JP2014528181A - 組み合わされたシリコン酸化膜エッチング及び汚染物除去プロセス - Google Patents
組み合わされたシリコン酸化膜エッチング及び汚染物除去プロセス Download PDFInfo
- Publication number
- JP2014528181A JP2014528181A JP2014533585A JP2014533585A JP2014528181A JP 2014528181 A JP2014528181 A JP 2014528181A JP 2014533585 A JP2014533585 A JP 2014533585A JP 2014533585 A JP2014533585 A JP 2014533585A JP 2014528181 A JP2014528181 A JP 2014528181A
- Authority
- JP
- Japan
- Prior art keywords
- etching
- oxide
- plasma
- substrate
- oxide material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 162
- 239000000356 contaminant Substances 0.000 title description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title description 4
- 229910052814 silicon oxide Inorganic materials 0.000 title description 2
- 239000000463 material Substances 0.000 claims abstract description 92
- 239000000758 substrate Substances 0.000 claims abstract description 67
- 238000005530 etching Methods 0.000 claims abstract description 37
- 238000001020 plasma etching Methods 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 10
- 239000007789 gas Substances 0.000 claims description 48
- 239000003575 carbonaceous material Substances 0.000 claims description 20
- 239000000126 substance Substances 0.000 claims description 15
- 239000011261 inert gas Substances 0.000 claims description 6
- 239000006227 byproduct Substances 0.000 claims description 5
- 239000002265 redox agent Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 description 54
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 239000000945 filler Substances 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000005202 decontamination Methods 0.000 description 2
- 230000003588 decontaminative effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 244000208734 Pisonia aculeata Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002090 carbon oxide Inorganic materials 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920003209 poly(hydridosilsesquioxane) Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000013515 script Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000000859 sublimation Methods 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31105—Etching inorganic layers
- H01L21/31111—Etching inorganic layers by chemical means
- H01L21/31116—Etching inorganic layers by chemical means by dry-etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Description
Claims (19)
- 半導体装置を形成する方法であって、
第1の材料、及び、該第1の材料によって吸蔵される第2の材料を含有する基板を提供するステップ、
第1のノンプラズマエッチングプロセスを使用して前記第1の材料をエッチングするステップであり、前記プロセスは、前記第2の材料をエッチングする速度と比較してより速いエッチング速度で前記第1の材料をエッチングして、前記第1の材料の少なくとも一部の上に重なる前記第2の材料を曝露する、ステップ、
反応性ガスを含有するプラズマを使用して前記第2の材料をエッチングして、前記第1の材料の少なくとも一部を曝露するステップ、及び、
第2のノンプラズマエッチングプロセスによって、前記第2の材料をエッチングすることにより曝露された前記第1の材料の少なくとも一部を含む前記第1の材料をエッチングするステップ、
を含む方法。 - 前記第2の材料が、前記第1の材料内で埋め込まれるか又は分散される、請求項1に記載の方法。
- 前記第2の材料が、前記第1の材料内で分散され、さらに、前記第1のノンプラズマエッチングの間に表面膜の中で集まる、請求項1に記載の方法。
- 前記第1のノンプラズマエッチングプロセス及び/又は前記第2のノンプラズマエッチングプロセスが、化学的酸化物除去プロセスである、請求項1に記載の方法。
- 前記反応性ガスが酸化還元剤を含み、該酸化還元剤は、N2、H2、O2、CO2及びNH3、並びにその組み合わせから成る群から選択される、請求項1に記載の方法。
- 前記反応性ガスが、不活性ガス及び/又はフッ化ガスをさらに含む、請求項5に記載の方法。
