JP2014516093A - 反射体及びそれを具備する発光装置 - Google Patents
反射体及びそれを具備する発光装置 Download PDFInfo
- Publication number
- JP2014516093A JP2014516093A JP2014510230A JP2014510230A JP2014516093A JP 2014516093 A JP2014516093 A JP 2014516093A JP 2014510230 A JP2014510230 A JP 2014510230A JP 2014510230 A JP2014510230 A JP 2014510230A JP 2014516093 A JP2014516093 A JP 2014516093A
- Authority
- JP
- Japan
- Prior art keywords
- acid
- liquid crystal
- wholly aromatic
- aromatic liquid
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003118 aryl group Chemical group 0.000 claims abstract description 84
- 229920005989 resin Polymers 0.000 claims abstract description 71
- 239000011347 resin Substances 0.000 claims abstract description 71
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 70
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims abstract description 68
- 150000001875 compounds Chemical class 0.000 claims abstract description 50
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims abstract description 28
- ALYNCZNDIQEVRV-UHFFFAOYSA-N 4-aminobenzoic acid Chemical compound NC1=CC=C(C(O)=O)C=C1 ALYNCZNDIQEVRV-UHFFFAOYSA-N 0.000 claims abstract description 20
- 229960004050 aminobenzoic acid Drugs 0.000 claims abstract description 19
- UPHOPMSGKZNELG-UHFFFAOYSA-N 2-hydroxynaphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=C(O)C=CC2=C1 UPHOPMSGKZNELG-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011256 inorganic filler Substances 0.000 claims abstract description 13
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 13
- 239000003365 glass fiber Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 229910052882 wollastonite Inorganic materials 0.000 claims description 7
- 239000010456 wollastonite Substances 0.000 claims description 7
- IJFXRHURBJZNAO-UHFFFAOYSA-N 3-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1 IJFXRHURBJZNAO-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 claims description 5
- -1 aromatic dicarboxylic acids Chemical class 0.000 claims description 5
- KAUQJMHLAFIZDU-UHFFFAOYSA-N 6-Hydroxy-2-naphthoic acid Chemical compound C1=C(O)C=CC2=CC(C(=O)O)=CC=C21 KAUQJMHLAFIZDU-UHFFFAOYSA-N 0.000 claims description 4
- RWZYAGGXGHYGMB-UHFFFAOYSA-N anthranilic acid Chemical compound NC1=CC=CC=C1C(O)=O RWZYAGGXGHYGMB-UHFFFAOYSA-N 0.000 claims description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid group Chemical group C(C1=CC=CC=C1)(=O)O WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 4
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 4
- SJJCQDRGABAVBB-UHFFFAOYSA-N 1-hydroxy-2-naphthoic acid Chemical compound C1=CC=CC2=C(O)C(C(=O)O)=CC=C21 SJJCQDRGABAVBB-UHFFFAOYSA-N 0.000 claims description 3
- LODHFNUFVRVKTH-ZHACJKMWSA-N 2-hydroxy-n'-[(e)-3-phenylprop-2-enoyl]benzohydrazide Chemical compound OC1=CC=CC=C1C(=O)NNC(=O)\C=C\C1=CC=CC=C1 LODHFNUFVRVKTH-ZHACJKMWSA-N 0.000 claims description 3
- ALKYHXVLJMQRLQ-UHFFFAOYSA-N 3-Hydroxy-2-naphthoate Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 ALKYHXVLJMQRLQ-UHFFFAOYSA-N 0.000 claims description 3
