JP2014503607A5 - - Google Patents
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- Publication number
- JP2014503607A5 JP2014503607A5 JP2013537685A JP2013537685A JP2014503607A5 JP 2014503607 A5 JP2014503607 A5 JP 2014503607A5 JP 2013537685 A JP2013537685 A JP 2013537685A JP 2013537685 A JP2013537685 A JP 2013537685A JP 2014503607 A5 JP2014503607 A5 JP 2014503607A5
- Authority
- JP
- Japan
- Prior art keywords
- glycine
- composition
- alkali metal
- metal salt
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims 4
- 239000004471 Glycine Substances 0.000 claims 2
- 229910052783 alkali metal Inorganic materials 0.000 claims 2
- -1 alkali metal salt Chemical class 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US40979110P | 2010-11-03 | 2010-11-03 | |
| US61/409,791 | 2010-11-03 | ||
| PCT/US2011/056743 WO2012061010A2 (en) | 2010-11-03 | 2011-10-18 | Polymer etchant and method of using same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014503607A JP2014503607A (ja) | 2014-02-13 |
| JP2014503607A5 true JP2014503607A5 (OSRAM) | 2014-10-23 |
Family
ID=46024998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013537685A Ceased JP2014503607A (ja) | 2010-11-03 | 2011-10-18 | ポリマーエッチング剤及びその使用方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9909063B2 (OSRAM) |
| JP (1) | JP2014503607A (OSRAM) |
| KR (1) | KR20130132828A (OSRAM) |
| CN (1) | CN103189470B (OSRAM) |
| TW (1) | TW201224123A (OSRAM) |
| WO (1) | WO2012061010A2 (OSRAM) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9674938B2 (en) | 2010-11-03 | 2017-06-06 | 3M Innovative Properties Company | Flexible LED device for thermal management |
| CN103190204B (zh) | 2010-11-03 | 2016-11-16 | 3M创新有限公司 | 具有无引线接合管芯的柔性led器件 |
| WO2012091971A1 (en) | 2010-12-29 | 2012-07-05 | 3M Innovative Properties Company | Remote phosphor led constructions |
| CN103282820B (zh) | 2010-12-29 | 2016-10-26 | 3M创新有限公司 | Led合色器 |
| CN203932096U (zh) | 2011-02-18 | 2014-11-05 | 3M创新有限公司 | 柔性发光半导体装置以及用于支承并电连接发光半导体装置的柔性制品 |
| WO2013025402A2 (en) | 2011-08-17 | 2013-02-21 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
| CN104024723B (zh) | 2011-11-23 | 2016-08-24 | 3M创新有限公司 | 具有三维结构的柔性发光半导体器件 |
| EP2859594A4 (en) | 2012-06-01 | 2016-04-06 | 3M Innovative Properties Co | HYBRID LIGHT BULBS WITH COMBINATIONS OF REMOTE PHOSPHORUS LEDs AND DIRECT EMITTING LEDS |
| EP2896078A4 (en) | 2012-09-13 | 2016-05-25 | 3M Innovative Properties Co | EFFICIENT LIGHTING SYSTEM WITH A LARGE COLOR RANGE |
| WO2014113045A1 (en) | 2013-01-16 | 2014-07-24 | 3M Innovative Properties Company | Light emitting semiconductor device and substrate therefore |
| US10692843B2 (en) | 2013-12-04 | 2020-06-23 | 3M Innovative Properties Company | Flexible light emitting semiconductor device with large area conduit |
| JP2017524542A (ja) | 2014-05-28 | 2017-08-31 | スリーエム イノベイティブ プロパティズ カンパニー | 可撓性基板上のmemsデバイス |
| CN208657154U (zh) | 2015-03-20 | 2019-03-26 | 3M创新有限公司 | 用于附接发光半导体装置的柔性多层基板 |
| KR101874194B1 (ko) * | 2016-11-09 | 2018-07-03 | 경희대학교 산학협력단 | 고속 롤투롤 공정을 이용한 유연소자의 제조 방법 |
| JP2020515903A (ja) | 2017-03-31 | 2020-05-28 | スリーエム イノベイティブ プロパティズ カンパニー | 光学システム |
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| US3448098A (en) | 1966-09-27 | 1969-06-03 | Merck & Co Inc | Production of guanylic acid |
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| FR2630550A1 (fr) | 1988-04-22 | 1989-10-27 | Radiotechnique Compelec | Procede de montage d'elements optiques sur un support et circuit optique ainsi obtenu |
| US4975312A (en) | 1988-06-20 | 1990-12-04 | Foster-Miller, Inc. | Multiaxially oriented thermotropic polymer substrate for printed wire board |
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| US5289630A (en) | 1991-07-22 | 1994-03-01 | Macdermid, Incorporated | Process for fabricating multilayer printed circuits |
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| JP3186834B2 (ja) | 1992-04-28 | 2001-07-11 | 住友金属鉱山株式会社 | ポリイミド樹脂溶解用エッチング液およびそれを使用したスルーホールのエッチング加工方法 |
