JP2014520966A - 基板上に少粒子層を形成するための方法および装置 - Google Patents

基板上に少粒子層を形成するための方法および装置 Download PDF

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Publication number
JP2014520966A
JP2014520966A JP2014520689A JP2014520689A JP2014520966A JP 2014520966 A JP2014520966 A JP 2014520966A JP 2014520689 A JP2014520689 A JP 2014520689A JP 2014520689 A JP2014520689 A JP 2014520689A JP 2014520966 A JP2014520966 A JP 2014520966A
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substrate
layer
magnetron
magnetron sputtering
turntable
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JP2014520966A5 (enExample
Inventor
フェルゲール，ミハエル
ラーデマッハー，ダニエル
クリヘルドルフ，ハンス−ウルリヒ
ブラウアー，ギュンター
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フラオンホファー−ゲゼルシャフト・ツア・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファオ
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Publication of JP2014520966A publication Critical patent/JP2014520966A/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/342—Hollow targets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Optical Filters (AREA)
JP2014520689A 2011-07-21 2012-07-23 基板上に少粒子層を形成するための方法および装置 Pending JP2014520966A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11174871.1 2011-07-21
EP11174871A EP2549521A1 (de) 2011-07-21 2011-07-21 Verfahren und Vorrichtung zur Herstellung partikelarmer Schichten auf Substraten
PCT/EP2012/064404 WO2013011149A1 (de) 2011-07-21 2012-07-23 Verfahren und vorrichtung zur herstellung partikelarmer schichten auf substraten

Related Child Applications (1)

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JP2017149711A Division JP2017226920A (ja) 2011-07-21 2017-08-02 基板上に少粒子層を形成するための方法および装置

Publications (2)

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JP2014520966A true JP2014520966A (ja) 2014-08-25
JP2014520966A5 JP2014520966A5 (enExample) 2015-07-23

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JP2014520689A Pending JP2014520966A (ja) 2011-07-21 2012-07-23 基板上に少粒子層を形成するための方法および装置
JP2017149711A Pending JP2017226920A (ja) 2011-07-21 2017-08-02 基板上に少粒子層を形成するための方法および装置
JP2019058603A Pending JP2019131891A (ja) 2011-07-21 2019-03-26 基板上に少粒子層を形成するための方法および装置
JP2021137403A Pending JP2021193213A (ja) 2011-07-21 2021-08-25 基板上に少粒子層を形成するための方法および装置
JP2023086136A Active JP7676466B2 (ja) 2011-07-21 2023-05-25 基板上に少粒子層を形成するための方法および装置

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JP2017149711A Pending JP2017226920A (ja) 2011-07-21 2017-08-02 基板上に少粒子層を形成するための方法および装置
JP2019058603A Pending JP2019131891A (ja) 2011-07-21 2019-03-26 基板上に少粒子層を形成するための方法および装置
JP2021137403A Pending JP2021193213A (ja) 2011-07-21 2021-08-25 基板上に少粒子層を形成するための方法および装置
JP2023086136A Active JP7676466B2 (ja) 2011-07-21 2023-05-25 基板上に少粒子層を形成するための方法および装置

Country Status (6)

Country Link
US (1) US9803276B2 (enExample)
EP (2) EP2549521A1 (enExample)
JP (5) JP2014520966A (enExample)
CA (1) CA2842253C (enExample)
DK (1) DK2735018T3 (enExample)
WO (1) WO2013011149A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021534323A (ja) * 2018-08-10 2021-12-09 フラウンホーファー−ゲゼルシャフト ツゥア フェアデルング デア アンゲヴァンドテン フォァシュング エー．ファウ． 水平方向に回転する基板ガイドを備えたコーティングシステムにおいて、均一性の高いコーティングを行うための装置及び方法

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DE102013221029A1 (de) * 2013-10-16 2015-04-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Herstellung uniformer Schichten auf bewegten Substraten und derart hergestellte Schichten
DE102015106368B4 (de) * 2015-04-24 2017-03-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Beschichteter Gegenstand und Verfahren zur Herstellung eines beschichteten Gegenstands
US9934950B2 (en) 2015-10-16 2018-04-03 Samsung Electronics Co., Ltd. Sputtering apparatuses and methods of manufacturing a magnetic memory device using the same
ES2786348T3 (es) * 2015-12-23 2020-10-09 Materion Advanced Mat Germany Gmbh Diana de pulverización catódica basada en óxido de circonio
DE102016125278A1 (de) 2016-12-14 2018-06-14 Schneider Gmbh & Co. Kg Vorrichtung, Verfahren und Verwendung zur Beschichtung von Linsen
DE102019132526B4 (de) 2019-01-15 2025-10-02 Asus Resources Pte. Ltd. Beschichtungsmaschine
EP3722451A1 (de) * 2019-04-09 2020-10-14 FRAUNHOFER-GESELLSCHAFT zur Förderung der angewandten Forschung e.V. Vorrichtung und verfahren zur beschichtung von substraten mit planaren oder geformten oberflächen mittels magnetron-sputtern
DE102020201829A1 (de) 2020-02-13 2021-08-19 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein Vorrichtung und Verfahren zur Herstellung von Schichten mit verbesserter Uniformität bei Beschichtungsanlagen mit horizontal rotierender Substratführung mit zusätzlichen Plasmaquellen
US20220122815A1 (en) * 2020-10-15 2022-04-21 Oem Group, Llc Systems and methods for unprecedented crystalline quality in physical vapor deposition-based ultra-thin aluminum nitride films

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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2021534323A (ja) * 2018-08-10 2021-12-09 フラウンホーファー−ゲゼルシャフト ツゥア フェアデルング デア アンゲヴァンドテン フォァシュング エー．ファウ． 水平方向に回転する基板ガイドを備えたコーティングシステムにおいて、均一性の高いコーティングを行うための装置及び方法
JP7277565B2 (ja) 2018-08-10 2023-05-19 フラウンホーファー－ゲゼルシャフト ツゥア フェアデルング デア アンゲヴァンドテン フォァシュング エー．ファウ． 水平方向に回転する基板ガイドを備えたコーティングシステムにおいて、均一性の高いコーティングを行うための装置及び方法
US12428720B2 (en) 2018-08-10 2025-09-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for producing layers with improved uniformity in coating systems with horizontally rotating substrate guiding

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WO2013011149A1 (de) 2013-01-24
JP2021193213A (ja) 2021-12-23
JP2019131891A (ja) 2019-08-08
DK2735018T3 (en) 2017-01-16
CA2842253C (en) 2019-07-16
CA2842253A1 (en) 2013-01-24
EP2735018A1 (de) 2014-05-28
JP2023113733A (ja) 2023-08-16
JP2017226920A (ja) 2017-12-28
EP2549521A1 (de) 2013-01-23
US20140262752A1 (en) 2014-09-18
EP2735018B1 (de) 2016-10-19
US9803276B2 (en) 2017-10-31
JP7676466B2 (ja) 2025-05-14

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