portion 16B switches the posture between a standing posture standing upward and a lying posture lying on the substrate transport conveyor 12 side. Can be done. At a position near the swing shaft 16J, based on the relative position of the swing shaft 16J, a posture detection sensor 17 (posture detection) such as an encoder that detects whether the swing chute 16b is in a standing posture or a lying posture. Means).

  As shown in FIGS. 5A and 5B and FIGS. 6A and 6B, the hand-held tray feeder 15 is located at the end of the hand-held tray feeder 15 on the substrate transport conveyor 12 side. An attachment detection sensor 18 (attachment detection means) for detecting whether or not the attachment is attached to 13b is provided. The mounting detection sensor 18 receives, for example, a protrusion 15b extending in a horizontal direction from the leading portion of the manual tray feeder 15 on the substrate transport conveyor 12 side in a state where the manual tray feeder 15 is mounted on the rear feeder base 13b. The switch member is configured to output a mounting detection signal while being received in the hole 18a.

  When the tape feeder 14 is mounted on the rear feeder base 13b, the swing chute 16b is in an upright posture (FIGS. 5A and 5B), and the hand-held tray feeder 15 is mounted on the rear feeder base 13b. In this case, the posture is set to fall (FIGS. 6A and 6B). When the hand tray tray 15 is mounted on the rear feeder base 13b, the swinging chute 16b is placed in the lying posture. The hand tray tray 15 when the hand tray tray 15 is mounted on the rear feeder base 13b. Since the leading portion in the mounting direction is positioned to protrude toward the substrate transport conveyor 12 from the leading portion in the mounting direction of the tape feeder 14 when the tape feeder 14 is mounted on the rear feeder base 13b, it is mounted on the rear feeder base 13b. This is to prevent the manually placed tray feeder 15 from interfering with the swinging chute 16b. That is, the swing-type chute 16b does not interfere with the manual tray feeder 15 when the carrier tray CT (empty tape) is guided to the disposal unit and when the manual tray feeder 15 is mounted on the rear feeder base 13b. It is provided so as to be swingable between the lying down posture.

  Further, in the component mounting apparatus 1 according to the present embodiment, the front portion of the manual tray feeder 15 when mounted on the rear feeder base 13b is located between the rear feeder base 13b and the board transfer conveyor 12 at the rear feeder base. A space (a space where nothing is installed) 11SP that can be positioned so as to protrude from the top of the tape feeder 14 toward the substrate transport conveyor 12 side when mounted on 13b is provided (FIG. 5). 1, FIG. 5 (a), (b) and FIG. 6 (a), (b)).

  1 and 2, on the base 11, a pair of Y-axis tables 20a extending in the Y-axis direction and arranged to face each other in the X-axis direction, extending in the X-axis direction and having both ends at the pair of Y-axis An orthogonal coordinate robot type head moving mechanism 20 is provided which includes an X-axis table 20b supported by the table 20a and a moving stage 20c which is provided so as to be movable in the X-axis direction on the X-axis table 20b. A mounting head 21 is attached to the moving stage 20c of the head moving mechanism 20, and the X-axis table 20b is driven in the Y-axis direction by the pair of Y-axis tables 20a and the X-axis direction of the moving stage 20c is driven by the X-axis table 20b. The mounting head 21 is moved above the base 11 in the horizontal plane direction in combination with the drive to the horizontal direction.

  In FIG. 7, a plurality of suction nozzles 22 extending downward in the mounting head 21 form two front and rear nozzle rows (front nozzle row and rear nozzle row) extending in the X-axis direction (that is, the transport direction of the substrate 2). Is provided. Each suction nozzle 22 is movable up and down in the vertical direction (up and down) with respect to the mounting head 21 and can be rotated around the vertical axis, and is composed of a tape feeder 14 or a manual tray feeder 15 upon receiving a vacuum pressure. The component 3 supplied from the supply unit is vacuum-sucked.

  1 and 7, the mounting head 21 is provided with a substrate camera 23 whose imaging field of view is directed downward. In addition, in order to recognize the posture of the component 3 in the state of being sucked by the suction nozzle 22, in the front region 11 </ b> A on the base 11, the region between the two front feeder bases 13 a arranged in the X-axis direction is A first component recognition camera 24a having an imaging field of view facing upward is provided. Similarly, in the rear region 11B on the base 11, a region between the two rear feeder bases 13b arranged in the X-axis direction is similarly provided with a second component recognition camera 24b with the imaging field of view facing upward. ing.

  In FIG. 8, the first component recognition camera 24a includes a line sensor unit 24S composed of a large number of light receiving elements (not shown) arranged in the Y-axis direction, and surrounds the line sensor unit 24S in plan view. A recognition camera illumination 24L composed of a plurality of illumination bodies 24H is provided at the position (the same applies to the second component recognition camera 24b).

