JP2012124253A5 - - Google Patents

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Publication number
JP2012124253A5
JP2012124253A5 JP2010272499A JP2010272499A JP2012124253A5 JP 2012124253 A5 JP2012124253 A5 JP 2012124253A5 JP 2010272499 A JP2010272499 A JP 2010272499A JP 2010272499 A JP2010272499 A JP 2010272499A JP 2012124253 A5 JP2012124253 A5 JP 2012124253A5
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JP
Japan
Prior art keywords
plating layer
hole
electrode substrate
layer
energizing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010272499A
Other languages
English (en)
Japanese (ja)
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JP5671317B2 (ja
JP2012124253A (ja
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Publication date
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Priority to JP2010272499A priority Critical patent/JP5671317B2/ja
Priority claimed from JP2010272499A external-priority patent/JP5671317B2/ja
Publication of JP2012124253A publication Critical patent/JP2012124253A/ja
Publication of JP2012124253A5 publication Critical patent/JP2012124253A5/ja
Application granted granted Critical
Publication of JP5671317B2 publication Critical patent/JP5671317B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010272499A 2010-12-07 2010-12-07 貫通電極基板及びその製造方法 Expired - Fee Related JP5671317B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010272499A JP5671317B2 (ja) 2010-12-07 2010-12-07 貫通電極基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010272499A JP5671317B2 (ja) 2010-12-07 2010-12-07 貫通電極基板及びその製造方法

Publications (3)

Publication Number Publication Date
JP2012124253A JP2012124253A (ja) 2012-06-28
JP2012124253A5 true JP2012124253A5 (cg-RX-API-DMAC7.html) 2014-01-30
JP5671317B2 JP5671317B2 (ja) 2015-02-18

Family

ID=46505420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010272499A Expired - Fee Related JP5671317B2 (ja) 2010-12-07 2010-12-07 貫通電極基板及びその製造方法

Country Status (1)

Country Link
JP (1) JP5671317B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102178158B1 (ko) * 2018-11-26 2020-11-12 동아대학교 산학협력단 관통공이 매립된 Si 기판의 제조방법
JPWO2022138151A1 (cg-RX-API-DMAC7.html) * 2020-12-23 2022-06-30

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4153328B2 (ja) * 2003-02-25 2008-09-24 日本シイエムケイ株式会社 多層プリント配線板の製造方法
JP4800585B2 (ja) * 2004-03-30 2011-10-26 ルネサスエレクトロニクス株式会社 貫通電極の製造方法、シリコンスペーサーの製造方法
JP2007005404A (ja) * 2005-06-21 2007-01-11 Matsushita Electric Works Ltd 半導体基板への貫通配線の形成方法
JP2007067031A (ja) * 2005-08-30 2007-03-15 Tdk Corp 配線基板の製造方法
JP4755545B2 (ja) * 2006-07-11 2011-08-24 新光電気工業株式会社 基板の製造方法

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