- 前記不活性ガスが、Ar、Ne及びNe、並びにその組み合わせから成る群から選択され、さらに、前記フッ化ガスが、CF4、CHF3、CH2F2及びCH3F、並びにその組み合わせから成る群から選択される、請求項6に記載の方法。
- 前記基板を加熱して、前記第1のノンプラズマエッチングプロセス及び/又は前記第2のノンプラズマエッチングプロセス間に前記基板の表面、及び/又は、前記第1の材料の表面上で形成された1つ又は複数の副産物材料を昇華させるステップ、
をさらに含む、請求項1に記載の方法。 - 前記第1の材料の深さを決定するステップ、及び
前記プラズマを使用して、前記第2の材料を選択的にさらにエッチングする、又は、前記第2のノンプラズマエッチングプロセスによって前記残りの第1の材料及び前記第1の材料を選択的にさらにエッチングするステップ、
をさらに含む、請求項1に記載の方法。 - 半導体装置を形成する方法であって、
酸化物材料、及び、該酸化物材料によって吸蔵される炭素材料を含有する基板を提供するステップ、
第1の化学的酸化物除去プロセスを使用して前記酸化物材料をエッチングするステップであり、前記プロセスは、前記炭素材料をエッチングする速度と比較してより速い速度で前記酸化物材料をエッチングして、前記酸化物材料の少なくとも一部の上に重なる前記炭素材料を曝露する、ステップ、
反応性ガスを含有するプラズマを使用して前記炭素材料をエッチングして、前記酸化物材料の少なくとも一部を曝露するステップ、及び、
第2の化学的酸化物除去プロセスによって、前記炭素材料をエッチングすることにより曝露された前記酸化物材料の少なくとも一部を含む前記酸化物材料をエッチングするステップ、
を含む方法。 - 前記炭素材料が、前記酸化物材料内で埋め込まれるか又は分散される、請求項10に記載の方法。
- 前記炭素材料が、前記酸化物材料内で分散され、さらに、前記第1の化学的酸化物除去プロセスの間に前記酸化物材料の表面上の炭素質の膜の中で集まる、請求項10に記載の方法。
- 前記反応性ガスが酸化還元剤を含み、該酸化還元剤は、N2、H2、O2、CO2及びNH3、並びにその組み合わせから成る群から選択される、請求項10に記載の方法。
- 前記反応性ガスが、不活性ガス及び/又はフッ化ガスをさらに含む、請求項13に記載の方法。
- 前記不活性ガスが、Ar、Ne及びNe、並びにその組み合わせから成る群から選択され、さらに、前記フッ化ガスが、CF4、CHF3、CH2F2及びCH3F、並びにその組み合わせから成る群から選択される、請求項14に記載の方法。
- 前記基板を加熱して、前記第1の化学的酸化物除去プロセス及び/又は前記第2の化学的酸化物除去プロセス間に前記基板の表面、及び/又は、前記酸化物層の表面上で形成された1つ又は複数の副産物材料を昇華させるステップ、
をさらに含む、請求項10に記載の方法。 - 半導体装置を形成する方法であって、
前記酸化物材料の深さを決定するステップ、及び
前記プラズマを使用して、前記炭素材料を選択的にさらにエッチングする、又は、前記第2の化学的酸化物除去プロセスによって前記残りの酸化物材料及び前記酸化物材料を選択的にさらにエッチングするステップ、
をさらに含む、請求項10に記載の方法。 - 半導体装置を形成する方法であって、
(a)酸化物材料、及び、吸蔵された炭素材料を有する基板を提供するステップ、
(b)ノンプラズマエッチングプロセスを使用して前記酸化物材料をエッチングするステップであり、前記プロセスは、前記炭素材料をエッチングする速度よりも速い速度で前記酸化物材料をエッチングして、前記炭素材料を曝露するように構成される、ステップ、
(c)反応性ガスを含むプラズマを使用して、前記曝露された炭素材料をエッチングするステップ、
(d)ノンプラズマエッチングプロセスを使用して、前記酸化物材料をエッチングするステップ、
(e)前記酸化物層の厚さを決定するステップ、並びに
(f)(1)前記決定された厚さが所定の前記酸化物材料の厚さと等しい場合にエッチングを終わらせるか、又は、(2)前記決定された厚さがほぼ前記所定の厚さになるまで(c)、(d)及び(e)を繰り返すステップ、
を含む方法。 - 前記炭素材料が前記酸化物材料内で分散され、さらに、前記ノンプラズマエッチングプロセス間に炭素質の膜の中で集まる、請求項18に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/250,960 US8664012B2 (en) | 2011-09-30 | 2011-09-30 | Combined silicon oxide etch and contamination removal process |
US13/250,960 | 2011-09-30 | ||
PCT/US2012/055288 WO2013048767A1 (en) | 2011-09-30 | 2012-09-14 | Combined silicon oxide etch and contamination removal process |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014528181A true JP2014528181A (ja) | 2014-10-23 |
JP5960270B2 JP5960270B2 (ja) | 2016-08-02 |
Family
ID=47992928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014533585A Active JP5960270B2 (ja) | 2011-09-30 | 2012-09-14 | 組み合わされたシリコン酸化膜エッチング及び汚染物除去プロセス |
Country Status (5)
Country | Link |
---|---|
US (1) | US8664012B2 (ja) |
JP (1) | JP5960270B2 (ja) |
KR (1) | KR101643830B1 (ja) |
TW (1) | TWI502640B (ja) |
WO (1) | WO2013048767A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016154209A (ja) * | 2015-02-16 | 2016-08-25 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
US10622205B2 (en) | 2015-02-16 | 2020-04-14 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
Families Citing this family (107)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9324576B2 (en) | 2010-05-27 | 2016-04-26 | Applied Materials, Inc. | Selective etch for silicon films |