| JP3273825B2 (ja) | 1993-04-14 | 2002-04-15 | 三井化学株式会社 | ポリイミド樹脂のエッチング方法 |
| JPH06302586A (ja) | 1993-04-14 | 1994-10-28 | Mitsui Toatsu Chem Inc | ポリイミドエッチング液及び廃液処理方法 |
| JP3535602B2 (ja) | 1995-03-23 | 2004-06-07 | 松下電器産業株式会社 | 面実装型led |
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| US6218022B1 (en) | 1996-09-20 | 2001-04-17 | Toray Engineering Co., Ltd. | Resin etching solution and process for etching polyimide resins |
| JP2001288286A (ja) | 2000-02-01 | 2001-10-16 | Toray Ind Inc | エッチング方法 |
| JP2001310959A (ja) | 2000-02-23 | 2001-11-06 | Toray Ind Inc | 樹脂膜のウエットエッチング用エッチング液及びそれを用いて成るエッチング方法 |
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| US6923919B2 (en) * | 2000-07-18 | 2005-08-02 | 3M Innovative Properties Company | Liquid crystal polymers for flexible circuits |
| US6403211B1 (en) * | 2000-07-18 | 2002-06-11 | 3M Innovative Properties Company | Liquid crystal polymer for flexible circuits |
| JP2002180044A (ja) | 2000-12-07 | 2002-06-26 | Toray Eng Co Ltd | 熱可塑性ポリイミド樹脂用エッチング液 |
| EP1389496A1 (en) | 2001-05-22 | 2004-02-18 | Mitsubishi Chemical Corporation | Method for cleaning surface of substrate |
| JP4326887B2 (ja) | 2003-09-08 | 2009-09-09 | 新日鐵化学株式会社 | 配線基板用積層体 |
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| JP2007027278A (ja) | 2005-07-13 | 2007-02-01 | Shinko Electric Ind Co Ltd | 半導体装置および半導体装置の製造方法 |
| TW200709471A (en) | 2005-08-29 | 2007-03-01 | Shane Harrah | Bendable high flux LED array |
| US20070120089A1 (en) | 2005-11-28 | 2007-05-31 | 3M Innovative Properties Company | Polymer etchant and method of using same |
| KR101347486B1 (ko) | 2006-01-31 | 2014-01-02 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 유연성 포일 구조를 구비한 led 조명 조립체 |
| WO2008039730A1 (en) * | 2006-09-25 | 2008-04-03 | Advanced Technology Materials, Inc. | Compositions and methods for the removal of photoresist for a wafer rework application |
| US8049112B2 (en) | 2007-04-13 | 2011-11-01 | 3M Innovative Properties Company | Flexible circuit with cover layer |
| FR2934916B1 (fr) | 2008-08-06 | 2013-09-20 | Laurain | Support de diodes electroluminescentes et procede de realisation d'un circuit de diodes electroluminescentes avec un tel support. |
| JP5379441B2 (ja) * | 2008-10-09 | 2013-12-25 | 関東化学株式会社 | 基板処理用アルカリ性水溶液組成物 |
| JP2010251376A (ja) | 2009-04-10 | 2010-11-04 | Sumitomo Electric Printed Circuit Inc | 配線体,その製造方法および電子機器 |
| JP2012064841A (ja) | 2010-09-17 | 2012-03-29 | Citizen Holdings Co Ltd | 半導体発光装置 |
| CN103190204B (zh) | 2010-11-03 | 2016-11-16 | 3M创新有限公司 | 具有无引线接合管芯的柔性led器件 |
| US9674938B2 (en) | 2010-11-03 | 2017-06-06 | 3M Innovative Properties Company | Flexible LED device for thermal management |
| KR20130143067A (ko) | 2010-11-03 | 2013-12-30 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 가요성 led 디바이스 및 제조 방법 |
| CN203932096U (zh) | 2011-02-18 | 2014-11-05 | 3M创新有限公司 | 柔性发光半导体装置以及用于支承并电连接发光半导体装置的柔性制品 |
| WO2012112666A2 (en) | 2011-02-18 | 2012-08-23 | 3M Innovate Properties Company | Light emitting semiconductor device having multi-level substrate |
| WO2012112310A1 (en) | 2011-02-18 | 2012-08-23 | 3M Innovative Properties Company | Flexible light emitting semiconductor device having thin dielectric substrate |
| WO2013025402A2 (en) | 2011-08-17 | 2013-02-21 | 3M Innovative Properties Company | Two part flexible light emitting semiconductor device |
-
2011
- 2011-10-18 US US13/882,068 patent/US9909063B2/en not_active Expired - Fee Related
- 2011-10-18 JP JP2013537685A patent/JP2014503607A/ja not_active Ceased
- 2011-10-18 KR KR20137013716A patent/KR20130132828A/ko not_active Ceased
- 2011-10-18 CN CN201180052625.7A patent/CN103189470B/zh not_active Expired - Fee Related
- 2011-10-18 WO PCT/US2011/056743 patent/WO2012061010A2/en not_active Ceased
- 2011-11-02 TW TW100140000A patent/TW201224123A/zh unknown
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