  Each component 3 sucked by the mounting head 21 from the tape feeder 14 mounted on the front feeder base 13a by the suction nozzle 22 is imaged from below by the first component recognition camera 24a before being mounted on the substrate 2, and mounted. Each component 3 sucked from the tape feeder 14 or the manual tray feeder 15 mounted on the rear feeder base 13b by the suction nozzle 22 is lowered by the second component recognition camera 24b before being mounted on the substrate 2. Is taken from. When the component 3 is imaged by the first component recognition camera 24a or the second component recognition camera 24b, the mounting head 21 is the center of the line sensor unit 24S included in the first component recognition camera 24a or the second component recognition camera 24b. 8 is moved in the X-axis direction (the transport direction of the substrate 2) (the movement trajectory SL of the mounting head 21 at this time is shown in FIG. 8), and all the sucked parts 3 are in the upper region of the line sensor unit 24S. Is passed in the X-axis direction (that is, relative to the line sensor unit 24S) (arrow C shown in FIG. 8).

  Each illuminating body 24H constituting the recognition camera illumination 24L is composed of an LED (for example, a red LED) that emits illumination light having a first wavelength band, and the recognition camera illumination 24L is located in the upper region of the line sensor unit 24S. Illumination light having a wavelength band of. The line sensor unit 24S of the first component recognition camera 24a receives illumination light (reflected light) having the first wavelength band from the recognition camera illumination 24L reflected by the component 3 passing above the line sensor unit 24S. The image of the part 3 is taken from below.

  The recognition camera illumination 24L has a first wavelength toward the upper region of the line sensor unit 24S until all the components 3 pass through the upper region of the line sensor unit 24S due to the movement of the mounting head 21 described above. During this period (while the line sensor unit 24S is performing the imaging operation), the line sensor unit 24S continuously executes the imaging operation, and below each component 3 (FIG. 9). Get image data from. In FIG. 9, the time axis T1 is the time when the tip of the mounting head 21 in the traveling direction reaches the line sensor unit 24S, and indicates the imaging start time by the line sensor unit 24S. This is the time when the rear end of the head 21 in the traveling direction has passed through the line sensor unit 24S, and shows the time when the line sensor unit 24S finishes imaging.

  1 and 8, a thickness detector 25 is provided in the vicinity of the first component recognition camera 24a. The thickness detector 25 includes two side imaging cameras (first side imaging camera 26a and second side imaging camera 27a) with the imaging optical axis oriented horizontally and two sides with the illumination optical axis oriented horizontally. It has illumination (first side illumination 26b and second side illumination 27b), and is provided integrally with the first component recognition camera 24a. By imaging the component 3 from the side by the thickness detection unit 25 and detecting the thickness of the component 3, it is sufficient to capture only the component 3 from below by the first component recognition camera 24a or the second component recognition camera 24b. It is possible to recognize the posture of the component 3 in a state of being attracted by the suction nozzle 22 even for a minute component that is difficult to recognize.

  In FIG. 8, the first side imaging camera 26 a includes a suction nozzle 22 that constitutes the front nozzle row among the two front and rear nozzle rows provided in the mounting head 21 that passes through the upper region of the line sensor unit 24 </ b> S in the X-axis direction. Is focused on a predetermined position (referred to as a first position P1) through which the component 3 adsorbed is passed. On the other hand, in the second side imaging camera 27a, the suction nozzle 22 constituting the rear nozzle row is sucked out of the two front and rear nozzle rows provided in the mounting head 21 passing through the upper region of the line sensor unit 24S in the X-axis direction. The predetermined position (referred to as the second position P2) through which the component 3 passes is focused. As shown in FIG. 8, the first position P1 and the second position P2 are positions in the vicinity of the line sensor unit 24S in a plan view and are slightly shifted in the X-axis direction. .

  8 and 10 (a) and 10 (b), the first side imaging camera 26a has a posture in which the imaging optical axis J1 is tilted from the Y-axis direction in plan view. The part 3 passing through the first position P1 can be imaged from the side without being obstructed by the parts 3 sucked by the suction nozzles 22 constituting the row. The second side imaging camera 27a also has an attitude in which the imaging optical axis J2 is inclined from the Y-axis direction (in a direction opposite to the imaging optical axis J1 of the first side imaging camera 26a) in plan view. Thus, the part 3 passing through the second position P2 can be imaged from the side without being blocked by the part 3 sucked by the suction nozzle 22 constituting the front nozzle row.

