JP2014510489A5 - - Google Patents

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Publication number
JP2014510489A5
JP2014510489A5 JP2014500501A JP2014500501A JP2014510489A5 JP 2014510489 A5 JP2014510489 A5 JP 2014510489A5 JP 2014500501 A JP2014500501 A JP 2014500501A JP 2014500501 A JP2014500501 A JP 2014500501A JP 2014510489 A5 JP2014510489 A5 JP 2014510489A5
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JP
Japan
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array
cmut
cmut cells
bulk
cells
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JP2014500501A
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English (en)
Japanese (ja)
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JP5961246B2 (ja
JP2014510489A (ja
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Priority claimed from PCT/IB2012/051173 external-priority patent/WO2012127360A2/en
Publication of JP2014510489A publication Critical patent/JP2014510489A/ja
Publication of JP2014510489A5 publication Critical patent/JP2014510489A5/ja
Application granted granted Critical
Publication of JP5961246B2 publication Critical patent/JP5961246B2/ja
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JP2014500501A 2011-03-22 2012-03-13 基板に対して抑制された音響結合を持つ超音波cmut Active JP5961246B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161466172P 2011-03-22 2011-03-22
US61/466,172 2011-03-22
PCT/IB2012/051173 WO2012127360A2 (en) 2011-03-22 2012-03-13 Ultrasonic cmut with suppressed acoustic coupling to the substrate

Publications (3)

Publication Number Publication Date
JP2014510489A JP2014510489A (ja) 2014-04-24
JP2014510489A5 true JP2014510489A5 (OSRAM) 2015-04-16
JP5961246B2 JP5961246B2 (ja) 2016-08-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014500501A Active JP5961246B2 (ja) 2011-03-22 2012-03-13 基板に対して抑制された音響結合を持つ超音波cmut

Country Status (7)

Country Link
US (1) US20130331705A1 (OSRAM)
EP (1) EP2688686B1 (OSRAM)
JP (1) JP5961246B2 (OSRAM)
CN (1) CN103501922B (OSRAM)
BR (1) BR112013023981A2 (OSRAM)
RU (1) RU2589272C2 (OSRAM)
WO (1) WO2012127360A2 (OSRAM)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2607720C2 (ru) * 2011-12-20 2017-01-10 Конинклейке Филипс Н.В. Устройство ультразвукового преобразователя и способ его изготовления
GB2513884B (en) 2013-05-08 2015-06-17 Univ Bristol Method and apparatus for producing an acoustic field
DE102013223695B4 (de) * 2013-11-20 2016-09-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zum herstellen eines kapazitiven ultraschallwandlers und anordnung einer mehrzahl von kapazitiven ultraschallwandlern
KR102155695B1 (ko) 2014-02-12 2020-09-21 삼성전자주식회사 전기 음향 변환기
GB2530036A (en) 2014-09-09 2016-03-16 Ultrahaptics Ltd Method and apparatus for modulating haptic feedback
WO2016083273A1 (en) * 2014-11-25 2016-06-02 Koninklijke Philips N.V. Ultrasound system and method
KR102515997B1 (ko) 2015-02-20 2023-03-29 울트라햅틱스 아이피 엘티디 햅틱 시스템에서의 인식
ES2908299T3 (es) 2015-02-20 2022-04-28 Ultrahaptics Ip Ltd Mejoras del algoritmo en un sistema háptico
WO2017001636A1 (en) * 2015-06-30 2017-01-05 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
EP3316791B1 (en) 2015-07-02 2020-08-05 Koninklijke Philips N.V. Multi-mode capacitive micromachined ultrasound transducer and associated devices and systems
DE102015212683A1 (de) * 2015-07-07 2017-01-12 Robert Bosch Gmbh Schallwandler und Einbauanordnung mit einem Schallwandler
US10818162B2 (en) 2015-07-16 2020-10-27 Ultrahaptics Ip Ltd Calibration techniques in haptic systems
US9751108B2 (en) * 2015-07-31 2017-09-05 Texas Instruments Incorporated Extended range ultrasound transducer
BR112018007728A2 (pt) 2015-11-24 2018-10-23 Halliburton Energy Services Inc transdutor ultrassônico, e, métodos para produzir um transdutor ultrassônico e para imageamento ultrassônico de uma formação.
US10497856B2 (en) 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US10268275B2 (en) 2016-08-03 2019-04-23 Ultrahaptics Ip Ltd Three-dimensional perceptions in haptic systems
US20190357882A1 (en) * 2016-11-22 2019-11-28 Koninklijke Philips N.V. Ultrasound device and acoustic component for use in such a device
US11039814B2 (en) 2016-12-04 2021-06-22 Exo Imaging, Inc. Imaging devices having piezoelectric transducers
US10943578B2 (en) 2016-12-13 2021-03-09 Ultrahaptics Ip Ltd Driving techniques for phased-array systems
EP3459646A1 (en) * 2017-09-22 2019-03-27 Koninklijke Philips N.V. Ultrasound transducer device and method for controlling the same
US11531395B2 (en) 2017-11-26 2022-12-20 Ultrahaptics Ip Ltd Haptic effects from focused acoustic fields
WO2019122912A1 (en) 2017-12-22 2019-06-27 Ultrahaptics Limited Tracking in haptic systems
EP3729418B1 (en) 2017-12-22 2024-11-20 Ultrahaptics Ip Ltd Minimizing unwanted responses in haptic systems
US10966683B2 (en) * 2018-03-22 2021-04-06 Exo Imaging Inc. Integrated ultrasonic transducers
US10656007B2 (en) 2018-04-11 2020-05-19 Exo Imaging Inc. Asymmetrical ultrasound transducer array
US10648852B2 (en) 2018-04-11 2020-05-12 Exo Imaging Inc. Imaging devices having piezoelectric transceivers
WO2019211616A1 (en) 2018-05-02 2019-11-07 Ultrahaptics Limited Blocking plate structure for improved acoustic transmission efficiency
WO2019226547A1 (en) 2018-05-21 2019-11-28 Exo Imaging, Inc. Ultrasonic transducers with q spoiling
CN112805843B (zh) 2018-08-01 2024-06-14 艾科索成像公司 用于集成具有混合触点的超声换能器的系统和方法
US11098951B2 (en) 2018-09-09 2021-08-24 Ultrahaptics Ip Ltd Ultrasonic-assisted liquid manipulation
US12373033B2 (en) 2019-01-04 2025-07-29 Ultrahaptics Ip Ltd Mid-air haptic textures
WO2020141330A2 (en) 2019-01-04 2020-07-09 Ultrahaptics Ip Ltd Mid-air haptic textures
US11842517B2 (en) 2019-04-12 2023-12-12 Ultrahaptics Ip Ltd Using iterative 3D-model fitting for domain adaptation of a hand-pose-estimation neural network
JP2023511802A (ja) 2019-09-12 2023-03-23 エコー イメージング,インク. 端部溝、仮想ピボット、および非拘束状態の境界を介する、mut結合効率および帯域幅の増加
CA3154040A1 (en) 2019-10-13 2021-04-22 Benjamin John Oliver LONG Dynamic capping with virtual microphones
US11374586B2 (en) 2019-10-13 2022-06-28 Ultraleap Limited Reducing harmonic distortion by dithering
US11715453B2 (en) 2019-12-25 2023-08-01 Ultraleap Limited Acoustic transducer structures
US11816267B2 (en) 2020-06-23 2023-11-14 Ultraleap Limited Features of airborne ultrasonic fields
US11886639B2 (en) 2020-09-17 2024-01-30 Ultraleap Limited Ultrahapticons
CA3154568A1 (en) * 2021-03-29 2022-09-29 Exo Imaging, Inc. Trenches for the reduction of cross-talk in mut arrays
US11819881B2 (en) 2021-03-31 2023-11-21 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
US11951512B2 (en) 2021-03-31 2024-04-09 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
WO2022254205A1 (en) * 2021-06-02 2022-12-08 Ultraleap Limited Electromechanical transducer mount
US12486159B2 (en) 2021-06-30 2025-12-02 Exo Imaging, Inc. Micro-machined ultrasound transducers with insulation layer and methods of manufacture