- ALYNCZNDIQEVRV-PZFLKRBQSA-N 4-amino-3,5-ditritiobenzoic acid Chemical compound [3H]c1cc(cc([3H])c1N)C(O)=O ALYNCZNDIQEVRV-PZFLKRBQSA-N 0.000 claims description 3
- YGSDEFSMJLZEOE-UHFFFAOYSA-N Salicylic acid Natural products OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 229960004889 salicylic acid Drugs 0.000 claims description 3
- 239000005711 Benzoic acid Substances 0.000 claims description 2
- 235000010233 benzoic acid Nutrition 0.000 claims description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 43
- 238000002347 injection Methods 0.000 description 13
- 239000007924 injection Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 13
- 229920001225 polyester resin Polymers 0.000 description 12
- 239000004645 polyester resin Substances 0.000 description 12
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 11
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000000178 monomer Substances 0.000 description 7
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 6
- 238000002310 reflectometry Methods 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 5
- 238000004898 kneading Methods 0.000 description 5
- 238000012643 polycondensation polymerization Methods 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- SCVFZCLFOSHCOH-UHFFFAOYSA-M potassium acetate Chemical compound [K+].CC([O-])=O SCVFZCLFOSHCOH-UHFFFAOYSA-M 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000002845 discoloration Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000007790 solid phase Substances 0.000 description 3
- AJHPGXZOIAYYDW-UHFFFAOYSA-N 3-(2-cyanophenyl)-2-[(2-methylpropan-2-yl)oxycarbonylamino]propanoic acid Chemical compound CC(C)(C)OC(=O)NC(C(O)=O)CC1=CC=CC=C1C#N AJHPGXZOIAYYDW-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000006640 acetylation reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 235000011056 potassium acetate Nutrition 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- DWCSXSQEGHQXEF-UHFFFAOYSA-N 2,6-dihydroxynaphthalene-1-carboxylic acid Chemical compound OC1=CC=C2C(C(=O)O)=C(O)C=CC2=C1 DWCSXSQEGHQXEF-UHFFFAOYSA-N 0.000 description 1
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 1
- UOBYKYZJUGYBDK-UHFFFAOYSA-N 2-naphthoic acid Chemical compound C1=CC=CC2=CC(C(=O)O)=CC=C21 UOBYKYZJUGYBDK-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 150000001242 acetic acid derivatives Chemical class 0.000 description 1
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 1
- 239000012345 acetylating agent Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000005427 anthranyl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- VSGNNIFQASZAOI-UHFFFAOYSA-L calcium acetate Chemical compound [Ca+2].CC([O-])=O.CC([O-])=O VSGNNIFQASZAOI-UHFFFAOYSA-L 0.000 description 1
- 239000001639 calcium acetate Substances 0.000 description 1
- 235000011092 calcium acetate Nutrition 0.000 description 1
