JP2014513434A5 - - Google Patents

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Publication number
JP2014513434A5
JP2014513434A5 JP2014508469A JP2014508469A JP2014513434A5 JP 2014513434 A5 JP2014513434 A5 JP 2014513434A5 JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014513434 A5 JP2014513434 A5 JP 2014513434A5
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JP
Japan
Prior art keywords
substrate
removal
controllable
removal profile
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014508469A
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English (en)
Japanese (ja)
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JP2014513434A (ja
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Publication date
Priority claimed from US13/098,257 external-priority patent/US8774958B2/en
Application filed filed Critical
Publication of JP2014513434A publication Critical patent/JP2014513434A/ja
Publication of JP2014513434A5 publication Critical patent/JP2014513434A5/ja
Pending legal-status Critical Current

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JP2014508469A 2011-04-29 2012-04-23 除去プロファイルを生成するための研磨パラメータの選択 Pending JP2014513434A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/098,257 US8774958B2 (en) 2011-04-29 2011-04-29 Selection of polishing parameters to generate removal profile
US13/098,257 2011-04-29
PCT/US2012/034702 WO2012148859A2 (en) 2011-04-29 2012-04-23 Selection of polishing parameters to generate removal profile

Publications (2)

Publication Number Publication Date
JP2014513434A JP2014513434A (ja) 2014-05-29
JP2014513434A5 true JP2014513434A5 (https=) 2015-09-17

Family

ID=47068573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014508469A Pending JP2014513434A (ja) 2011-04-29 2012-04-23 除去プロファイルを生成するための研磨パラメータの選択

Country Status (5)

Country Link
US (3) US8774958B2 (https=)
JP (1) JP2014513434A (https=)
KR (2) KR101834711B1 (https=)
TW (2) TWI637813B (https=)
WO (1) WO2012148859A2 (https=)

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Publication number Priority date Publication date Assignee Title
US8774958B2 (en) * 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile
JP5900196B2 (ja) * 2012-07-05 2016-04-06 株式会社Sumco ウェーハの片面研磨方法およびウェーハの片面研磨装置
MX354430B (es) * 2012-07-10 2018-03-05 Statoil Petroleum As Estimacion de parametro de anisotropia.
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102276869B1 (ko) * 2016-06-30 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 자동화된 레시피 생성
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI794293B (zh) 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP6983306B2 (ja) * 2018-03-12 2021-12-17 東京エレクトロン株式会社 基板の反り修正方法、コンピュータ記憶媒体及び基板反り修正装置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11282755B2 (en) * 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
JP2022551429A (ja) * 2019-09-27 2022-12-09 コーニング インコーポレイテッド 平坦さ機能要件を満たすフォトマスクブランクを仕上げるための目標トポグラフィマップの生成提供装置、システムおよび方法
KR102747336B1 (ko) * 2021-03-03 2024-12-31 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
US11919121B2 (en) 2021-03-05 2024-03-05 Applied Materials, Inc. Control of processing parameters during substrate polishing using constrained cost function
US12343840B2 (en) 2021-03-05 2025-07-01 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
CN113159121B (zh) * 2021-03-16 2022-07-19 华中科技大学 基于先验知识模型的机器人磨抛去除量预测方法及设备
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
CN115972074B (zh) * 2022-11-08 2026-04-03 北京晶亦精微科技股份有限公司 化学机械抛光设备研磨时间调整方法、装置、设备及介质
US20250114896A1 (en) * 2023-10-05 2025-04-10 Applied Materials, Inc. Individually rotatable platens and control of carrier head sweep

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US6544103B1 (en) * 2000-11-28 2003-04-08 Speedfam-Ipec Corporation Method to determine optimum geometry of a multizone carrier
US6540591B1 (en) * 2001-04-18 2003-04-01 Alexander J. Pasadyn Method and apparatus for post-polish thickness and uniformity control
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US6857947B2 (en) 2002-01-17 2005-02-22 Asm Nutool, Inc Advanced chemical mechanical polishing system with smart endpoint detection
US20050070205A1 (en) 2003-09-30 2005-03-31 Speedfam-Ipec Corporation Integrated pressure control system for workpiece carrier
US6932671B1 (en) * 2004-05-05 2005-08-23 Novellus Systems, Inc. Method for controlling a chemical mechanical polishing (CMP) operation
CN1972780B (zh) * 2004-06-21 2010-09-08 株式会社荏原制作所 抛光设备和抛光方法
US7150673B2 (en) * 2004-07-09 2006-12-19 Ebara Corporation Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus
JP4689367B2 (ja) * 2004-07-09 2011-05-25 株式会社荏原製作所 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置
US7115017B1 (en) 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
CN101511539B (zh) * 2006-09-12 2012-08-22 株式会社荏原制作所 研磨装置及研磨方法
US7699688B2 (en) 2006-11-22 2010-04-20 Applied Materials, Inc. Carrier ring for carrier head
US8774958B2 (en) 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile

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