US10283321B2 (en) | 2011-01-18 | 2019-05-07 | Applied Materials, Inc. | Semiconductor processing system and methods using capacitively coupled plasma |
US9064815B2 (en) | 2011-03-14 | 2015-06-23 | Applied Materials, Inc. | Methods for etch of metal and metal-oxide films |
US8999856B2 (en) | 2011-03-14 | 2015-04-07 | Applied Materials, Inc. | Methods for etch of sin films |
US9267739B2 (en) | 2012-07-18 | 2016-02-23 | Applied Materials, Inc. | Pedestal with multi-zone temperature control and multiple purge capabilities |
US9373517B2 (en) | 2012-08-02 | 2016-06-21 | Applied Materials, Inc. | Semiconductor processing with DC assisted RF power for improved control |
US9132436B2 (en) | 2012-09-21 | 2015-09-15 | Applied Materials, Inc. | Chemical control features in wafer process equipment |
US10256079B2 (en) | 2013-02-08 | 2019-04-09 | Applied Materials, Inc. | Semiconductor processing systems having multiple plasma configurations |
US9362130B2 (en) | 2013-03-01 | 2016-06-07 | Applied Materials, Inc. | Enhanced etching processes using remote plasma sources |
US9040422B2 (en) | 2013-03-05 | 2015-05-26 | Applied Materials, Inc. | Selective titanium nitride removal |
US20140271097A1 (en) | 2013-03-15 | 2014-09-18 | Applied Materials, Inc. | Processing systems and methods for halide scavenging |
US9493879B2 (en) | 2013-07-12 | 2016-11-15 | Applied Materials, Inc. | Selective sputtering for pattern transfer |
US9773648B2 (en) | 2013-08-30 | 2017-09-26 | Applied Materials, Inc. | Dual discharge modes operation for remote plasma |
US9576809B2 (en) | 2013-11-04 | 2017-02-21 | Applied Materials, Inc. | Etch suppression with germanium |
US9520303B2 (en) | 2013-11-12 | 2016-12-13 | Applied Materials, Inc. | Aluminum selective etch |
US9245762B2 (en) | 2013-12-02 | 2016-01-26 | Applied Materials, Inc. | Procedure for etch rate consistency |
US9499898B2 (en) | 2014-03-03 | 2016-11-22 | Applied Materials, Inc. | Layered thin film heater and method of fabrication |
US9299537B2 (en) | 2014-03-20 | 2016-03-29 | Applied Materials, Inc. | Radial waveguide systems and methods for post-match control of microwaves |
US9903020B2 (en) | 2014-03-31 | 2018-02-27 | Applied Materials, Inc. | Generation of compact alumina passivation layers on aluminum plasma equipment components |
US9309598B2 (en) | 2014-05-28 | 2016-04-12 | Applied Materials, Inc. | Oxide and metal removal |
US9496167B2 (en) | 2014-07-31 | 2016-11-15 | Applied Materials, Inc. | Integrated bit-line airgap formation and gate stack post clean |
US9659753B2 (en) | 2014-08-07 | 2017-05-23 | Applied Materials, Inc. | Grooved insulator to reduce leakage current |
US9553102B2 (en) | 2014-08-19 | 2017-01-24 | Applied Materials, Inc. | Tungsten separation |
US9478434B2 (en) | 2014-09-24 | 2016-10-25 | Applied Materials, Inc. | Chlorine-based hardmask removal |
US9613822B2 (en) | 2014-09-25 | 2017-04-04 | Applied Materials, Inc. | Oxide etch selectivity enhancement |
US9966240B2 (en) | 2014-10-14 | 2018-05-08 | Applied Materials, Inc. | Systems and methods for internal surface conditioning assessment in plasma processing equipment |