  The first side illumination 26b is located on the imaging optical axis J1 of the first side imaging camera 26a and sandwiching the line sensor unit 24S, and the illumination light L1 toward the first side imaging camera 26a. (FIGS. 10A and 10B). The second side illumination 27b is positioned on the imaging optical axis J2 of the second side imaging camera 27a and sandwiching the line sensor unit 24S, and illuminates toward the second side imaging camera 27a. The light L2 is irradiated (FIGS. 10A and 10B). In the present embodiment, as shown in FIGS. 1 and 8, the first side imaging camera 26a and the second side imaging camera 27a are outside the line sensor unit 24S (on the side opposite to the substrate transport conveyor 12). 1st side illumination 26b and 2nd side illumination 27b are located in the area | region (board | substrate conveyance conveyor 12 side) inside the line sensor part 24S.

  Each of the first side illumination 26b and the second side illumination 27b includes an LED (for example, a green LED) that emits illumination light having a second wavelength band different from the first wavelength band, and the line sensor unit 24S. Is illuminated with illumination light having the second wavelength band. That is, the illumination light of the recognition camera illumination 24L (illumination light composed of the first wavelength band) and the illumination light (illumination light composed of the second wavelength band) of the first side illumination 26b and the second side illumination 27b The wavelength bands are different. The first side imaging camera 26a receives illumination light (transmitted light) having the second wavelength band from the first side illumination 26b that has passed through the part 3 passing above the line sensor unit 24S and receives the part. 3, and the second side imaging camera 27 a transmits illumination light (transmitted light) having the second wavelength band from the second side illumination 27 b that has passed through the part 3 passing above the line sensor unit 24 </ b> S. Is received and the part 3 is imaged.

  Here, in the cover glass of the line sensor unit 24S provided in the first component recognition camera 24a, the illumination light having the second wavelength band from the first side illumination 26b and the second side illumination 27b can be cut. One wavelength band filter 24F is attached so that the component 3 can be imaged without being affected by the illumination light having the second wavelength band. Each of the first side imaging camera 26a and the second side imaging camera 27a (specifically, the imaging lens or its cover glass) has the first wavelength band from the first component recognition camera 24a. A second wavelength band filter 25F capable of cutting the illumination light is attached, and the component 3 can be imaged without being affected by the illumination light having the first wavelength band.

  As described above, in the present embodiment, the first side imaging camera 26a has the respective suctions constituting one nozzle row of the two nozzle rows of the mounting head 21 that moves relative to the first component recognition camera 24a. Focusing on the first position P1 through which the part 3 sucked by the nozzle 22 passes, the part 3 passing through the first position P1 is imaged from the side, and the second side imaging camera 27a is Focusing on the second position P2 through which the component 3 sucked by each suction nozzle 22 constituting the other nozzle row of the two nozzle rows passes, the component 3 passing through the second position P2 is lateral. The image is taken from.

  The first side illumination 26b irradiates the illumination light L1 having the second wavelength band only at the moment when the first side imaging camera 26a images the component 3 that has reached the first position P1, and the first side imaging 26b. The camera 26a acquires a silhouette image of the component 3 that has passed through the first position P1 against the background of the illumination light L1 having the second wavelength band irradiated by the first side illumination 26b. On the other hand, the second side illumination 27b irradiates the illumination light L2 having the second wavelength band only at the moment when the second side imaging camera 27a images the part 3 that has reached the second position P2, and the second side illumination 27b The side imaging camera 27a acquires a silhouette image of the component 3 that has passed through the second position P2 with the illumination light L2 having the second wavelength band irradiated by the second side illumination 27b as a background. FIG. 11 shows an example of the silhouette image GZ of the part 3 acquired by the first side imaging camera 26 a (or the second side imaging camera 27 a) by imaging the part 3. As described above, the thickness detection unit 25 is provided integrally with the first component recognition camera 24a, so that the first position P1 and the second position P2 are in the vicinity of the line sensor unit 24S. Therefore, the imaging from the side of the part 3 by the first side imaging camera 26a and the second side imaging camera 27a is the same as the imaging from the lower side of the part 3 by the first part recognition camera 24a. It is performed in parallel (see FIG. 9).

  Further, as described above, the first position P1 and the second position P2 are set to be shifted in the X-axis direction, so that the first side imaging camera 26a reaches the first position P1. The timing (FIG. 10 (a)) for capturing the captured component 3 and the timing (FIG. 10 (b)) for capturing the component 3 at which the second side imaging camera 27a has reached the second position P2 are not simultaneous. . Since the imaging operation of the component 3 by the first side imaging camera 26a and the imaging operation of the component 3 by the second side imaging camera 27a can be performed alternately (FIG. 9), the second side illumination 27b second The illumination light L2 having the wavelength band does not hinder the imaging of the component 3 by the first side imaging camera 26a, and the illumination light L1 having the second wavelength band of the first side illumination 26b is the second side. This does not hinder the imaging of the part 3 by the imaging camera 27a. Accordingly, the first side imaging camera 26a and the second side imaging camera 27a are not adversely affected by the illumination light having the second wavelength band of the other party, and the side imaging of the component 3 with high accuracy is possible. The result can be obtained.