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2117415C1 (ru) * 1994-05-31 1998-08-10 Шанаурин Александр Михайлович Электростатический конденсаторный преобразователь
US6262946B1 (en) 1999-09-29 2001-07-17 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling
US6443901B1 (en) * 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6862254B2 (en) 2000-10-19 2005-03-01 Sensant Corporation Microfabricated ultrasonic transducer with suppressed substrate modes
US6669644B2 (en) * 2001-07-31 2003-12-30 Koninklijke Philips Electronics N.V. Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy
US6831394B2 (en) 2002-12-11 2004-12-14 General Electric Company Backing material for micromachined ultrasonic transducer devices
US20040190377A1 (en) * 2003-03-06 2004-09-30 Lewandowski Robert Stephen Method and means for isolating elements of a sensor array
US7303530B2 (en) * 2003-05-22 2007-12-04 Siemens Medical Solutions Usa, Inc. Transducer arrays with an integrated sensor and methods of use
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
US7545075B2 (en) 2004-06-04 2009-06-09 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
US7888709B2 (en) * 2004-09-15 2011-02-15 Sonetics Ultrasound, Inc. Capacitive micromachined ultrasonic transducer and manufacturing method
CN101166473B (zh) * 2005-04-25 2012-11-14 皇家飞利浦电子股份有限公司 通过超声换能器系统连续成像的装置
JP4791534B2 (ja) * 2005-05-18 2011-10-12 コロ テクノロジーズ インコーポレイテッド 超小型電気機械デバイスの製造方法
CN101558552B (zh) * 2005-06-17 2017-05-31 科隆科技公司 具有绝缘延伸部的微机电换能器
JP4724505B2 (ja) * 2005-09-09 2011-07-13 株式会社日立製作所 超音波探触子およびその製造方法
US7741686B2 (en) * 2006-07-20 2010-06-22 The Board Of Trustees Of The Leland Stanford Junior University Trench isolated capacitive micromachined ultrasonic transducer arrays with a supporting frame
EP2070114B1 (en) * 2006-09-25 2010-01-06 Koninklijke Philips Electronics N.V. Flip-chip interconnection through chip vias
US7843022B2 (en) 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
US8207652B2 (en) * 2009-06-16 2012-06-26 General Electric Company Ultrasound transducer with improved acoustic performance
JP5578810B2 (ja) * 2009-06-19 2014-08-27 キヤノン株式会社 静電容量型の電気機械変換装置
KR20110002630A (ko) * 2009-07-02 2011-01-10 삼성전자주식회사 휴대 단말기의 카메라 운용 방법 및 장치
JP5495918B2 (ja) * 2009-07-24 2014-05-21 キヤノン株式会社 電気機械変換装置、及び電気機械変換装置の作製方法
US8455289B1 (en) * 2011-12-02 2013-06-04 Texas Instruments Incorporated Low frequency CMUT with thick oxide

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