US9355922B2 (en) | 2014-10-14 | 2016-05-31 | Applied Materials, Inc. | Systems and methods for internal surface conditioning in plasma processing equipment |
US11637002B2 (en) | 2014-11-26 | 2023-04-25 | Applied Materials, Inc. | Methods and systems to enhance process uniformity |
US10573496B2 (en) | 2014-12-09 | 2020-02-25 | Applied Materials, Inc. | Direct outlet toroidal plasma source |
US10224210B2 (en) | 2014-12-09 | 2019-03-05 | Applied Materials, Inc. | Plasma processing system with direct outlet toroidal plasma source |
US9502258B2 (en) | 2014-12-23 | 2016-11-22 | Applied Materials, Inc. | Anisotropic gap etch |
US11257693B2 (en) | 2015-01-09 | 2022-02-22 | Applied Materials, Inc. | Methods and systems to improve pedestal temperature control |
US9728437B2 (en) | 2015-02-03 | 2017-08-08 | Applied Materials, Inc. | High temperature chuck for plasma processing systems |
US20160225652A1 (en) | 2015-02-03 | 2016-08-04 | Applied Materials, Inc. | Low temperature chuck for plasma processing systems |
US9881805B2 (en) | 2015-03-02 | 2018-01-30 | Applied Materials, Inc. | Silicon selective removal |
JP6555972B2 (ja) * | 2015-08-05 | 2019-08-07 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
US9741593B2 (en) | 2015-08-06 | 2017-08-22 | Applied Materials, Inc. | Thermal management systems and methods for wafer processing systems |
US9691645B2 (en) | 2015-08-06 | 2017-06-27 | Applied Materials, Inc. | Bolted wafer chuck thermal management systems and methods for wafer processing systems |
US9349605B1 (en) | 2015-08-07 | 2016-05-24 | Applied Materials, Inc. | Oxide etch selectivity systems and methods |
US10504700B2 (en) | 2015-08-27 | 2019-12-10 | Applied Materials, Inc. | Plasma etching systems and methods with secondary plasma injection |
US10504754B2 (en) | 2016-05-19 | 2019-12-10 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
US10522371B2 (en) | 2016-05-19 | 2019-12-31 | Applied Materials, Inc. | Systems and methods for improved semiconductor etching and component protection |
US9865484B1 (en) | 2016-06-29 | 2018-01-09 | Applied Materials, Inc. | Selective etch using material modification and RF pulsing |
US10062575B2 (en) | 2016-09-09 | 2018-08-28 | Applied Materials, Inc. | Poly directional etch by oxidation |
US10629473B2 (en) | 2016-09-09 | 2020-04-21 | Applied Materials, Inc. | Footing removal for nitride spacer |
US9721789B1 (en) | 2016-10-04 | 2017-08-01 | Applied Materials, Inc. | Saving ion-damaged spacers |
US10062585B2 (en) | 2016-10-04 | 2018-08-28 | Applied Materials, Inc. | Oxygen compatible plasma source |
US10546729B2 (en) | 2016-10-04 | 2020-01-28 | Applied Materials, Inc. | Dual-channel showerhead with improved profile |
US9934942B1 (en) | 2016-10-04 | 2018-04-03 | Applied Materials, Inc. | Chamber with flow-through source |
US10062579B2 (en) | 2016-10-07 | 2018-08-28 | Applied Materials, Inc. | Selective SiN lateral recess |
US9947549B1 (en) | 2016-10-10 | 2018-04-17 | Applied Materials, Inc. | Cobalt-containing material removal |
US9768034B1 (en) | 2016-11-11 | 2017-09-19 | Applied Materials, Inc. | Removal methods for high aspect ratio structures |