  Thus, the component mounting apparatus 1 according to the present embodiment includes the first component recognition camera 24a and the first component recognition camera as the first imaging camera that images the component 3 sucked by the suction nozzle 22 from below. Recognition camera illumination 24L as a first illuminating unit that irradiates illumination light having a first wavelength band for imaging of the component 3 by 24a, and simultaneously with imaging from below the component 3 by the first component recognition camera 24a The first side imaging camera 26a, the second side imaging camera 27a, the first side imaging camera 26a, and the second imaging camera 26a as the second imaging camera that images the part 3 sucked by the suction nozzle 22 from the side. A configuration including a first side illumination 26b and a second side illumination 27b as a second illumination unit that emits illumination light having a second wavelength band for imaging of the component 3 by the side imaging camera 27a. Yes To have. Then, the first side imaging camera 26a focuses on the component 3 corresponding to the front nozzle row of the two nozzle rows before and after the mounting head 21 that moves relative to the first component recognition camera 24a. An image is taken when passing through the first position P1, and a part 3 corresponding to the rear nozzle row is taken when passing through the second position P2 where the second side imaging camera 27a is focused. Therefore, the first side imaging camera 26a and the second side imaging camera 27a can each perform imaging at a single focal point, and the imaging accuracy of the component 3 can be improved.

  In addition, since the first side imaging camera 26a and the second side imaging camera 27a perform imaging of the component 3 independently of each other, the imaging of the component 3 corresponding to one nozzle row and the component corresponding to the other nozzle row are performed. 3 imaging can be performed in parallel. When all the components 3 adsorbed by the two rows of nozzles are picked up by one camera, the optical axis of the camera is configured to be close to the traveling axis of the mounting head 21 (shallow angle). However, in the present embodiment, since the first side imaging camera 26a and the second side imaging camera 27a perform imaging in parallel, the scanning distance is shortened and the time required for imaging the component 3 can be shortened. The productivity of the substrate 2 can be improved.

  When all the components 3 adsorbed by the two rows of nozzles are imaged with one camera, the position of the camera is in a posture (shallow angle) close to the traveling axis of the mounting head 21. Therefore, it is necessary to install the camera 3 at a certain distance from the imaging position of the component 3 (above the first component recognition camera 24a). If the component 3 of one nozzle row and the component 3 of the other nozzle row are separately imaged by the (first side imaging camera 26a and the second side imaging camera 27a), these two cameras are the component 3 Can be provided close to the imaging position. Therefore, as in the present embodiment, the first side imaging camera 26a and the second side imaging camera 27a and their illumination units (the first side illumination 26b and the second side illumination 27b) are connected to the first side imaging camera 26a and the second side imaging camera 27a. In the case of adopting a configuration provided integrally with the component recognition camera 24a, the size can be made compact.

  As described above, imaging from below of the component 3 by the first component recognition camera 24a and from the side of the component 3 by the thickness detection unit 25 (the first side imaging camera 26a and the second side imaging camera 27a). In the situation where the illumination light consisting of the first wavelength band for imaging by the first component recognition camera 24a is continuously emitted from the recognition camera illumination 24L, the thickness of Irradiation light having the second wavelength band for imaging by the detector 25 is intermittently emitted from the first side illumination 26b or the second side illumination 27b (FIG. 9). Then, at the time of imaging by the thickness detection unit 25, illumination light having the first wavelength band for imaging by the first component recognition camera 24a and irradiation light having the second wavelength band for imaging by the thickness detection unit 25 Are irradiated at the same time. As a result, the irradiation light composed of the second wavelength band for imaging by the thickness detection unit 25 adversely affects the imaging result of the first component recognition camera 24a, and the first for imaging by the first component recognition camera 24a. Irradiation light having a wavelength band of 1 adversely affects the imaging result of the thickness detection unit 25, so that the imaging accuracy decreases.

