TWI637813B - 選擇研磨參數以產生移除輪廓 - Google Patents

選擇研磨參數以產生移除輪廓 Download PDF

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Publication number
TWI637813B
TWI637813B TW101114548A TW101114548A TWI637813B TW I637813 B TWI637813 B TW I637813B TW 101114548 A TW101114548 A TW 101114548A TW 101114548 A TW101114548 A TW 101114548A TW I637813 B TWI637813 B TW I637813B
Authority
TW
Taiwan
Prior art keywords
substrate
chamber
pressure
profile
removal
Prior art date
Application number
TW101114548A
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English (en)
Chinese (zh)
Other versions
TW201313392A (zh
Inventor
張煥波
辛格瑞特浩宜
張靜宜
伯翰寧奈森
張清
Original Assignee
應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 應用材料股份有限公司 filed Critical 應用材料股份有限公司
Publication of TW201313392A publication Critical patent/TW201313392A/zh
Application granted granted Critical
Publication of TWI637813B publication Critical patent/TWI637813B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/182—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by the machine tool function, e.g. thread cutting, cam making, tool direction control
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00—Control of fluid pressure
    • G05D16/20—Control of fluid pressure characterised by the use of electric means
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45232—CMP chemical mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Fluid Mechanics (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW101114548A 2011-04-29 2012-04-24 選擇研磨參數以產生移除輪廓 TWI637813B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/098,257 US8774958B2 (en) 2011-04-29 2011-04-29 Selection of polishing parameters to generate removal profile
US13/098,257 2011-04-29

Publications (2)

Publication Number Publication Date
TW201313392A TW201313392A (zh) 2013-04-01
TWI637813B true TWI637813B (zh) 2018-10-11

Family

ID=47068573

Family Applications (2)

Application Number Title Priority Date Filing Date
TW101114548A TWI637813B (zh) 2011-04-29 2012-04-24 選擇研磨參數以產生移除輪廓
TW106120666A TWI668078B (zh) 2011-04-29 2012-04-24 用於選擇研磨參數以產生移除輪廓的電腦程式產品

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW106120666A TWI668078B (zh) 2011-04-29 2012-04-24 用於選擇研磨參數以產生移除輪廓的電腦程式產品

Country Status (5)

Country Link
US (3) US8774958B2 (https=)
JP (1) JP2014513434A (https=)
KR (2) KR101834711B1 (https=)
TW (2) TWI637813B (https=)
WO (1) WO2012148859A2 (https=)

