IN2014CN01603A - - Google Patents

Info

Publication number
IN2014CN01603A
IN2014CN01603A IN1603CHN2014A IN2014CN01603A IN 2014CN01603 A IN2014CN01603 A IN 2014CN01603A IN 1603CHN2014 A IN1603CHN2014 A IN 1603CHN2014A IN 2014CN01603 A IN2014CN01603 A IN 2014CN01603A
Authority
IN
India
Prior art keywords
mechanical polishing
chemical mechanical
xxa
cmp
composite
Prior art date
Application number
Inventor
Bastian Marten Noller
Bettina Drescher
Christophe Gillot
Original Assignee
Basf Se
Ning Gao
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Basf Se, Ning Gao filed Critical Basf Se
Publication of IN2014CN01603A publication Critical patent/IN2014CN01603A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

1 xxA process for the manufacture of semiconductor devices comprising the chemical mechanical polishing of elemental germanium and/or SiGe material with 0.1 = x < 1 in the presence of a chemical mechanical polishing (CMP) composition having a pH value in the range of from 3.0 to 5.5 and comprising: (A) inorganic particles organic particles or a mixture or composite thereof (B) at least one type of an oxidizing agent and (C) an aqueous medium.
IN1603CHN2014 2011-08-01 2012-07-30 IN2014CN01603A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161513691P 2011-08-01 2011-08-01
PCT/IB2012/053878 WO2013018016A2 (en) 2011-08-01 2012-07-30 A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING OF ELEMENTAL GERMANIUM AND/OR Si1-XGeX MATERIAL IN THE PRESENCE OF A CMP COMPOSITION HAVING A pH VALUE OF 3.0 TO 5.5

Publications (1)

Publication Number Publication Date
IN2014CN01603A true IN2014CN01603A (en) 2015-05-08

Family

ID=47629745

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1603CHN2014 IN2014CN01603A (en) 2011-08-01 2012-07-30

Country Status (9)

Country Link
US (1) US20140199841A1 (en)
EP (1) EP2741892A4 (en)
JP (1) JP2014527298A (en)
KR (1) KR20140071353A (en)
CN (1) CN103717351A (en)
IN (1) IN2014CN01603A (en)
RU (1) RU2014107762A (en)
TW (1) TW201311842A (en)
WO (1) WO2013018016A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102028217B1 (en) * 2011-11-25 2019-10-02 가부시키가이샤 후지미인코퍼레이티드 Polishing composition
KR20150014924A (en) * 2012-04-18 2015-02-09 가부시키가이샤 후지미인코퍼레이티드 Polishing composition
EP2810997A1 (en) 2013-06-05 2014-12-10 Basf Se A chemical mechanical polishing (cmp) composition
KR20240141863A (en) 2014-12-16 2024-09-27 바스프 에스이 Chemical mechanical polishing (cmp) composition for high effective polishing of substrates comprising germanium
US10570313B2 (en) * 2015-02-12 2020-02-25 Versum Materials Us, Llc Dishing reducing in tungsten chemical mechanical polishing
US9646841B1 (en) 2015-10-14 2017-05-09 International Business Machines Corporation Group III arsenide material smoothing and chemical mechanical planarization processes
US9916985B2 (en) 2015-10-14 2018-03-13 International Business Machines Corporation Indium phosphide smoothing and chemical mechanical planarization processes
US9646842B1 (en) 2015-10-14 2017-05-09 International Business Machines Corporation Germanium smoothing and chemical mechanical planarization processes
US11670522B2 (en) 2016-07-29 2023-06-06 Shibaura Mechatronics Corporation Processing liquid generator and substrate processing apparatus using the same
JP6918600B2 (en) * 2016-07-29 2021-08-11 芝浦メカトロニクス株式会社 Processing liquid generator and substrate processing equipment using it
TWI821407B (en) 2018-09-28 2023-11-11 日商福吉米股份有限公司 Polishing composition, polishing method, and method of producing substrate
US20220348791A1 (en) 2021-04-30 2022-11-03 Fujimi Incorporated Polishing composition, polishing method, and method for producing polished substrate

