JP2014513434A5 - - Google Patents
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- Publication number
- JP2014513434A5 JP2014513434A5 JP2014508469A JP2014508469A JP2014513434A5 JP 2014513434 A5 JP2014513434 A5 JP 2014513434A5 JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014508469 A JP2014508469 A JP 2014508469A JP 2014513434 A5 JP2014513434 A5 JP 2014513434A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- removal
- controllable
- removal profile
- chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 34
- 238000004590 computer program Methods 0.000 claims 14
- 239000011159 matrix material Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 238000005498 polishing Methods 0.000 claims 7
- 239000000126 substance Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 2
- 238000004364 calculation method Methods 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/098,257 | 2011-04-29 | ||
| US13/098,257 US8774958B2 (en) | 2011-04-29 | 2011-04-29 | Selection of polishing parameters to generate removal profile |
| PCT/US2012/034702 WO2012148859A2 (en) | 2011-04-29 | 2012-04-23 | Selection of polishing parameters to generate removal profile |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014513434A JP2014513434A (ja) | 2014-05-29 |
| JP2014513434A5 true JP2014513434A5 (https=) | 2015-09-17 |
Family
ID=47068573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014508469A Pending JP2014513434A (ja) | 2011-04-29 | 2012-04-23 | 除去プロファイルを生成するための研磨パラメータの選択 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US8774958B2 (https=) |
| JP (1) | JP2014513434A (https=) |
| KR (2) | KR101831309B1 (https=) |
| TW (2) | TWI668078B (https=) |
| WO (1) | WO2012148859A2 (https=) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8774958B2 (en) | 2011-04-29 | 2014-07-08 | Applied Materials, Inc. | Selection of polishing parameters to generate removal profile |
| JP5900196B2 (ja) * | 2012-07-05 | 2016-04-06 | 株式会社Sumco | ウェーハの片面研磨方法およびウェーハの片面研磨装置 |
| WO2014008931A1 (en) * | 2012-07-10 | 2014-01-16 | Statoil Petroleum As | Anisotropy parameter estimation |
| US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
| JP6158637B2 (ja) * | 2012-08-28 | 2017-07-05 | 株式会社荏原製作所 | 弾性膜及び基板保持装置 |
| JP6266493B2 (ja) * | 2014-03-20 | 2018-01-24 | 株式会社荏原製作所 | 研磨装置及び研磨方法 |
| TWI658899B (zh) * | 2014-03-31 | 2019-05-11 | Ebara Corporation | 研磨裝置及研磨方法 |
| US9610672B2 (en) * | 2014-06-27 | 2017-04-04 | Applied Materials, Inc. | Configurable pressure design for multizone chemical mechanical planarization polishing head |
| CN109314050B (zh) * | 2016-06-30 | 2023-05-26 | 应用材料公司 | 化学机械研磨的自动配方的产生 |
| TWI816620B (zh) | 2017-04-21 | 2023-09-21 | 美商應用材料股份有限公司 | 使用神經網路來監測的拋光裝置 |
| TWI794293B (zh) * | 2017-09-25 | 2023-03-01 | 美商應用材料股份有限公司 | 使用製程控制參數矩陣的半導體製造 |
| TWI783037B (zh) * | 2017-09-25 | 2022-11-11 | 美商應用材料股份有限公司 | 使用機器學習方式以產生製程控制參數的半導體製造 |
| JP7068831B2 (ja) * | 2018-01-18 | 2022-05-17 | 株式会社荏原製作所 | 研磨装置 |
| US12491600B2 (en) * | 2018-03-12 | 2025-12-09 | Tokyo Electron Limited | Substrate warpage correction method, computer storage medium, and substrate warpage correction apparatus |
| TWI845444B (zh) | 2018-04-03 | 2024-06-11 | 美商應用材料股份有限公司 | 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體 |
| US12017322B2 (en) * | 2018-08-14 | 2024-06-25 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing method |
| CN111886686B (zh) * | 2018-09-26 | 2024-08-02 | 应用材料公司 | 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿 |
| EP3640972A1 (en) * | 2018-10-18 | 2020-04-22 | ASML Netherlands B.V. | System and method for facilitating chemical mechanical polishing |
| US11989492B2 (en) * | 2018-12-26 | 2024-05-21 | Applied Materials, Inc. | Preston matrix generator |
| TWI850338B (zh) * | 2019-02-28 | 2024-08-01 | 美商應用材料股份有限公司 | 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法 |
