JP2014522098A5 - - Google Patents

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Publication number
JP2014522098A5
JP2014522098A5 JP2014502748A JP2014502748A JP2014522098A5 JP 2014522098 A5 JP2014522098 A5 JP 2014522098A5 JP 2014502748 A JP2014502748 A JP 2014502748A JP 2014502748 A JP2014502748 A JP 2014502748A JP 2014522098 A5 JP2014522098 A5 JP 2014522098A5
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JP
Japan
Prior art keywords
iii nitride
containing surface
group iii
softened
slurry composition
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JP2014502748A
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English (en)
Japanese (ja)
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JP2014522098A (ja
JP6087900B2 (ja
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Priority claimed from US13/073,582 external-priority patent/US8828874B2/en
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Publication of JP2014522098A publication Critical patent/JP2014522098A/ja
Publication of JP2014522098A5 publication Critical patent/JP2014522098A5/ja
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Publication of JP6087900B2 publication Critical patent/JP6087900B2/ja
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JP2014502748A 2011-03-28 2012-03-28 Ｉｉｉ族窒化物表面の化学機械研磨方法 Active JP6087900B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/073,582 2011-03-28
US13/073,582 US8828874B2 (en) 2011-03-28 2011-03-28 Chemical mechanical polishing of group III-nitride surfaces
PCT/US2012/030944 WO2012135342A1 (en) 2011-03-28 2012-03-28 Chemical mechanical polishing of group iii-nitride surfaces

Publications (3)

Publication Number Publication Date
JP2014522098A JP2014522098A (ja) 2014-08-28
JP2014522098A5 true JP2014522098A5 (enExample) 2014-12-18
JP6087900B2 JP6087900B2 (ja) 2017-03-01

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ID=45953264

Family Applications (1)

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JP2014502748A Active JP6087900B2 (ja) 2011-03-28 2012-03-28 Ｉｉｉ族窒化物表面の化学機械研磨方法

Country Status (4)

Country Link
US (1) US8828874B2 (enExample)
JP (1) JP6087900B2 (enExample)
KR (1) KR101608932B1 (enExample)
WO (1) WO2012135342A1 (enExample)

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Publication number Priority date Publication date Assignee Title
CN103890127B (zh) * 2011-10-13 2015-09-09 三井金属矿业株式会社 研磨剂浆料及研磨方法
KR20150008442A (ko) * 2012-05-07 2015-01-22 바스프 에스이 반도체 소자의 제조 방법
US9259818B2 (en) * 2012-11-06 2016-02-16 Sinmat, Inc. Smooth diamond surfaces and CMP method for forming
US8920667B2 (en) * 2013-01-30 2014-12-30 Cabot Microelectronics Corporation Chemical-mechanical polishing composition containing zirconia and metal oxidizer
JP6130316B2 (ja) * 2014-03-11 2017-05-17 信越化学工業株式会社 研磨組成物及び研磨方法並びに研磨組成物の製造方法
US9567492B2 (en) * 2014-08-28 2017-02-14 Sinmat, Inc. Polishing of hard substrates with soft-core composite particles
KR20190091579A (ko) * 2015-01-12 2019-08-06 버슘머트리얼즈 유에스, 엘엘씨 화학적 기계적 평탄화 조성물용 복합 연마 입자 및 이를 사용하는 방법
CN109715751A (zh) * 2016-09-23 2019-05-03 圣戈本陶瓷及塑料股份有限公司 化学机械平坦化浆料及其形成方法
US11078380B2 (en) 2017-07-10 2021-08-03 Entegris, Inc. Hard abrasive particle-free polishing of hard materials
JP6780800B1 (ja) * 2020-04-09 2020-11-04 信越半導体株式会社 ウェーハの研磨方法及び研磨装置
JP7165858B2 (ja) * 2020-06-30 2022-11-07 日亜化学工業株式会社 発光素子の製造方法
KR20250151538A (ko) * 2021-03-29 2025-10-21 엔테그리스, 아이엔씨. 화학적 기계적 평탄화(cmp)를 위한 현탁액 및 이를 사용하는 방법
US20220332977A1 (en) * 2021-04-16 2022-10-20 Entegris, Inc. Cmp compositions for polishing dielectric materials
TWI873902B (zh) * 2022-10-11 2025-02-21 美商Ｃｍｃ材料有限責任公司 用於高度摻雜硼之矽膜之化學機械拋光組合物
CN119371896B (zh) * 2024-10-21 2025-06-27 镇江瑞斯普新材料科技有限公司 一种耐磨型复合抛光粉及其制备方法

Family Cites Families (16)

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Publication number Priority date Publication date Assignee Title
JP2000080352A (ja) 1998-06-11 2000-03-21 Allied Signal Inc 低誘電率材料用研磨用スラリ―としての水系金属酸化物ゾル
JP4345746B2 (ja) * 1999-11-16 2009-10-14 株式会社デンソー メカノケミカル研磨装置
JP4028163B2 (ja) 1999-11-16 2007-12-26 株式会社デンソー メカノケミカル研磨方法及びメカノケミカル研磨装置
US6866793B2 (en) 2002-09-26 2005-03-15 University Of Florida Research Foundation, Inc. High selectivity and high planarity dielectric polishing
US7221037B2 (en) 2003-01-20 2007-05-22 Matsushita Electric Industrial Co., Ltd. Method of manufacturing group III nitride substrate and semiconductor device
US7176115B2 (en) 2003-03-20 2007-02-13 Matsushita Electric Industrial Co., Ltd. Method of manufacturing Group III nitride substrate and semiconductor device
JP2006100570A (ja) * 2004-09-29 2006-04-13 Fuji Photo Film Co Ltd 研磨用組成物及びそれを用いた研磨方法
JP4792802B2 (ja) * 2005-04-26 2011-10-12 住友電気工業株式会社 Ｉｉｉ族窒化物結晶の表面処理方法
JP5336699B2 (ja) 2006-09-15 2013-11-06 株式会社ノリタケカンパニーリミテド 結晶材料の研磨加工方法
US8283694B2 (en) * 2006-10-19 2012-10-09 Sumitomo Electric Industries, Ltd. GaN substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
EP2039474A1 (en) * 2007-02-20 2009-03-25 Sumitomo Electric Industries, Ltd. Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material
DE102007047737A1 (de) * 2007-10-05 2009-04-30 Merck Patent Gmbh Piperidin- und Piperazinderivate
CN101815771A (zh) * 2007-10-05 2010-08-25 圣戈本陶瓷及塑料股份有限公司 改进的碳化硅颗粒及其制造方法和使用方法
JP2009272380A (ja) 2008-05-01 2009-11-19 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶およびその表面処理方法、ｉｉｉ族窒化物積層体およびその製造方法、ならびにｉｉｉ族窒化物半導体デバイスおよびその製造方法
JP4333820B1 (ja) * 2009-01-19 2009-09-16 住友電気工業株式会社 化合物半導体基板
US9368367B2 (en) 2009-04-13 2016-06-14 Sinmat, Inc. Chemical mechanical polishing of silicon carbide comprising surfaces

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