- 229960005147 calcium acetate Drugs 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- JVLRYPRBKSMEBF-UHFFFAOYSA-K diacetyloxystibanyl acetate Chemical compound [Sb+3].CC([O-])=O.CC([O-])=O.CC([O-])=O JVLRYPRBKSMEBF-UHFFFAOYSA-K 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 229940046892 lead acetate Drugs 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- UEGPKNKPLBYCNK-UHFFFAOYSA-L magnesium acetate Chemical compound [Mg+2].CC([O-])=O.CC([O-])=O UEGPKNKPLBYCNK-UHFFFAOYSA-L 0.000 description 1
- 239000011654 magnesium acetate Substances 0.000 description 1
- 235000011285 magnesium acetate Nutrition 0.000 description 1
- 229940069446 magnesium acetate Drugs 0.000 description 1
- 229940071125 manganese acetate Drugs 0.000 description 1
- UOGMEBQRZBEZQT-UHFFFAOYSA-L manganese(2+);diacetate Chemical compound [Mn+2].CC([O-])=O.CC([O-])=O UOGMEBQRZBEZQT-UHFFFAOYSA-L 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 238000012667 polymer degradation Methods 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229960004109 potassium acetate Drugs 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000004246 zinc acetate Substances 0.000 description 1
- 229960000314 zinc acetate Drugs 0.000 description 1
- 235000013904 zinc acetate Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
- C08L77/12—Polyester-amides
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/12—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids with both amino and carboxylic groups aromatically bound
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/44—Polyester-amides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/14—Glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
- C08J2367/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the hydroxy and the carboxyl groups directly linked to aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2237—Oxides; Hydroxides of metals of titanium
- C08K2003/2241—Titanium dioxide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/878—Arrangements for extracting light from the devices comprising reflective means
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Polyamides (AREA)
- Polyesters Or Polycarbonates (AREA)
Abstract
Description
本発明の他の具現例は、前記反射体を具備する発光装置を提供するものである。
前記発光装置は、LED(light emitting diode)または有機ELディスプレイであってもよい。
(a)1種以上の単量体を溶融縮重合することにより、全芳香族液晶ポリエステルアミドプレポリマーを合成する段階;
(b)前記プレポリマーを固相重合することにより、全芳香族液晶ポリエステルアミド樹脂を合成する段階。
製造例1−2〜1−6:全芳香族液晶ポリエステルアミド樹脂(2)〜(6)の製造
製造例2−2:全芳香族液晶ポリエステルアミド樹脂コンパウンド(2)の製造
製造例2−3:全芳香族液晶ポリエステルアミド樹脂コンパウンド(3)の製造
製造例3−1:全芳香族液晶ポリエステル樹脂コンパウンド(1)の製造
製造例3−2:全芳香族液晶ポリエステル樹脂コンパウンド(2)の製造
製造例3−3:全芳香族液晶ポリエステル樹脂コンパウンド(2)の製造
実施例1〜3:LED用反射体(1)〜(3)の製造
参考例1〜3:LED用反射体(4)〜(6)の製造
[評価例]
LED用反射体(1)〜(6)の性能評価
色差計(Konica Minolta社、CM−3700d)を使用して、射出直後の各反射体の反射率を測定した後、キセノンランプ(xenon lamp)(POLARION社のPS−PHモデル、定格出力50W、最大光束5,000lumen、色温度4,300K)が設置された密閉空間中に、前記各反射体サンプルを入れ、射出後6時間経過時の反射率変化を測定し、初期反射率低下の改善効果を評価した。経時的反射率の変化が小さいほど、初期反射率低下の改善効果が良好であるということを意味する。すなわち、色差計を使用して、360nm〜740nmの波長範囲にわたり、10nmの波長間隔で、各LED用反射体当たり5個のサンプルに係わる反射率を測定した後、このサンプルの各波長別平均値を求めた後、汎用的に通用する反射率の基準である450nm、550nm及び650nmでの平均値を、各反射体の反射率として表示した。このとき、反射率の測定範囲は、0〜100%であり、反射率標準偏差は、0.1%以内であるということが分かった。初期反射率低下の改善効果の評価結果を下記表2に示した。