| US11282755B2 (en) | 2019-08-27 | 2022-03-22 | Applied Materials, Inc. | Asymmetry correction via oriented wafer loading |
| WO2021061477A1 (en) * | 2019-09-27 | 2021-04-01 | Corning Incorporated | Devices, systems, and methods of generating and providing a target topographic map for finishing a photomask blank subject to functional requirements on flatness |
| KR20240161701A (ko) * | 2021-03-03 | 2024-11-12 | 어플라이드 머티어리얼스, 인코포레이티드 | 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들 |
| US11931853B2 (en) * | 2021-03-05 | 2024-03-19 | Applied Materials, Inc. | Control of processing parameters for substrate polishing with angularly distributed zones using cost function |
| EP4301549A4 (en) | 2021-03-05 | 2025-02-26 | Applied Materials, Inc. | CONTROLLING PROCESSING PARAMETERS DURING POLISHING OF A SUBSTRATE USING A COST FUNCTION OR EXPECTED FUTURE PARAMETER CHANGES |
| CN113159121B (zh) * | 2021-03-16 | 2022-07-19 | 华中科技大学 | 基于先验知识模型的机器人磨抛去除量预测方法及设备 |
| US20220362903A1 (en) * | 2021-05-12 | 2022-11-17 | Taiwan Semiconductor Manufacturing Co., Ltd. | Multiple polishing heads with cross-zone pressure element distributions for cmp |
| CN115972074B (zh) * | 2022-11-08 | 2026-04-03 | 北京晶亦精微科技股份有限公司 | 化学机械抛光设备研磨时间调整方法、装置、设备及介质 |
| US20250114896A1 (en) * | 2023-10-05 | 2025-04-10 | Applied Materials, Inc. | Individually rotatable platens and control of carrier head sweep |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6439964B1 (en) * | 1999-10-12 | 2002-08-27 | Applied Materials, Inc. | Method of controlling a polishing machine |
| US6544103B1 (en) * | 2000-11-28 | 2003-04-08 | Speedfam-Ipec Corporation | Method to determine optimum geometry of a multizone carrier |
| US6540591B1 (en) * | 2001-04-18 | 2003-04-01 | Alexander J. Pasadyn | Method and apparatus for post-polish thickness and uniformity control |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
| US6857947B2 (en) | 2002-01-17 | 2005-02-22 | Asm Nutool, Inc | Advanced chemical mechanical polishing system with smart endpoint detection |
| US20050070205A1 (en) | 2003-09-30 | 2005-03-31 | Speedfam-Ipec Corporation | Integrated pressure control system for workpiece carrier |
| US6932671B1 (en) * | 2004-05-05 | 2005-08-23 | Novellus Systems, Inc. | Method for controlling a chemical mechanical polishing (CMP) operation |
| EP1758711B1 (en) * | 2004-06-21 | 2013-08-07 | Ebara Corporation | Polishing apparatus and polishing method |
| JP4689367B2 (ja) * | 2004-07-09 | 2011-05-25 | 株式会社荏原製作所 | 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置 |
| US7150673B2 (en) * | 2004-07-09 | 2006-12-19 | Ebara Corporation | Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus |
| US7115017B1 (en) | 2006-03-31 | 2006-10-03 | Novellus Systems, Inc. | Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization |
| JP5283506B2 (ja) * | 2006-09-12 | 2013-09-04 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US7699688B2 (en) | 2006-11-22 | 2010-04-20 | Applied Materials, Inc. | Carrier ring for carrier head |
| US8774958B2 (en) | 2011-04-29 | 2014-07-08 | Applied Materials, Inc. | Selection of polishing parameters to generate removal profile |
-
2011
- 2011-04-29 US US13/098,257 patent/US8774958B2/en active Active
-
2012
- 2012-04-23 WO PCT/US2012/034702 patent/WO2012148859A2/en not_active Ceased
- 2012-04-23 JP JP2014508469A patent/JP2014513434A/ja active Pending
- 2012-04-23 KR KR1020137031787A patent/KR101831309B1/ko active Active
- 2012-04-23 KR KR1020177015865A patent/KR101834711B1/ko active Active
- 2012-04-24 TW TW106120666A patent/TWI668078B/zh active
- 2012-04-24 TW TW101114548A patent/TWI637813B/zh active
-
2014
- 2014-06-02 US US14/293,776 patent/US9213340B2/en active Active
-
2015
- 2015-12-14 US US14/968,546 patent/US10493590B2/en active Active
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