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3429080A (en) * 1966-05-02 1969-02-25 Tizon Chem Corp Composition for polishing crystalline silicon and germanium and process
JP3027551B2 (en) * 1997-07-03 2000-04-04 キヤノン株式会社 Substrate holding device, polishing method and polishing device using the substrate holding device
FR2773177B1 (en) * 1997-12-29 2000-03-17 France Telecom PROCESS FOR OBTAINING A SINGLE-CRYSTAL GERMANIUM OR SILICON LAYER ON A SILICON OR SINGLE-CRYSTAL GERMANIUM SUBSTRATE, RESPECTIVELY, AND MULTILAYER PRODUCTS OBTAINED
JP4090589B2 (en) * 1998-09-01 2008-05-28 株式会社フジミインコーポレーテッド Polishing composition
US6270395B1 (en) * 1998-09-24 2001-08-07 Alliedsignal, Inc. Oxidizing polishing slurries for low dielectric constant materials
US6890835B1 (en) * 2000-10-19 2005-05-10 International Business Machines Corporation Layer transfer of low defect SiGe using an etch-back process
EP1566420A1 (en) * 2004-01-23 2005-08-24 JSR Corporation Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US6893936B1 (en) * 2004-06-29 2005-05-17 International Business Machines Corporation Method of Forming strained SI/SIGE on insulator with silicon germanium buffer
CN1300271C (en) * 2004-09-24 2007-02-14 中国科学院上海微系统与信息技术研究所 Nano polishing liquid for sulfuric compound phase changing material chemical mechanical polishing and its use
CN100335581C (en) * 2004-11-24 2007-09-05 中国科学院上海微系统与信息技术研究所 Sulphurs phase-change material chemically machinery polished non-abrasive polishing liquid and its use
TWI402335B (en) * 2006-09-08 2013-07-21 Kao Corp Polishing composition
US7678605B2 (en) * 2007-08-30 2010-03-16 Dupont Air Products Nanomaterials Llc Method for chemical mechanical planarization of chalcogenide materials
FR2932108B1 (en) * 2008-06-10 2019-07-05 Soitec POLISHING GERMANIUM LAYERS
CN101372606B (en) * 2008-10-14 2013-04-17 中国科学院上海微系统与信息技术研究所 Method for polishing sulfur compound phase-change material by cerium oxide chemico-mechanical polishing solution
US8110483B2 (en) * 2009-10-22 2012-02-07 International Business Machines Corporation Forming an extremely thin semiconductor-on-insulator (ETSOI) layer

Also Published As

Publication number Publication date
JP2014527298A (en) 2014-10-09
WO2013018016A2 (en) 2013-02-07
KR20140071353A (en) 2014-06-11
WO2013018016A3 (en) 2013-03-28
RU2014107762A (en) 2015-09-10
CN103717351A (en) 2014-04-09
EP2741892A2 (en) 2014-06-18
TW201311842A (en) 2013-03-16
EP2741892A4 (en) 2015-03-18
US20140199841A1 (en) 2014-07-17

Similar Documents

Publication Publication Date Title
IN2014CN01603A (en)
EP2742103A4 (en) A PROCESS FOR THE MANUFACTURE OF SEMICONDUCTOR DEVICES COMPRISING THE CHEMICAL MECHANICAL POLISHING OF ELEMENTAL GERMANIUM AND/OR Si1-xGex MATERIAL IN THE PRESENCE OF A CMP COMPOSITION COMPRISING A SPECIFIC ORGANIC COMPOUND
IN2014MN01779A (en)
WO2016069569A3 (en) Serine proteases
WO2015143360A3 (en) Serine proteases of bacillus species
GB201212098D0 (en) New cleaning material
MX2016004260A (en) Benefit agent containing delivery particle based on styrene maleic anhydride copolymer.
WO2014167358A3 (en) Method for treating a substrate made of animal fibers with solid particles and a chemical formulation comprising a colourant
WO2016069548A3 (en) Serine proteases
CA2910399C (en) Phytoglycogen nanoparticles and methods of manufacture thereof
MX2013002258A (en) Alkoxy carboxylate surfactants.
MY170292A (en) Chemical mechanical polishing composition comprising non-ionic surfactant and an aromatic compound comprising at least one acid group
PH12018502590A1 (en) Method for manufacturing briquettes containing a calcium-magnesium compound and an iron-based compound, and briquettes obtained thereby
MY176981A (en) Chemical mechanical polishing composition comprising non-ionic suirfactant and carbonate salt
MY171093A (en) Chemical mechanical polishing (cmp) composition comprising a protein
MX346364B (en) Porous inorganic oxide particles and methods of making and using the same.
PH12014501731A1 (en) Low dielectric photoimageable compositions and electronic devices made therefrom
WO2012103091A3 (en) Abrasive free silicon chemical mechanical planarization
AR085994A1 (en) HYDROPHOBIC FUNCTIONED PARTICLES
DOP2016000083A (en) MINERAL LIXIVIATION
EP2852644A4 (en) A process for the manufacture of semiconductor devices comprising the chemical mechanical polishing (cmp) of iii-v material in the presence of a cmp composition comprising a specific non-ionic surfactant
WO2013108041A3 (en) Process and method for the treatment of materials, materials thus obtained and uses of these materials
MY175060A (en) Method for processing rubber granules or rubber powders
MX364245B (en) Methods and compositions comprising cement kiln dust having an altered particle size.
MX2014015839A (en) Biodegradable organophilic clays for drilling fluids.