Claims (9)
- ヒドロキシ安息香酸から誘導された反復単位、ヒドロキシナフトエ酸から誘導された反復単位、及びアミノ安息香酸から誘導された反復単位を含むが、芳香族ジカルボン酸から誘導された反復単位を含まない全芳香族液晶ポリエステルアミド樹脂のコンパウンドを含み、
前記全芳香族液晶ポリエステルアミド樹脂のコンパウンドは、白色無機充填剤をさらに含む反射体。 - 前記ヒドロキシ安息香酸は、p−ヒドロキシ安息香酸、3−ヒドロキシ安息香酸、2−ヒドロキシ安息香酸、及びそれらの組み合わせからなる群から選択され、前記ヒドロキシナフトエ酸は、6−ヒドロキシ−2−ナフトエ酸、3−ヒドロキシ−2−ナフトエ酸、2−ヒドロキシ−1−ナフトエ酸、1−ヒドロキシ−2−ナフトエ酸、及びそれらの組み合わせからなる群から選択され、前記アミノ安息香酸は、アントラニル酸、3−アミノ安息香酸、4−アミノ安息香酸、及びそれらの組み合わせからなる群から選択されたことを特徴とする請求項1に記載の反射体。
- 前記全芳香族液晶ポリエステルアミド樹脂は、前記ヒドロキシ安息香酸から誘導された反復単位と、前記アミノ安息香酸から誘導された反復単位との総計65〜85モル部、及び前記ヒドロキシナフトエ酸から誘導された反復単位15〜35モル部を含むことを特徴とする請求項1に記載の反射体。
- 前記全芳香族液晶ポリエステルアミド樹脂は、前記ヒドロキシ安息香酸から誘導された反復単位50〜84.5モル部、前記アミノ安息香酸から誘導された反復単位0.5〜15モル部、及び前記ヒドロキシナフトエ酸から誘導された反復単位20〜35モル部を含むことを特徴とする請求項3に記載の反射体。
- 前記白色無機充填剤は、酸化チタンを含むことを特徴とする請求項1に記載の反射体。
- 前記白色無機充填剤の含量は、前記全芳香族液晶ポリエステルアミド樹脂コンパウンド100重量部に対して、10ないし60重量部であることを特徴とする請求項1に記載の反射体。
- 前記全芳香族液晶ポリエステルアミド樹脂コンパウンドは、ガラスファイバ及び珪灰石のうち少なくとも一つをさらに含むことを特徴とする請求項5に記載の反射体。
- 請求項1ないし7のうち、いずれか1項に記載の反射体を具備する発光装置。
- 発光ダイオード(LED)または有機ELディスプレイであることを特徴とする請求項8に記載の発光装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110043071A KR101763948B1 (ko) | 2011-05-06 | 2011-05-06 | 반사체 및 이를 구비하는 발광장치 |
KR10-2011-0043071 | 2011-05-06 | ||
PCT/KR2011/009103 WO2012153900A1 (ko) | 2011-05-06 | 2011-11-28 | 반사체 및 이를 구비하는 발광장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014516093A true JP2014516093A (ja) | 2014-07-07 |
JP5909277B2 JP5909277B2 (ja) | 2016-04-26 |
Family
ID=47139362
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014510230A Active JP5909277B2 (ja) | 2011-05-06 | 2011-11-28 | 反射体及びそれを具備する発光装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140070150A1 (ja) |
EP (1) | EP2706094B1 (ja) |
JP (1) | JP5909277B2 (ja) |
KR (1) | KR101763948B1 (ja) |
CN (1) | CN103502358B (ja) |
TW (1) | TWI551621B (ja) |
WO (1) | WO2012153900A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020097706A (ja) * | 2018-12-19 | 2020-06-25 | ポリプラスチックス株式会社 | 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物及びポリエステルアミド成形品 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4351917A (en) * | 1981-04-06 | 1982-09-28 | Celanese Corporation | Poly(ester-amide) capable of forming an anisotropic melt phase derived from 6-hydroxy-2-naphthoic acid, aromatic monomer capable of forming an amide linkage, and other aromatic hydroxyacid |
JP2003128782A (ja) * | 2001-10-30 | 2003-05-08 | Polyplastics Co | 全芳香族ポリエステルアミド及びポリエステルアミド樹脂組成物 |
JP2007271834A (ja) * | 2006-03-31 | 2007-10-18 | Mitsui Chemicals Inc | 反射板用樹脂組成物および反射板 |
JP2007320996A (ja) * | 2006-05-30 | 2007-12-13 | Toray Ind Inc | 液晶性樹脂組成物、およびそれからなる成形品 |
JP2008544498A (ja) * | 2005-06-10 | 2008-12-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 高温ポリアミド組成物を含む発光ダイオードアセンブリハウジング |
JP2010235810A (ja) * | 2009-03-31 | 2010-10-21 | Jx Nippon Oil & Energy Corp | 全芳香族サーモトロピック液晶ポリエステル樹脂組成物、成形体及びledリフレクター |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3043867A (en) * | 1959-10-16 | 1962-07-10 | Dow Chemical Co | Method for the purification of aminocarboxylic acids |
