JP2014518009A5 - - Google Patents

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Publication number
JP2014518009A5
JP2014518009A5 JP2014508603A JP2014508603A JP2014518009A5 JP 2014518009 A5 JP2014518009 A5 JP 2014518009A5 JP 2014508603 A JP2014508603 A JP 2014508603A JP 2014508603 A JP2014508603 A JP 2014508603A JP 2014518009 A5 JP2014518009 A5 JP 2014518009A5
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JP
Japan
Prior art keywords
light
process chamber
processing system
reflected
photodetector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014508603A
Other languages
English (en)
Japanese (ja)
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JP2014518009A (ja
JP6019105B2 (ja
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Publication date
Priority claimed from US13/440,564 external-priority patent/US9347132B2/en
Application filed filed Critical
Publication of JP2014518009A publication Critical patent/JP2014518009A/ja
Publication of JP2014518009A5 publication Critical patent/JP2014518009A5/ja
Application granted granted Critical
Publication of JP6019105B2 publication Critical patent/JP6019105B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014508603A 2011-04-29 2012-04-27 光学的終点検出システム Active JP6019105B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161480839P 2011-04-29 2011-04-29
US61/480,839 2011-04-29
US13/440,564 2012-04-05
US13/440,564 US9347132B2 (en) 2011-04-29 2012-04-05 Optical endpoint detection system
PCT/US2012/035469 WO2012149331A2 (en) 2011-04-29 2012-04-27 Optical endpoint detection system

Publications (3)

Publication Number Publication Date
JP2014518009A JP2014518009A (ja) 2014-07-24
JP2014518009A5 true JP2014518009A5 (enExample) 2015-06-18
JP6019105B2 JP6019105B2 (ja) 2016-11-02

Family

ID=47066950

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014508603A Active JP6019105B2 (ja) 2011-04-29 2012-04-27 光学的終点検出システム

Country Status (7)

Country Link
US (2) US9347132B2 (enExample)
JP (1) JP6019105B2 (enExample)
KR (1) KR101742478B1 (enExample)
CN (1) CN103493192B (enExample)
SG (1) SG194450A1 (enExample)
TW (1) TWI538079B (enExample)
WO (1) WO2012149331A2 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10047457B2 (en) 2013-09-16 2018-08-14 Applied Materials, Inc. EPI pre-heat ring
US10153141B2 (en) 2014-02-14 2018-12-11 Electronics And Telecommunications Research Institute Apparatus for monitoring gas and plasma process equipment including the same
US10053777B2 (en) * 2014-03-19 2018-08-21 Applied Materials, Inc. Thermal processing chamber
JP2018046044A (ja) * 2016-09-12 2018-03-22 大陽日酸株式会社 サセプタのクリーニング装置及びクリーニング方法
US10043641B2 (en) 2016-09-22 2018-08-07 Applied Materials, Inc. Methods and apparatus for processing chamber cleaning end point detection
CN109226131A (zh) * 2018-10-11 2019-01-18 武汉华星光电半导体显示技术有限公司 清洗终点监测方法以及监测装置
CN109365410B (zh) * 2018-10-17 2020-09-18 北京航天控制仪器研究所 一种实现高效激光清洗的加工头装置及清洗方法
KR102774924B1 (ko) * 2019-07-26 2025-02-27 어플라이드 머티어리얼스, 인코포레이티드 기판 프로세싱 모니터링
US11708635B2 (en) 2020-06-12 2023-07-25 Applied Materials, Inc. Processing chamber condition and process state monitoring using optical reflector attached to processing chamber liner
US12009191B2 (en) 2020-06-12 2024-06-11 Applied Materials, Inc. Thin film, in-situ measurement through transparent crystal and transparent substrate within processing chamber wall
US12031910B2 (en) 2021-09-15 2024-07-09 Applied Materials, Inc. Transmission corrected plasma emission using in-situ optical reflectometry
US12467136B2 (en) 2022-03-16 2025-11-11 Applied Materials, Inc. Process characterization and correction using optical wall process sensor (OWPS)
US12469686B2 (en) 2022-03-16 2025-11-11 Applied Materials, Inc. Process characterization and correction using optical wall process sensor (OWPS)
USD1031743S1 (en) 2022-05-06 2024-06-18 Applied Materials, Inc. Portion of a display panel with a graphical user interface
US20250038040A1 (en) * 2023-07-27 2025-01-30 Applied Materials, Inc. Lift frames for central heating, and related processing chambers and methods
CN120072606A (zh) * 2023-11-28 2025-05-30 北京北方华创微电子装备有限公司 半导体工艺设备及其控制方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6129807A (en) 1997-10-06 2000-10-10 Applied Materials, Inc. Apparatus for monitoring processing of a substrate
JPH11140655A (ja) 1997-11-14 1999-05-25 Sony Corp プラズマ処理装置
JP3535785B2 (ja) 1999-11-26 2004-06-07 Necエレクトロニクス株式会社 クリーニング終点検出装置およびクリーニング終点検出方法
JP2002057149A (ja) 2000-08-08 2002-02-22 Tokyo Electron Ltd 処理装置及びそのクリーニング方法
JP2002246320A (ja) 2001-02-20 2002-08-30 Hitachi Ltd プラズマ処理装置のプラズマクリーニング方法
JP2004047020A (ja) * 2002-07-15 2004-02-12 Fuji Electric Holdings Co Ltd 磁気ディスク媒体及び固定磁気ディスク装置
KR100844273B1 (ko) 2002-12-20 2008-07-07 동부일렉트로닉스 주식회사 챔버 세정장치
US8460945B2 (en) 2003-09-30 2013-06-11 Tokyo Electron Limited Method for monitoring status of system components
US20060021633A1 (en) 2004-07-27 2006-02-02 Applied Materials, Inc. Closed loop clean gas control
US7534469B2 (en) 2005-03-31 2009-05-19 Asm Japan K.K. Semiconductor-processing apparatus provided with self-cleaning device
CN101174082A (zh) * 2006-10-30 2008-05-07 应用材料股份有限公司 用于光掩模刻蚀的终点检测
US8092695B2 (en) 2006-10-30 2012-01-10 Applied Materials, Inc. Endpoint detection for photomask etching
JP3138693U (ja) 2007-02-01 2008-01-17 アプライド マテリアルズ インコーポレイテッド ノズルを備えたプラズマリアクタ及び可変プロセスガス分配

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