  However, from the illumination light composed of the first wavelength band for imaging by the first component recognition camera 24a (illumination light emitted by the recognition camera illumination 24L) and the second wavelength band for imaging by the thickness detection unit 25 The wavelength components of the illumination light (illumination light emitted by the first side illumination 26b or the second side illumination 27b) are made different from each other, and the first component recognition camera 24a uses the first wavelength band filter 24F to change the thickness detection unit. Imaging is performed in a state where the wavelength band of the illumination light composed of the second wavelength band on the 25th side is cut, and the thickness detection unit 25 side is first on the first component recognition camera 24a side by the second wavelength band filter 25F. Since the imaging is performed in a state where the wavelength band of the illumination light having the wavelength band is cut, the illumination light having the second wavelength band on the thickness detection unit 25 side interferes with the imaging for the first component recognition camera 24a. Never Illumination light comprising a first wavelength band of the first component recognition camera 24a side does not become an obstacle to the imaging for the detection unit 25 side.

  In FIG. 1, a first nozzle stocker 28a, which is a nozzle stocker on the front region 11A side, is installed between one (here, the right side) front feeder base 13a and the substrate transport conveyor 12, and the other (here, the right side). A disposal box 29 is installed between the front feeder base 13 a on the left side and the substrate transport conveyor 12. The nozzle stocker (the first nozzle stocker 28a and the second nozzle stocker 28b described later) is a member that holds the suction nozzle 22 for replacement of the suction nozzle 22 included in the mounting head 21, and the disposal box 29 is handled as disposal. This is a container-like member into which the component 3 that has become. The first nozzle stocker 28a may be provided between at least one of the two front feeder bases 13a and the substrate transport conveyor 12.

  A second nozzle stocker 28b, which is a nozzle stocker on the rear region 11B side, is installed in the region between the two rear feeder bases 13b. Since the arrangement of the nozzle stocker (second nozzle stocker 28b) having a relatively small influence on the production tact is changed, the above-described space 11SP is provided between the rear feeder base 13b and the substrate transport conveyor 12 without reducing the production tact. It is possible to ensure.

  In FIG. 12, the operation of conveying and positioning the substrate 2 by the substrate conveying conveyor 12, the operation of supplying the component 3 by each tape feeder 14, and the operation of moving the mounting head 21 by the head moving mechanism 20 are performed by the control device 30 provided in the component mounting apparatus 1. Made. Each operation of raising and lowering and rotating each suction nozzle 22 is performed by controlling the operation of a nozzle drive mechanism 21 a provided in the mounting head 21 by the control device 30, and the suction operation of the component 3 by each suction nozzle 22 is controlled. This is done by the device 30 controlling the operation of the suction mechanism 21b. Further, information sent from the posture detection sensor 17 of each swing type chute 16b (information on whether the swing type chute 16b is in a standing posture or a lying posture) and sent from the mounting detection sensor 18. The information (information on whether or not the manual tray feeder 15 is attached to the rear feeder base 13 b) is input to the control device 30.

  Imaging operation control by the board camera 23, the first component recognition camera 24a and the second component recognition camera 24b, and the illumination operation control of the recognition camera illumination 24L provided in each of the first component recognition camera 24a and the second component recognition camera 24b. Is performed by the control device 30. The control device also controls each imaging operation of the first side imaging camera 26a and the second side imaging camera 27a and the illumination operation control of the first side illumination 26b and the second side illumination 27b constituting the thickness detection unit 25. 30. Image data obtained by the imaging operations of the board camera 23, the first component recognition camera 24a, the second component recognition camera 24b, the first side imaging camera 26a, and the second side imaging camera 27a are respectively sent to the control device 30. The image recognition unit 30a (FIG. 12) of the control device 30 performs image recognition.

  The control device 30 recognizes the position of the board 2 by performing image recognition of image data of a mark (not shown) on the board 2 obtained by the imaging operation of the board camera 23, and performs the position recognition of the first component recognition camera 24a. Image recognition of the image data of the component 3 obtained by the imaging operation is performed to recognize the component 3, and image recognition of the image data of the component 3 obtained by the imaging operation of the second component recognition camera 24b is performed. The part 3 is recognized. In addition, the control device 30 performs image recognition of the silhouette image of the component 3 that has passed the first position P1 obtained by the imaging operation of the first side imaging camera 26a, detects the thickness of the component 3, and Image recognition of the silhouette image of the part 3 that has passed through the second position P2 obtained by the imaging operation of the two side imaging camera 27a is performed, and the thickness of the part 3 is detected. In the example of the silhouette image GZ in FIG. 11, the vertical dimension of the part 3 shown in the figure corresponds to the thickness T of the part 3. The posture of the component 3 in the state of being sucked by the suction nozzle 22 can be recognized based on the magnitude relationship when the thickness T is compared with the thickness data of the known component 3.