TW413697B (en) * | 1995-12-15 | 2000-12-01 | Toray Industries | Liquid crystalline resin composition |
TW474984B (en) * | 1996-12-25 | 2002-02-01 | Toray Industries | Liquid crystalline resin and molded product thereof |
US6046300A (en) * | 1997-12-26 | 2000-04-04 | Toray Industries, Inc. | Liquid-crystalline resin and thermoplastic resin composition |
JP4907053B2 (ja) * | 2003-04-25 | 2012-03-28 | ポリプラスチックス株式会社 | 非晶質全芳香族ポリエステルアミド及びその組成物 |
JP4498810B2 (ja) * | 2004-04-16 | 2010-07-07 | ポリプラスチックス株式会社 | 液晶樹脂組成物 |
JP4558374B2 (ja) * | 2004-05-11 | 2010-10-06 | 上野製薬株式会社 | 液晶ポリエステル樹脂組成物の接合方法および液晶ポリエステル樹脂組成物接合体 |
EP1760104B1 (en) * | 2004-06-22 | 2019-01-02 | Toray Industries, Inc. | Liquid-crystalline resin, process for producing the same, composition of liquid-crystalline resin, and molded article |
JP2006070086A (ja) * | 2004-08-31 | 2006-03-16 | Polyplastics Co | 熱可塑性樹脂組成物 |
JP5172279B2 (ja) * | 2006-11-06 | 2013-03-27 | 上野製薬株式会社 | 液晶ポリマー組成物およびそれからなる成形品 |
JP2008231368A (ja) * | 2007-03-23 | 2008-10-02 | Nippon Oil Corp | 光線反射率および強度に優れた液晶ポリエステル樹脂組成物 |
KR100929383B1 (ko) * | 2007-05-23 | 2009-12-02 | 삼성정밀화학 주식회사 | 방향족 액정 폴리에스테르 아미드 공중합체, 상기 방향족액정 폴리에스테르 아미드 공중합체를 채용한 프리프레그,및 상기 프리프레그를 채용한 적층판과 프린트 배선판 |
KR101111644B1 (ko) * | 2009-06-17 | 2012-02-14 | 삼성정밀화학 주식회사 | 방향족 폴리에스테르 아미드 공중합체, 상기 방향족 폴리에스테르 아미드 공중합체를 채용한 프리프레그와 프리프레그 적층체, 및 상기 프리프레그 또는 프리프레그 적층체를 채용한 금속박 적층판과 프린트 배선판 |
KR101111645B1 (ko) * | 2009-06-17 | 2012-03-13 | 삼성정밀화학 주식회사 | 용융점도가 일정한 전방향족 액정 폴리에스테르 수지의 제조방법 및 전방향족 액정 폴리에스테르 수지 컴파운드의 제조방법 |
JP5503915B2 (ja) * | 2009-07-30 | 2014-05-28 | 住友化学株式会社 | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
WO2011040184A1 (ja) * | 2009-09-30 | 2011-04-07 | ポリプラスチックス株式会社 | 液晶性高分子及び成形体 |
-
2011
- 2011-05-06 KR KR1020110043071A patent/KR101763948B1/ko active IP Right Grant
- 2011-11-28 CN CN201180070562.8A patent/CN103502358B/zh active Active
- 2011-11-28 JP JP2014510230A patent/JP5909277B2/ja active Active
- 2011-11-28 US US14/114,413 patent/US20140070150A1/en not_active Abandoned
- 2011-11-28 EP EP11865434.2A patent/EP2706094B1/en active Active
- 2011-11-28 WO PCT/KR2011/009103 patent/WO2012153900A1/ko active Application Filing
-
2012
- 2012-03-02 TW TW101106865A patent/TWI551621B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4351917A (en) * | 1981-04-06 | 1982-09-28 | Celanese Corporation | Poly(ester-amide) capable of forming an anisotropic melt phase derived from 6-hydroxy-2-naphthoic acid, aromatic monomer capable of forming an amide linkage, and other aromatic hydroxyacid |
JPS57177020A (en) * | 1981-04-06 | 1982-10-30 | Celanese Corp | Anisotropic melt phase-formable melt-workable poly(ester-amide) |
JP2003128782A (ja) * | 2001-10-30 | 2003-05-08 | Polyplastics Co | 全芳香族ポリエステルアミド及びポリエステルアミド樹脂組成物 |
US20030100701A1 (en) * | 2001-10-30 | 2003-05-29 | Toshiaki Yokota | Wholly aromatic polyester amide and polyester amide resin composition |