US10163696B2 (en) | 2016-11-11 | 2018-12-25 | Applied Materials, Inc. | Selective cobalt removal for bottom up gapfill |
US10242908B2 (en) | 2016-11-14 | 2019-03-26 | Applied Materials, Inc. | Airgap formation with damage-free copper |
US10026621B2 (en) | 2016-11-14 | 2018-07-17 | Applied Materials, Inc. | SiN spacer profile patterning |
JP6726610B2 (ja) * | 2016-12-13 | 2020-07-22 | 東京エレクトロン株式会社 | エッチング方法及び基板処理システム |
US10566206B2 (en) | 2016-12-27 | 2020-02-18 | Applied Materials, Inc. | Systems and methods for anisotropic material breakthrough |
US10403507B2 (en) | 2017-02-03 | 2019-09-03 | Applied Materials, Inc. | Shaped etch profile with oxidation |
US10431429B2 (en) | 2017-02-03 | 2019-10-01 | Applied Materials, Inc. | Systems and methods for radial and azimuthal control of plasma uniformity |
US10043684B1 (en) | 2017-02-06 | 2018-08-07 | Applied Materials, Inc. | Self-limiting atomic thermal etching systems and methods |
US10319739B2 (en) | 2017-02-08 | 2019-06-11 | Applied Materials, Inc. | Accommodating imperfectly aligned memory holes |
US10943834B2 (en) | 2017-03-13 | 2021-03-09 | Applied Materials, Inc. | Replacement contact process |
US10319649B2 (en) | 2017-04-11 | 2019-06-11 | Applied Materials, Inc. | Optical emission spectroscopy (OES) for remote plasma monitoring |
US11276559B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Semiconductor processing chamber for multiple precursor flow |
US11276590B2 (en) | 2017-05-17 | 2022-03-15 | Applied Materials, Inc. | Multi-zone semiconductor substrate supports |
US10049891B1 (en) | 2017-05-31 | 2018-08-14 | Applied Materials, Inc. | Selective in situ cobalt residue removal |
US10497579B2 (en) | 2017-05-31 | 2019-12-03 | Applied Materials, Inc. | Water-free etching methods |
US10920320B2 (en) | 2017-06-16 | 2021-02-16 | Applied Materials, Inc. | Plasma health determination in semiconductor substrate processing reactors |
US10541246B2 (en) | 2017-06-26 | 2020-01-21 | Applied Materials, Inc. | 3D flash memory cells which discourage cross-cell electrical tunneling |
US10727080B2 (en) | 2017-07-07 | 2020-07-28 | Applied Materials, Inc. | Tantalum-containing material removal |
US10541184B2 (en) | 2017-07-11 | 2020-01-21 | Applied Materials, Inc. | Optical emission spectroscopic techniques for monitoring etching |
US10354889B2 (en) | 2017-07-17 | 2019-07-16 | Applied Materials, Inc. | Non-halogen etching of silicon-containing materials |
US10043674B1 (en) | 2017-08-04 | 2018-08-07 | Applied Materials, Inc. | Germanium etching systems and methods |
US10170336B1 (en) | 2017-08-04 | 2019-01-01 | Applied Materials, Inc. | Methods for anisotropic control of selective silicon removal |
US10297458B2 (en) | 2017-08-07 | 2019-05-21 | Applied Materials, Inc. | Process window widening using coated parts in plasma etch processes |
US10128086B1 (en) | 2017-10-24 | 2018-11-13 | Applied Materials, Inc. | Silicon pretreatment for nitride removal |
US10283324B1 (en) | 2017-10-24 | 2019-05-07 | Applied Materials, Inc. | Oxygen treatment for nitride etching |
CN107845574B (zh) * | 2017-10-31 | 2018-11-23 | 长鑫存储技术有限公司 | 半导体上刻蚀去除氧化物的方法 |