  In FIG. 12, the program storage unit 30b of the control device 30 stores a production operation program related to the production of the board 2, and the production operation program is predetermined according to the component supply form of the component supply unit. Information on the posture of the swinging chute 16b is recorded. And the 1st alarm control part 30c of the control apparatus 30 determines beforehand according to the attitude | position of the rocking | swiveling type chute | shoot 16b detected by the attitude | position detection sensor 17, and the component supply form of the component supply part recorded on the production operation program. When the posture of the swing type chute 16b detected by the posture detection sensor 17 is compared with the predetermined posture of the swing type chute 16b. In addition, a warning is given to the worker OP via an alarm 31 such as a buzzer connected to the control device 30. In this case, the predetermined posture of the swing chute 16b is an upright posture in the case of a component supply form in which the tape feeder 14 is attached to the rear feeder base 13b, and the rear feeder base 13b has a hand posture. In the case of a component supply form that is performed by mounting the placing tray feeder 15, it is a lying posture.

  In FIG. 12, the second alarm control unit 30 d of the control device 30 is a case in which the component supply form of the component supply unit is a component supply form that is performed by attaching the manual tray feeder 15 to the rear feeder base 13 b. When the state where the manual tray feeder 15 is not attached to the rear feeder base 13b is detected by the attachment detection sensor 18, an alarm is issued to the operator OP via the alarm device 31.

  As described above, in the present embodiment, the first alarm control unit 30c and the alarm device 31 of the control device 30 are configured so that the posture of the swinging chute 16b detected by the posture detection sensor 17 is the component supply form of the component supply unit. Accordingly, the first warning means for issuing a warning when the posture of the swinging chute 16b is not consistent with the predetermined posture. Further, the second alarm control unit 30d and the alarm device 31 of the control device 30 are the case where the component supply mode of the component supply unit is a component supply mode that is performed by mounting the manual tray feeder 15 on the rear feeder base 13b. This is a second alarm unit that issues an alarm when the mounting detection sensor 18 detects that the manual feeder tray feeder 15 is not mounted on the rear feeder base 13b.

  Next, a procedure for mounting the component 3 on the substrate 2 by the component mounting apparatus 1 (component mounting operation) will be described. For this purpose, the control device 30 first operates the substrate transfer conveyor 12 to receive and carry in the substrate 2 sent from the upstream process device, and position it at a predetermined work position. Next, the mounting head 21 is moved, and a mark on the substrate 2 (not shown) is picked up by the substrate camera 23 to perform image recognition, and the positional deviation of the substrate 2 is obtained from the position of the mark on the obtained substrate 2. .

  When the controller 30 obtains the positional deviation of the substrate 2, the controller 30 moves the mounting head 21 and sucks the component 3 by the suction nozzle 22. When the control device 30 adsorbs the component 3 supplied by the tape feeder 14 to the mounting head 21, the mounting head 21 is positioned above the tape feeder 14 while causing the tape feeder 14 to supply the component 3. The component 3 supplied to the component supply port 14 a by the tape feeder 14 is adsorbed by the adsorption nozzle 22. On the other hand, when the controller 30 adsorbs the component 3 supplied by the manual tray feeder 15 to the mounting head 21, the control device 30 positions the mounting head 21 above the tray 15T on the pallet 15p on which the manual tray feeder 15 is placed. Thus, the component 3 in the tray 15T is sucked by the suction nozzle 22.

  When the component 3 is attracted to the mounting head 21 as described above, the control device 30 moves the mounting head 21 so that the mounting head 21 absorbs the component 3 sucked by the suction nozzles 22 constituting the two front and rear nozzle rows. Recognize. Here, when the mounting head 21 recognizes the component 3 sucked from the tape feeder 14 mounted on the front feeder base 13a in the front region 11A, the component 3 sucked by the suction nozzle 22 is detected. The mounting head 21 is moved so as to pass in the X-axis direction along the movement trajectory SL above the first component recognition camera 24a. Then, each component 3 is imaged from below by the first component recognition camera 24a for recognition, and the presence / absence of abnormality of the component 3 is determined, the suction posture with respect to the suction nozzle 22 is grasped (calculation of suction deviation), and the like. . In addition, when the first component recognition camera 24a performs imaging from below the component 3, the control device 30 performs the thickness detection of each component 3 by the thickness detection unit 25 in parallel with this.

  On the other hand, the control device 30 is configured such that the mounting head 21 is sucked from the tape feeder 14 mounted on the rear feeder base 13b in the rear area 11B or the component sucked from the manual tray feeder 15 mounted on the rear feeder base 13b. 3 is recognized, the mounting head 21 is moved so that the component 3 sucked by the suction nozzle 22 passes in the X-axis direction along the movement path SL above the second component recognition camera 24b. Then, each component 3 is imaged from below by the second component recognition camera 24b to recognize it, and whether or not there is an abnormality in the component 3, grasping the suction posture with respect to the suction nozzle 22 (calculation of suction displacement), and the like are performed. .

  In addition, the control apparatus 30 is with respect to the component 3 adsorbed from the tape feeder 14 with which the back feeder base 13b in the back area | region 11B was mounted | worn, or the component 3 with which it adsorbed from the manual placement tray feeder 15 with which the back feeder base 13b was mounted | worn. When the first component recognition camera 24a captures an image from below, the first component recognition camera 24a can move the mounting head 21 without moving the mounting head 21 so as to pass along the movement path SL in the X-axis direction. The mounting head 21 is moved so as to pass above the one component recognition camera 24a along the movement path SL in the X-axis direction. And the control apparatus 30 detects the thickness of each component 3 by the thickness detection part 25 in parallel with this, when imaging from the downward direction of the component 3 by the 1st component recognition camera 24a.

  When the control device 30 detects the positional shift of the component 3 relative to the suction nozzle 22 as described above, and further detects the thickness of the component 3 together with this, the control device 30 positions the mounting head 21 above the substrate 2 and moves the suction nozzle 22 to the suction nozzle 22. The sucked component 3 is brought into contact with the substrate 2 to release the vacuum suction, and the component 3 is mounted on the substrate 2. When the component 3 is mounted, a correction is made so that the positional deviation of the substrate 2 obtained as described above, the suction deviation of the component 3 and the deviation of the posture of the component 3 obtained based on the thickness of the component 3 are canceled. Do.

  After mounting the components 3 sucked by the respective suction nozzles 22 of the mounting head 21 on the substrate 2, the control device 30 determines whether or not all the components 3 to be mounted on the substrate 2 have been mounted. . As a result, when the mounting of all the components 3 to be mounted on the substrate 2 has not been completed, the new component 3 is subsequently sucked and the mounting of all the components 3 to be mounted on the substrate 2 is completed. When it is done, the board conveying conveyor 12 is operated to carry out the board 2 from the component mounting apparatus 1.

  In the production operation program for executing the component mounting operation according to the above procedure, when the component supply form from the rear feeder base 13b is changed from the tape feeder 14 to the manual tray feeder 15, the current detected by the posture detection sensor 17 is detected. The posture of the swinging chute 16b (standing posture) does not coincide with the posture (falling posture) predetermined according to the component supply form of the component supply unit recorded in the production operation program. Further, the attachment detection sensor 18 detects a state in which the manual tray feeder 15 is not attached to the rear feeder base 13b in a situation where the manual tray feeder 15 should be attached to the rear feeder base 13b. Become. For this reason, the control device 30 notifies that through the alarm device 31 described above (the posture of the swinging chute 16b is not in the lying posture and the manual feeder tray feeder 15 is not mounted on the rear feeder base 13b). The operator OP is notified and the tape feeder 14 attached to the rear feeder base 13b is removed from the operator OP through the screen of the display device 32 (FIG. 12) connected to the control device 30, and the swing chute 16b is removed. Is in a lying posture, and a work instruction is given to the effect that the manual tray feeder 15 should be mounted.

  When the operator OP receives the operation instruction from the control device 30 through the screen of the display device 32 or the like, the operator OP removes the tape feeder 14 from the target rear feeder base 13b and swings the chute 16b in the standing posture. Then, the hand-held tray feeder 15 is mounted on the rear feeder base 13b. As a result, the posture of the swing chute 16b coincides with a predetermined posture (falling posture), and the manual feeder tray feeder 15 is mounted on the rear feeder base 13b. After stopping the notification through the machine 31, the production operation program is advanced.

  On the contrary, in the production operation program, when the component supply form from the rear feeder base 13b is changed from the manual tray feeder 15 to the tape feeder 14, the current fluctuation detected by the posture detection sensor 17 is changed. The posture (falling posture) of the dynamic chute 16b does not match the posture (standing posture) determined in advance according to the component supply form of the component supply unit. The mounting detection sensor 18 detects a state in which the manual tray feeder 15 is mounted on the rear feeder base 13b in a situation where the manual tray feeder 15 is not mounted on the rear feeder base 13b. It will be. For this reason, the control device 30 informs that effect (the posture of the swinging chute 16b is not in the standing posture and the hand-held tray feeder 15 is mounted on the rear feeder base 13b) through the alarm device 31 described above. The operator OP is notified and the operator OP removes the hand-held tray feeder 15 attached to the rear feeder base 13b through the screen of the display device 32 and the like, and the swinging chute 16b is raised. A work instruction for giving the tape feeder 14 is given.

  When the operator OP receives the above work instruction from the control device 30 through the screen of the display device 32 or the like, the operator OP removes the hand-held tray feeder 15 from the target rear feeder base 13b and swings in the lying posture. After raising the chute 16b to the upright posture, the tape feeder 14 is mounted on the rear feeder base 13b. As a result, the posture of the swing chute 16b coincides with a predetermined posture (standing posture), and the manual tray feeder 15 is not attached to the rear feeder base 13b. After stopping the notification through the alarm device 31, the production operation program is advanced.

