JP2014532989A - チャンバ壁温度制御を備えたプラズマリアクタ - Google Patents
チャンバ壁温度制御を備えたプラズマリアクタ Download PDFInfo
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- JP2014532989A JP2014532989A JP2014538841A JP2014538841A JP2014532989A JP 2014532989 A JP2014532989 A JP 2014532989A JP 2014538841 A JP2014538841 A JP 2014538841A JP 2014538841 A JP2014538841 A JP 2014538841A JP 2014532989 A JP2014532989 A JP 2014532989A
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- 238000012545 processing Methods 0.000 claims abstract description 69
- 239000002826 coolant Substances 0.000 claims description 15
- 238000009616 inductively coupled plasma Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 11
- 239000004065 semiconductor Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
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- 239000000463 material Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 3
- 230000006399 behavior Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
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- 230000007547 defect Effects 0.000 description 3
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- 238000010586 diagram Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 239000011737 fluorine Substances 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000008246 gaseous mixture Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910001026 inconel Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003446 memory effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30604—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Vapour Deposition (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (15)
- 処理チャンバの内部容積内の基板支持体の周りに配置される大きさの第1伝導体と、
第1伝導体の第1端部に結合された内縁部を有し、内縁部の半径方向外側に配置された外縁部を有する第1伝導性リングと、
第1伝導性リングの外縁部に結合され、第1伝導性リングの上方に配置された少なくとも一部を有する第2伝導体であって、第1伝導性リングと、第2伝導体の少なくとも一部が、第1伝導性リングの上方の第1領域を部分的に画定する第2伝導体と、
第1伝導体、第2伝導体、及び第1伝導性リングを加熱するように構成されるヒータを含む基板を処理するための装置。 - 第1端部とは反対の第1伝導体の第2端部に結合された第3伝導体を含み、第3伝導体、第1伝導性リング、及び第1伝導体は、第1領域の下方に配置された第2領域を部分的に画定する請求項1記載の装置。
- 第1伝導性リングが、基板支持体の処理面の上方の第1領域を第2領域に流体結合するために第1伝導性リングを貫通して配置された複数の開口部を更に含む請求項2記載の装置。
- 第2伝導体は、第1領域から分離された第1チャネルを更に含み、第1チャネルは第2伝導体内かつ第1領域の周りに配置され、ヒータが第1チャネル内に配置される請求項1記載の装置。
- 第1伝導体、第2伝導体、第3伝導体、及び第1伝導性リングの各々は、アルミニウム(Al)を含む請求項1記載の装置。
- 第1領域に面する第2伝導体及び第1伝導性リングの表面上に形成された非伝導性コーティングを含む請求項1記載の装置。
- 第2伝導体の外部かつ周りに配置され、第2チャネルを介してクーラントを流すための第2チャネルを有する第4本体を含む請求項1記載の装置。
- 第2伝導体及び第1伝導性リングは、一体に製造される請求項1記載の装置。
- 第1伝導性リングが、基板支持体の処理面の上方の第1領域を、第1伝導性リングの下方に配置された第2領域に流体結合するために、第1伝導性リングを貫通して配置された複数の開口部を更に含む請求項1記載の装置。
- 第2伝導体は、第1領域から分離された第1チャネルを更に含み、第1チャネルは第2伝導体内かつ第1領域の周りに配置され、ヒータが第1チャネル内に配置される請求項9記載の装置。
- 内部容積及び内部容積内に配置された基板支持体を有する処理チャンバと、
処理チャンバの内部容積内に配置された前記請求項のいずれか1項記載の基板を処理するための装置を含む基板処理装置。 - 請求項3に記載されるように第1伝導体の第2端部に結合された第3伝導体を含み、第3伝導体は、第1伝導体が処理チャンバの壁に接触するのを防止する請求項11記載の基板処理装置。
- 第1伝導体は、第3伝導体を介して処理チャンバの壁に電気的に結合され、第3伝導体を介して処理チャンバの壁から熱的に分離される請求項12記載の基板処理装置。
- 請求項7に記載されるように、第2伝導体の外部かつ周りに配置され、第2チャネルを介してクーラントを流すための第2チャネルを有する第4本体と、
第4伝導体の第2チャネルにクーラントを供給するクーラント供給源を含む請求項11記載の基板処理装置。 - 処理チャンバの天井の上方に配置され、RF電源に結合された第1RFコイル及び第2RFコイルを有する誘導結合プラズマ装置を含む請求項11記載の基板処理装置。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201161552806P | 2011-10-28 | 2011-10-28 | |
US61/552,806 | 2011-10-28 | ||
US201261681370P | 2012-08-09 | 2012-08-09 | |
US61/681,370 | 2012-08-09 | ||
US13/647,574 US20130105085A1 (en) | 2011-10-28 | 2012-10-09 | Plasma reactor with chamber wall temperature control |
US13/647,574 | 2012-10-09 | ||
PCT/US2012/060686 WO2013062834A1 (en) | 2011-10-28 | 2012-10-17 | Plasma reactor with chamber wall temperature control |
Publications (3)
Publication Number | Publication Date |
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JP2014532989A true JP2014532989A (ja) | 2014-12-08 |
JP2014532989A5 JP2014532989A5 (ja) | 2015-12-10 |
JP6143766B2 JP6143766B2 (ja) | 2017-06-07 |
Family
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Family Applications (1)
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JP2014538841A Active JP6143766B2 (ja) | 2011-10-28 | 2012-10-17 | チャンバ壁温度制御を備えたプラズマリアクタ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20130105085A1 (ja) |
JP (1) | JP6143766B2 (ja) |
CN (1) | CN103891417B (ja) |
TW (1) | TWI614789B (ja) |
WO (1) | WO2013062834A1 (ja) |
Cited By (2)
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KR20180028937A (ko) * | 2016-09-09 | 2018-03-19 | 도쿄엘렉트론가부시키가이샤 | 안테나 장치 및 이것을 사용한 플라즈마 발생 장치, 및 플라즈마 처리 장치 |
KR20200003561A (ko) * | 2018-07-02 | 2020-01-10 | 주식회사 기가레인 | 기계적으로 플라즈마 밀도를 제어하는 기판 처리 장치 |
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US9761416B2 (en) * | 2013-03-15 | 2017-09-12 | Applied Materials, Inc. | Apparatus and methods for reducing particles in semiconductor process chambers |
KR102202406B1 (ko) * | 2013-05-23 | 2021-01-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 반도체 처리 챔버를 위한 코팅된 라이너 어셈블리 |
US9837250B2 (en) | 2013-08-30 | 2017-12-05 | Applied Materials, Inc. | Hot wall reactor with cooled vacuum containment |
JP5857207B2 (ja) | 2013-11-18 | 2016-02-10 | パナソニックIpマネジメント株式会社 | プラズマ処理装置及び方法 |
CN104658845B (zh) * | 2013-11-22 | 2017-07-28 | 中微半导体设备(上海)有限公司 | 等离子体处理装置及其隔离装置 |
KR20160002543A (ko) * | 2014-06-30 | 2016-01-08 | 세메스 주식회사 | 기판 처리 장치 |
US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
US10573496B2 (en) | 2014-12-09 | 2020-02-25 | Applied Materials, Inc. | Direct outlet toroidal plasma source |
US10224210B2 (en) | 2014-12-09 | 2019-03-05 | Applied Materials, Inc. | Plasma processing system with direct outlet toroidal plasma source |
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US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
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CN106711007B (zh) * | 2015-11-17 | 2018-08-14 | 中微半导体设备(上海)有限公司 | 一种感应耦合型等离子体处理装置 |
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2012
- 2012-10-09 US US13/647,574 patent/US20130105085A1/en not_active Abandoned
- 2012-10-17 CN CN201280051755.3A patent/CN103891417B/zh not_active Expired - Fee Related
- 2012-10-17 JP JP2014538841A patent/JP6143766B2/ja active Active
- 2012-10-17 WO PCT/US2012/060686 patent/WO2013062834A1/en active Application Filing
- 2012-10-25 TW TW101139499A patent/TWI614789B/zh not_active IP Right Cessation
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JP2010238944A (ja) * | 2009-03-31 | 2010-10-21 | Panasonic Corp | プラズマ処理装置 |
WO2011146108A2 (en) * | 2010-05-21 | 2011-11-24 | Lam Research Corporation | Movable chamber liner plasma confinement screen combination for plasma processing apparatuses |
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KR20180028937A (ko) * | 2016-09-09 | 2018-03-19 | 도쿄엘렉트론가부시키가이샤 | 안테나 장치 및 이것을 사용한 플라즈마 발생 장치, 및 플라즈마 처리 장치 |
KR102190279B1 (ko) | 2016-09-09 | 2020-12-11 | 도쿄엘렉트론가부시키가이샤 | 안테나 장치 및 이것을 사용한 플라즈마 발생 장치, 및 플라즈마 처리 장치 |
KR20200003561A (ko) * | 2018-07-02 | 2020-01-10 | 주식회사 기가레인 | 기계적으로 플라즈마 밀도를 제어하는 기판 처리 장치 |
KR102190794B1 (ko) * | 2018-07-02 | 2020-12-15 | 주식회사 기가레인 | 기계적으로 플라즈마 밀도를 제어하는 기판 처리 장치 |
Also Published As
Publication number | Publication date |
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TW201330047A (zh) | 2013-07-16 |
CN103891417A (zh) | 2014-06-25 |
TWI614789B (zh) | 2018-02-11 |
CN103891417B (zh) | 2018-02-27 |
WO2013062834A1 (en) | 2013-05-02 |
JP6143766B2 (ja) | 2017-06-07 |
US20130105085A1 (en) | 2013-05-02 |
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