US10256112B1 (en) | 2017-12-08 | 2019-04-09 | Applied Materials, Inc. | Selective tungsten removal |
US10903054B2 (en) | 2017-12-19 | 2021-01-26 | Applied Materials, Inc. | Multi-zone gas distribution systems and methods |
US11328909B2 (en) | 2017-12-22 | 2022-05-10 | Applied Materials, Inc. | Chamber conditioning and removal processes |
US10854426B2 (en) | 2018-01-08 | 2020-12-01 | Applied Materials, Inc. | Metal recess for semiconductor structures |
US10964512B2 (en) | 2018-02-15 | 2021-03-30 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus and methods |
US10679870B2 (en) | 2018-02-15 | 2020-06-09 | Applied Materials, Inc. | Semiconductor processing chamber multistage mixing apparatus |
US10714319B2 (en) | 2018-02-21 | 2020-07-14 | Applied Materials, Inc. | Apparatus and methods for removing contaminant particles in a plasma process |
TWI716818B (zh) | 2018-02-28 | 2021-01-21 | 美商應用材料股份有限公司 | 形成氣隙的系統及方法 |
US10593560B2 (en) | 2018-03-01 | 2020-03-17 | Applied Materials, Inc. | Magnetic induction plasma source for semiconductor processes and equipment |
US10319600B1 (en) | 2018-03-12 | 2019-06-11 | Applied Materials, Inc. | Thermal silicon etch |
US10497573B2 (en) | 2018-03-13 | 2019-12-03 | Applied Materials, Inc. | Selective atomic layer etching of semiconductor materials |
US10573527B2 (en) | 2018-04-06 | 2020-02-25 | Applied Materials, Inc. | Gas-phase selective etching systems and methods |
US10490406B2 (en) | 2018-04-10 | 2019-11-26 | Appled Materials, Inc. | Systems and methods for material breakthrough |
US10699879B2 (en) | 2018-04-17 | 2020-06-30 | Applied Materials, Inc. | Two piece electrode assembly with gap for plasma control |
JP7137959B2 (ja) * | 2018-04-20 | 2022-09-15 | 株式会社Screenホールディングス | 基板処理方法および基板処理装置 |
US10886137B2 (en) | 2018-04-30 | 2021-01-05 | Applied Materials, Inc. | Selective nitride removal |
US10755941B2 (en) | 2018-07-06 | 2020-08-25 | Applied Materials, Inc. | Self-limiting selective etching systems and methods |
US10872778B2 (en) | 2018-07-06 | 2020-12-22 | Applied Materials, Inc. | Systems and methods utilizing solid-phase etchants |
US10672642B2 (en) | 2018-07-24 | 2020-06-02 | Applied Materials, Inc. | Systems and methods for pedestal configuration |
US11049755B2 (en) | 2018-09-14 | 2021-06-29 | Applied Materials, Inc. | Semiconductor substrate supports with embedded RF shield |
US10892198B2 (en) | 2018-09-14 | 2021-01-12 | Applied Materials, Inc. | Systems and methods for improved performance in semiconductor processing |
US11062887B2 (en) | 2018-09-17 | 2021-07-13 | Applied Materials, Inc. | High temperature RF heater pedestals |
US11417534B2 (en) | 2018-09-21 | 2022-08-16 | Applied Materials, Inc. | Selective material removal |
US11682560B2 (en) | 2018-10-11 | 2023-06-20 | Applied Materials, Inc. | Systems and methods for hafnium-containing film removal |
US11121002B2 (en) | 2018-10-24 | 2021-09-14 | Applied Materials, Inc. | Systems and methods for etching metals and metal derivatives |
US11437242B2 (en) | 2018-11-27 | 2022-09-06 | Applied Materials, Inc. | Selective removal of silicon-containing materials |
US11721527B2 (en) | 2019-01-07 | 2023-08-08 | Applied Materials, Inc. | Processing chamber mixing systems |
US10920319B2 (en) | 2019-01-11 | 2021-02-16 | Applied Materials, Inc. | Ceramic showerheads with conductive electrodes |
JP2020123672A (ja) * | 2019-01-30 | 2020-08-13 | 東京エレクトロン株式会社 | 基板処理装置の制御方法、基板処理装置及びクラスタシステム |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059735A (ja) * | 2005-08-26 | 2007-03-08 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
JP2007227691A (ja) * | 2006-02-24 | 2007-09-06 | Sony Corp | 基板処理方法および基板処理装置 |
US20110053380A1 (en) * | 2009-08-31 | 2011-03-03 | Applied Materials, Inc. | Silicon-selective dry etch for carbon-containing films |
US20110124144A1 (en) * | 2009-03-17 | 2011-05-26 | Roth & Rau Ag | Substrate processing system and substrate processing method |
US20130023122A1 (en) * | 2011-07-20 | 2013-01-24 | Nemani Srinivas D | Method of multiple patterning of a low-k dielectric film |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6087267A (en) | 1986-03-04 | 2000-07-11 | Motorola, Inc. | Process for forming an integrated circuit |
JPH09190979A (ja) | 1996-01-10 | 1997-07-22 | Nec Corp | 選択シリコンエピタキシャル成長方法及び成長装置 |
US6423646B1 (en) | 1998-06-04 | 2002-07-23 | Vanguard International Semiconductor Corporation | Method for removing etch-induced polymer film and damaged silicon layer from a silicon surface |
US6214736B1 (en) | 1998-10-15 | 2001-04-10 | Texas Instruments Incorporated | Silicon processing method |
TW460617B (en) * | 1998-11-06 | 2001-10-21 | United Microelectronics Corp | Method for removing carbon contamination on surface of semiconductor substrate |
EP1266883A4 (en) * | 2000-03-03 | 2005-02-23 | Teijin Ltd | PROCESS FOR THE PRODUCTION OF AN AROMATIC CARBONATE |
US6716766B2 (en) | 2002-08-22 | 2004-04-06 | Micron Technology, Inc. | Process variation resistant self aligned contact etch |
US6790733B1 (en) * | 2003-03-28 | 2004-09-14 | International Business Machines Corporation | Preserving TEOS hard mask using COR for raised source-drain including removable/disposable spacer |
US7625603B2 (en) | 2003-11-14 | 2009-12-01 | Robert Bosch Gmbh | Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics |
US8486845B2 (en) * | 2005-03-21 | 2013-07-16 | Tokyo Electron Limited | Plasma enhanced atomic layer deposition system and method |
JP4343875B2 (ja) | 2005-06-08 | 2009-10-14 | Tdk株式会社 | エッチング量計測装置、エッチング装置及びエッチング量計測方法 |
JP4788415B2 (ja) * | 2006-03-15 | 2011-10-05 | ソニー株式会社 | 半導体装置の製造方法 |
US20080009139A1 (en) | 2006-07-05 | 2008-01-10 | Thomas Hecht | Structure in a substrate for the manufacturing of a semiconductor device and process for manufacturing of a semiconductor device |
US20090151870A1 (en) * | 2007-12-14 | 2009-06-18 | Tokyo Electron Limited | Silicon carbide focus ring for plasma etching system |
US20090233447A1 (en) | 2008-03-11 | 2009-09-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Control wafer reclamation process |
US8501629B2 (en) | 2009-12-23 | 2013-08-06 | Applied Materials, Inc. | Smooth SiConi etch for silicon-containing films |
-
2011