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JP5900196B2 (ja) * 2012-07-05 2016-04-06 株式会社Sumco ウェーハの片面研磨方法およびウェーハの片面研磨装置
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US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
JP6266493B2 (ja) * 2014-03-20 2018-01-24 株式会社荏原製作所 研磨装置及び研磨方法
KR102323430B1 (ko) * 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9610672B2 (en) * 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102276869B1 (ko) * 2016-06-30 2021-07-14 어플라이드 머티어리얼스, 인코포레이티드 화학적 기계적 연마 자동화된 레시피 생성
TWI816620B (zh) 2017-04-21 2023-09-21 美商應用材料股份有限公司 使用神經網路來監測的拋光裝置
TWI794293B (zh) 2017-09-25 2023-03-01 美商應用材料股份有限公司 使用製程控制參數矩陣的半導體製造
TWI783037B (zh) * 2017-09-25 2022-11-11 美商應用材料股份有限公司 使用機器學習方式以產生製程控制參數的半導體製造
JP7068831B2 (ja) * 2018-01-18 2022-05-17 株式会社荏原製作所 研磨装置
JP6983306B2 (ja) * 2018-03-12 2021-12-17 東京エレクトロン株式会社 基板の反り修正方法、コンピュータ記憶媒体及び基板反り修正装置
TWI825075B (zh) 2018-04-03 2023-12-11 美商應用材料股份有限公司 針對墊子厚度使用機器學習及補償的拋光裝置、拋光系統、方法及電腦儲存媒體
US12017322B2 (en) * 2018-08-14 2024-06-25 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing method
CN118943037A (zh) 2018-09-26 2024-11-12 应用材料公司 针对原位电磁感应监测的边缘重建中的基板掺杂的补偿
EP3640972A1 (en) * 2018-10-18 2020-04-22 ASML Netherlands B.V. System and method for facilitating chemical mechanical polishing
US11989492B2 (en) * 2018-12-26 2024-05-21 Applied Materials, Inc. Preston matrix generator
TWI850338B (zh) * 2019-02-28 2024-08-01 美商應用材料股份有限公司 拋光墊、化學機械拋光系統、及控制拋光墊的背襯層的剛度的方法
US11282755B2 (en) * 2019-08-27 2022-03-22 Applied Materials, Inc. Asymmetry correction via oriented wafer loading
JP2022551429A (ja) * 2019-09-27 2022-12-09 コーニング インコーポレイテッド 平坦さ機能要件を満たすフォトマスクブランクを仕上げるための目標トポグラフィマップの生成提供装置、システムおよび方法
KR102747336B1 (ko) * 2021-03-03 2024-12-31 어플라이드 머티어리얼스, 인코포레이티드 공간 분해능을 제공하기 위한 모터 토크 모니터링 동안의 압력 신호들
US11919121B2 (en) 2021-03-05 2024-03-05 Applied Materials, Inc. Control of processing parameters during substrate polishing using constrained cost function
US12343840B2 (en) 2021-03-05 2025-07-01 Applied Materials, Inc. Control of processing parameters for substrate polishing with substrate precession
CN113159121B (zh) * 2021-03-16 2022-07-19 华中科技大学 基于先验知识模型的机器人磨抛去除量预测方法及设备
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
CN115972074B (zh) * 2022-11-08 2026-04-03 北京晶亦精微科技股份有限公司 化学机械抛光设备研磨时间调整方法、装置、设备及介质
US20250114896A1 (en) * 2023-10-05 2025-04-10 Applied Materials, Inc. Individually rotatable platens and control of carrier head sweep

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US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
CN1554118A (zh) * 2001-06-19 2004-12-08 Ӧ�ò��Ϲ�˾ 提供去除速率曲线处理的化学机械抛光设备的反馈控制
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
TW200607604A (en) * 2004-06-21 2006-03-01 Ebara Corp Polishing apparatus and polishing method
TW200822204A (en) * 2006-09-12 2008-05-16 Ebara Corp Polishing apparatus and polishing method

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US6544103B1 (en) * 2000-11-28 2003-04-08 Speedfam-Ipec Corporation Method to determine optimum geometry of a multizone carrier
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US8774958B2 (en) 2011-04-29 2014-07-08 Applied Materials, Inc. Selection of polishing parameters to generate removal profile

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1554118A (zh) * 2001-06-19 2004-12-08 Ӧ�ò��Ϲ�˾ 提供去除速率曲线处理的化学机械抛光设备的反馈控制
US20040023606A1 (en) * 2002-01-17 2004-02-05 Yuchun Wang Advanced chemical mechanical polishing system with smart endpoint detection
TW200607604A (en) * 2004-06-21 2006-03-01 Ebara Corp Polishing apparatus and polishing method
JP2006043873A (ja) * 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
TW200822204A (en) * 2006-09-12 2008-05-16 Ebara Corp Polishing apparatus and polishing method

Also Published As

Publication number Publication date
US20120277897A1 (en) 2012-11-01
US20160096251A1 (en) 2016-04-07
TW201313392A (zh) 2013-04-01
KR101831309B1 (ko) 2018-02-22
US9213340B2 (en) 2015-12-15
US10493590B2 (en) 2019-12-03
KR20140028045A (ko) 2014-03-07
JP2014513434A (ja) 2014-05-29
US8774958B2 (en) 2014-07-08
WO2012148859A2 (en) 2012-11-01
TWI668078B (zh) 2019-08-11
US20140277670A1 (en) 2014-09-18
KR101834711B1 (ko) 2018-03-05
TW201736043A (zh) 2017-10-16
WO2012148859A3 (en) 2013-03-21
KR20170071609A (ko) 2017-06-23

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