JP2015012055A5 - - Google Patents

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Publication number
JP2015012055A5
JP2015012055A5 JP2013134691A JP2013134691A JP2015012055A5 JP 2015012055 A5 JP2015012055 A5 JP 2015012055A5 JP 2013134691 A JP2013134691 A JP 2013134691A JP 2013134691 A JP2013134691 A JP 2013134691A JP 2015012055 A5 JP2015012055 A5 JP 2015012055A5
Authority
JP
Japan
Prior art keywords
copper foil
roughening treatment
copper
spine
enlarging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013134691A
Other languages
English (en)
Japanese (ja)
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JP6202905B2 (ja
JP2015012055A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013134691A priority Critical patent/JP6202905B2/ja
Priority claimed from JP2013134691A external-priority patent/JP6202905B2/ja
Publication of JP2015012055A publication Critical patent/JP2015012055A/ja
Publication of JP2015012055A5 publication Critical patent/JP2015012055A5/ja
Application granted granted Critical
Publication of JP6202905B2 publication Critical patent/JP6202905B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013134691A 2013-06-27 2013-06-27 回路基板およびその製造方法 Expired - Fee Related JP6202905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013134691A JP6202905B2 (ja) 2013-06-27 2013-06-27 回路基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013134691A JP6202905B2 (ja) 2013-06-27 2013-06-27 回路基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2015012055A JP2015012055A (ja) 2015-01-19
JP2015012055A5 true JP2015012055A5 (cg-RX-API-DMAC7.html) 2016-02-25
JP6202905B2 JP6202905B2 (ja) 2017-09-27

Family

ID=52304981

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013134691A Expired - Fee Related JP6202905B2 (ja) 2013-06-27 2013-06-27 回路基板およびその製造方法

Country Status (1)

Country Link
JP (1) JP6202905B2 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6929555B2 (ja) * 2018-10-18 2021-09-01 共同技研化学株式会社 金属張積層板の製造方法
WO2021039370A1 (ja) 2019-08-29 2021-03-04 東洋鋼鈑株式会社 銅張積層体及びその製造方法
WO2022030645A1 (ja) 2020-08-07 2022-02-10 東洋鋼鈑株式会社 銅張積層体及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4471795B2 (ja) * 2004-09-21 2010-06-02 古河電気工業株式会社 電解銅箔の製造方法およびプリント配線板
JP2008127618A (ja) * 2006-11-20 2008-06-05 Furukawa Circuit Foil Kk 交流給電による銅箔の表面処理方法
JP2011016962A (ja) * 2009-07-10 2011-01-27 Sekisui Chem Co Ltd 熱伝導性樹脂組成物及び電子回路用基板
JP2011216598A (ja) * 2010-03-31 2011-10-27 Kuraray Co Ltd 高周波回路基板
CN103069933B (zh) * 2010-08-12 2014-06-04 新日铁住金化学株式会社 覆金属层叠板

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