  As described above, in the component mounting apparatus 1 according to the present embodiment, the posture of the swing type chute 16b detected by the posture detection sensor 17 is determined according to the component supply form of the component supply unit. If the position does not coincide with the posture of 16b, an alarm is issued (alarm by the first alarm means), and the component supply form of the component supply unit is performed by attaching the manual tray feeder 15 to the rear feeder base 13b. In the supply mode, an alarm (alarm by the second alarm means) is issued when the attachment detection sensor 18 detects that the manual feeder tray feeder 15 is not attached to the rear feeder base 13b. It is like that. Therefore, it is possible to prevent the operator OP from setting mistakes of the swinging chute 16b, and to reliably attach the tape feeder 14 when the tape feeder 14 is to be attached to the rear feeder base 13b. The hand-held tray feeder 15 can be securely attached when it is to be attached. In particular, when the manual tray feeder 15 is to be attached to the rear feeder base 13b, the swinging chute 16b is in a lying posture, and the manual feeder tray feeder 15 is not attached to the rear feeder base 13b. Since the warning by the second warning means is issued, it is possible to reliably prevent mistakes (including forgetting to mount) of the manual tray feeder 15 by the operator OP by double checking.

  As described above, the component mounting apparatus 1 according to the present embodiment corresponds to one (front) nozzle row of the two front and rear nozzle rows of the mounting head 21 that moves relative to the first component recognition camera 24a. The part 3 to be imaged is taken by the first side imaging camera 26a when passing the first position P1 where the first side imaging camera 26a is focused, and the part 3 corresponding to the other (rear) nozzle row is When the second side imaging camera 27a passes through the focused second position P2, the second side imaging camera 27a captures an image. The first side imaging camera 26a and the second side imaging camera 26a Since each of the imaging cameras 27a performs imaging at a single focal point, the imaging accuracy of the component 3 can be improved. In addition, since the first side imaging camera 26a and the second side imaging camera 27a perform imaging of the component 3 independently of each other, the imaging of the component 3 corresponding to one (front) nozzle row and the other (rear) Imaging of the component 3 corresponding to the nozzle row can be performed in parallel. For this reason, the scanning distance of the mounting head 21 can be shortened, the imaging time can be shortened, and the productivity of the substrate 2 can be improved.

  Further, in the component mounting apparatus 1 according to the present embodiment, as described above, the two cameras (the first side imaging camera 26a and the second side imaging camera 27a) use the component 3 in one nozzle row and the other nozzle row. Since these two cameras can be provided close to the imaging position of the component 3, the first component recognition camera 24a, the first side imaging camera 26a, The second side imaging camera 27a can be integrally provided in a region between the two front feeder bases 13a to form a compact configuration.

  Component mounting capable of improving the imaging accuracy and improving the productivity of the substrate by shortening the imaging time when imaging each component sucked by each suction nozzle of the two nozzle rows of the mounting head from the side Providing equipment.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Components 12 Board | substrate conveyance conveyor (board | substrate conveyance mechanism)
13a Front feeder base (feeder base)
14 Tape feeder (component supply unit)
21 mounting head 22 suction nozzle 24a first component recognition camera (component recognition camera)
26a First lateral imaging camera 27a Second lateral imaging camera P1 First position P2 Second position

Claims (2)

A substrate transport mechanism for transporting the substrate and positioning it at a predetermined position;
A plurality of suction nozzles constituting two nozzle rows extending in the substrate transport direction by the substrate transport mechanism are provided, and the components supplied from the component supply unit by the respective suction nozzles are suctioned and positioned by the substrate transport mechanism. A mounting head to be mounted on the substrate,
A component recognition camera that images the component from below when the mounting head that has attracted the component to the suction nozzle moves upward in the transport direction of the substrate;
The first position is focused on the first position through which the component sucked by each suction nozzle constituting one nozzle row of the two nozzle rows of the mounting head that moves relative to the component recognition camera passes. A first side imaging camera that images the part passing through the position from the side;
Focusing on the second position through which the part sucked by each of the suction nozzles constituting the other nozzle row of the two nozzle rows is focused, the part passing through the second position from the side. A component mounting apparatus comprising a second side imaging camera for imaging.   The component supply unit is provided on two feeder bases arranged in the substrate transport direction by the substrate transport mechanism, and the component recognition camera, the first side imaging camera, and the second side imaging camera are The component mounting apparatus according to claim 1, wherein the component mounting apparatus is integrally provided in a region between the two feeder bases.

Images