JP2008544498A (ja) * | 2005-06-10 | 2008-12-04 | イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー | 高温ポリアミド組成物を含む発光ダイオードアセンブリハウジング |
JP2007271834A (ja) * | 2006-03-31 | 2007-10-18 | Mitsui Chemicals Inc | 反射板用樹脂組成物および反射板 |
JP2007320996A (ja) * | 2006-05-30 | 2007-12-13 | Toray Ind Inc | 液晶性樹脂組成物、およびそれからなる成形品 |
JP2010235810A (ja) * | 2009-03-31 | 2010-10-21 | Jx Nippon Oil & Energy Corp | 全芳香族サーモトロピック液晶ポリエステル樹脂組成物、成形体及びledリフレクター |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020097706A (ja) * | 2018-12-19 | 2020-06-25 | ポリプラスチックス株式会社 | 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物及びポリエステルアミド成形品 |
JP7332285B2 (ja) | 2018-12-19 | 2023-08-23 | ポリプラスチックス株式会社 | 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物及びポリエステルアミド成形品 |
Also Published As
Publication number | Publication date |
---|---|
CN103502358A (zh) | 2014-01-08 |
CN103502358B (zh) | 2016-04-13 |
EP2706094A4 (en) | 2014-11-26 |
US20140070150A1 (en) | 2014-03-13 |
JP5909277B2 (ja) | 2016-04-26 |
TW201245270A (en) | 2012-11-16 |
TWI551621B (zh) | 2016-10-01 |
WO2012153900A1 (ko) | 2012-11-15 |
EP2706094A1 (en) | 2014-03-12 |
KR101763948B1 (ko) | 2017-08-01 |
KR20120125033A (ko) | 2012-11-14 |
EP2706094B1 (en) | 2016-02-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5837082B2 (ja) | 反射体及びそれを具備する発光装置 | |
JP4525917B2 (ja) | Ledリフレクタ成形用ポリアミド樹脂組成物およびledリフレクタ | |
TWI495681B (zh) | A wholly aromatic thermotropic liquid crystal polyester resin composition, a molded body, and an LED reflector | |
JP2017066412A (ja) | 液晶ポリエステル組成物 | |
TWI535781B (zh) | A liquid crystal polyester resin composition, a molded body, and an LED reflector | |
KR20120012414A (ko) | 액정 폴리에스테르 조성물, 반사판 및 발광 장치 | |
JP2010084129A (ja) | 液晶ポリエステル樹脂混合物及びそれを用いてなる反射板並びに発光装置 | |
TWI526468B (zh) | 液晶聚酯之製造方法 | |
TW201527417A (zh) | 聚對苯二甲酸環乙酯樹脂組成 | |
JP6492078B2 (ja) | 反射材用樹脂組成物およびそれを含む反射板 | |
JP5909277B2 (ja) | 反射体及びそれを具備する発光装置 | |
JP6324701B2 (ja) | 液晶ポリエステル組成物 | |
TW201608260A (zh) | 反射材用聚酯樹脂組成物及含有其的反射板 | |
JP6042271B2 (ja) | 反射材用ポリエステル樹脂組成物および反射板 | |
KR101783486B1 (ko) | 수지 컴파운드, 반사체 및 이를 구비하는 발광장치 | |
JP6052848B2 (ja) | 液晶ポリエステル樹脂組成物および成形体 | |
KR101650200B1 (ko) | 내변색성이 개선된 반사체 및 이를 구비하는 발광장치 | |
KR20130037871A (ko) | 높은 열적 안정성 및 휘도 저하 현상이 개선된 반사체 제조용 수지 조성물, 그로부터 제조되는 반사체 및 발광장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20141028 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141126 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20141203 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150116 |
|
A625 | Written request for application examination (by other person) |
Free format text: JAPANESE INTERMEDIATE CODE: A625 Effective date: 20141126 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150612 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150714 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20151014 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160301 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160325 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5909277 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |