JP2014527298A - ｐＨ値が３．０〜５．５であるＣＭＰ組成物の存在下で元素状ゲルマニウム及び／又はＳｉ１−ｘＧｅｘ製の材料を化学機械研磨することを含む半導体装置の製造方法 - Google Patents

ｐＨ値が３．０〜５．５であるＣＭＰ組成物の存在下で元素状ゲルマニウム及び／又はＳｉ１−ｘＧｅｘ製の材料を化学機械研磨することを含む半導体装置の製造方法 Download PDF

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Publication number
JP2014527298A
JP2014527298A JP2014523428A JP2014523428A JP2014527298A JP 2014527298 A JP2014527298 A JP 2014527298A JP 2014523428 A JP2014523428 A JP 2014523428A JP 2014523428 A JP2014523428 A JP 2014523428A JP 2014527298 A JP2014527298 A JP 2014527298A
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Japan
Prior art keywords
cmp composition
particles
mass
cmp
germanium
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Japanese (ja)
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JP2014527298A5 (https=
Inventor
マルテン ノラー，バスティアン
ドレシャー，ベッティナ
ジロー，クリストフ
リー，ユーチョウ
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BASF SE
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BASF SE
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Publication of JP2014527298A5 publication Critical patent/JP2014527298A5/ja
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/129—Preparing bulk and homogeneous wafers by polishing

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2014523428A 2011-08-01 2012-07-30 ｐＨ値が３．０〜５．５であるＣＭＰ組成物の存在下で元素状ゲルマニウム及び／又はＳｉ１−ｘＧｅｘ製の材料を化学機械研磨することを含む半導体装置の製造方法 Withdrawn JP2014527298A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161513691P 2011-08-01 2011-08-01
US61/513,691 2011-08-01
PCT/IB2012/053878 WO2013018016A2 (en) 2011-08-01 2012-07-30 A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING OF ELEMENTAL GERMANIUM AND/OR Si1-XGeX MATERIAL IN THE PRESENCE OF A CMP COMPOSITION HAVING A pH VALUE OF 3.0 TO 5.5

Publications (2)

Publication Number Publication Date
JP2014527298A true JP2014527298A (ja) 2014-10-09
JP2014527298A5 JP2014527298A5 (https=) 2015-09-10

Family

ID=47629745

Family Applications (1)

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JP2014523428A Withdrawn JP2014527298A (ja) 2011-08-01 2012-07-30 ｐＨ値が３．０〜５．５であるＣＭＰ組成物の存在下で元素状ゲルマニウム及び／又はＳｉ１−ｘＧｅｘ製の材料を化学機械研磨することを含む半導体装置の製造方法

Country Status (9)

Country Link
US (1) US20140199841A1 (https=)
EP (1) EP2741892A4 (https=)
JP (1) JP2014527298A (https=)
KR (1) KR20140071353A (https=)
CN (1) CN103717351A (https=)
IN (1) IN2014CN01603A (https=)
RU (1) RU2014107762A (https=)
TW (1) TW201311842A (https=)
WO (1) WO2013018016A2 (https=)

Cited By (4)

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JP2018026537A (ja) * 2016-07-29 2018-02-15 芝浦メカトロニクス株式会社 処理液生成装置及びそれを用いた基板処理装置
KR20220149434A (ko) 2021-04-30 2022-11-08 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마 방법 및 연마 완료 기판의 제조 방법
JP2022171565A (ja) * 2021-04-30 2022-11-11 株式会社フジミインコーポレーテッド 研磨用組成物、研磨方法および研磨済基板の製造方法
US11670522B2 (en) 2016-07-29 2023-06-06 Shibaura Mechatronics Corporation Processing liquid generator and substrate processing apparatus using the same

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US9238755B2 (en) * 2011-11-25 2016-01-19 Fujima Incorporated Polishing composition
WO2013157442A1 (ja) * 2012-04-18 2013-10-24 株式会社フジミインコーポレーテッド 研磨用組成物
EP2810997A1 (en) 2013-06-05 2014-12-10 Basf Se A chemical mechanical polishing (cmp) composition
JP2018506176A (ja) 2014-12-16 2018-03-01 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ ゲルマニウムを含む基板の高効率研磨のための化学機械研磨（ｃｍｐ）組成物
US10570313B2 (en) * 2015-02-12 2020-02-25 Versum Materials Us, Llc Dishing reducing in tungsten chemical mechanical polishing
US9916985B2 (en) 2015-10-14 2018-03-13 International Business Machines Corporation Indium phosphide smoothing and chemical mechanical planarization processes
US9646842B1 (en) 2015-10-14 2017-05-09 International Business Machines Corporation Germanium smoothing and chemical mechanical planarization processes
US9646841B1 (en) 2015-10-14 2017-05-09 International Business Machines Corporation Group III arsenide material smoothing and chemical mechanical planarization processes
TWI821407B (zh) 2018-09-28 2023-11-11 日商福吉米股份有限公司 研磨用組合物、研磨方法及基板之製造方法
JP7638667B2 (ja) 2019-11-20 2025-03-04 株式会社フジミインコーポレーテッド 研磨組成物、研磨方法および基板の製造方法

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US3429080A (en) * 1966-05-02 1969-02-25 Tizon Chem Corp Composition for polishing crystalline silicon and germanium and process
JP3027551B2 (ja) * 1997-07-03 2000-04-04 キヤノン株式会社 基板保持装置ならびに該基板保持装置を用いた研磨方法および研磨装置
FR2773177B1 (fr) * 1997-12-29 2000-03-17 France Telecom Procede d'obtention d'une couche de germanium ou silicium monocristallin sur un substrat de silicium ou germanium monocristallin, respectivement, et produits multicouches obtenus
JP4090589B2 (ja) * 1998-09-01 2008-05-28 株式会社フジミインコーポレーテッド 研磨用組成物
US6270395B1 (en) * 1998-09-24 2001-08-07 Alliedsignal, Inc. Oxidizing polishing slurries for low dielectric constant materials
US6890835B1 (en) * 2000-10-19 2005-05-10 International Business Machines Corporation Layer transfer of low defect SiGe using an etch-back process
EP1566420A1 (en) * 2004-01-23 2005-08-24 JSR Corporation Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US6893936B1 (en) * 2004-06-29 2005-05-17 International Business Machines Corporation Method of Forming strained SI/SIGE on insulator with silicon germanium buffer
CN1300271C (zh) * 2004-09-24 2007-02-14 中国科学院上海微系统与信息技术研究所 硫系化合物相变材料化学机械抛光的纳米抛光液及其应用
CN100335581C (zh) * 2004-11-24 2007-09-05 中国科学院上海微系统与信息技术研究所 硫系相变材料化学机械抛光的无磨料抛光液及其应用
TWI402335B (zh) * 2006-09-08 2013-07-21 Kao Corp 研磨液組合物
US7678605B2 (en) * 2007-08-30 2010-03-16 Dupont Air Products Nanomaterials Llc Method for chemical mechanical planarization of chalcogenide materials
FR2932108B1 (fr) * 2008-06-10 2019-07-05 Soitec Polissage de couches de germanium
CN101372606B (zh) * 2008-10-14 2013-04-17 中国科学院上海微系统与信息技术研究所 用氧化铈化学机械抛光液抛光硫系化合物相变材料的方法
US8110483B2 (en) * 2009-10-22 2012-02-07 International Business Machines Corporation Forming an extremely thin semiconductor-on-insulator (ETSOI) layer

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018026537A (ja) * 2016-07-29 2018-02-15 芝浦メカトロニクス株式会社 処理液生成装置及びそれを用いた基板処理装置
US11670522B2 (en) 2016-07-29 2023-06-06 Shibaura Mechatronics Corporation Processing liquid generator and substrate processing apparatus using the same
KR20220149434A (ko) 2021-04-30 2022-11-08 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물, 연마 방법 및 연마 완료 기판의 제조 방법
JP2022171565A (ja) * 2021-04-30 2022-11-11 株式会社フジミインコーポレーテッド 研磨用組成物、研磨方法および研磨済基板の製造方法
US12590225B2 (en) 2021-04-30 2026-03-31 Fujimi Incorporated Polishing composition, polishing method, and method for producing polished substrate

Also Published As

Publication number Publication date
WO2013018016A3 (en) 2013-03-28
RU2014107762A (ru) 2015-09-10
KR20140071353A (ko) 2014-06-11
TW201311842A (zh) 2013-03-16
EP2741892A4 (en) 2015-03-18
US20140199841A1 (en) 2014-07-17
CN103717351A (zh) 2014-04-09
EP2741892A2 (en) 2014-06-18
IN2014CN01603A (https=) 2015-05-08
WO2013018016A2 (en) 2013-02-07

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