- 2011-09-30 US US13/250,960 patent/US8664012B2/en active Active
-
2012
- 2012-09-14 JP JP2014533585A patent/JP5960270B2/ja active Active
- 2012-09-14 WO PCT/US2012/055288 patent/WO2013048767A1/en active Application Filing
- 2012-09-14 KR KR1020147011577A patent/KR101643830B1/ko active IP Right Grant
- 2012-09-27 TW TW101135634A patent/TWI502640B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059735A (ja) * | 2005-08-26 | 2007-03-08 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
JP2007227691A (ja) * | 2006-02-24 | 2007-09-06 | Sony Corp | 基板処理方法および基板処理装置 |
US20110124144A1 (en) * | 2009-03-17 | 2011-05-26 | Roth & Rau Ag | Substrate processing system and substrate processing method |
US20110053380A1 (en) * | 2009-08-31 | 2011-03-03 | Applied Materials, Inc. | Silicon-selective dry etch for carbon-containing films |
US20130023122A1 (en) * | 2011-07-20 | 2013-01-24 | Nemani Srinivas D | Method of multiple patterning of a low-k dielectric film |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016154209A (ja) * | 2015-02-16 | 2016-08-25 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
US10622205B2 (en) | 2015-02-16 | 2020-04-14 | Tokyo Electron Limited | Substrate processing method and substrate processing apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR101643830B1 (ko) | 2016-08-10 |
JP5960270B2 (ja) | 2016-08-02 |
TWI502640B (zh) | 2015-10-01 |
KR20140069323A (ko) | 2014-06-09 |
TW201318057A (zh) | 2013-05-01 |
US20130084654A1 (en) | 2013-04-04 |
WO2013048767A1 (en) | 2013-04-04 |
US8664012B2 (en) | 2014-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5960270B2 (ja) | 組み合わされたシリコン酸化膜エッチング及び汚染物除去プロセス | |
JP7008918B2 (ja) | 選択的窒化シリコンエッチングの方法 | |
JP5728221B2 (ja) | 基板処理方法及び記憶媒体 | |
TW201836010A (zh) | 使用六氟化硫之優先氮化矽蝕刻方法 | |
TWI680499B (zh) | 側壁影像轉移方法 | |
JP4968861B2 (ja) | 基板のエッチング方法及びシステム | |
JP5701654B2 (ja) | 基板処理方法 | |
KR100716689B1 (ko) | 높은 k 값의 게이트 유전체를 갖는 반도체 장치를제조하는 선택적 에칭 공정 | |
US20170345673A1 (en) | Method of selective silicon oxide etching | |
JP2009094307A (ja) | エッチング方法及び記録媒体 | |
TWI576907B (zh) | Substrate handling method | |
JP5074009B2 (ja) | 高アスペクト比の開口を有するシリコン構造体用エッチングマスクの製造方法及びその装置並びにその製造プログラム | |
JP5177997B2 (ja) | 高アスペクト比の開口を有するシリコン構造体、その製造方法、その製造装置、及びその製造プログラム | |
TWI528450B (zh) | Substrate processing methods and memory media | |
JP5443937B2 (ja) | シリコン構造体の製造方法及びその製造装置並びにその製造プログラム | |
JP7257883B2 (ja) | プラズマ処理方法およびプラズマ処理装置 | |
TWI841579B (zh) | 電漿處理方法及電漿處理裝置 | |
JP2006156992A (ja) | プラズマ処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140328 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150319 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150324 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150521 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20160202 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160428 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20160512 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160531 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160622 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5960270 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |