JP2014236007A - 透明導電膜 - Google Patents
透明導電膜 Download PDFInfo
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- JP2014236007A JP2014236007A JP2014112507A JP2014112507A JP2014236007A JP 2014236007 A JP2014236007 A JP 2014236007A JP 2014112507 A JP2014112507 A JP 2014112507A JP 2014112507 A JP2014112507 A JP 2014112507A JP 2014236007 A JP2014236007 A JP 2014236007A
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- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000010410 layer Substances 0.000 claims description 71
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 42
- 239000000463 material Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 230000006698 induction Effects 0.000 claims description 9
- 239000004417 polycarbonate Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 229920000515 polycarbonate Polymers 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 5
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- -1 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000002861 polymer material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 39
- 239000004020 conductor Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000007641 inkjet printing Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012994 photoredox catalyst Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0108—Transparent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09681—Mesh conductors, e.g. as a ground plane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Manufacturing & Machinery (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Non-Insulated Conductors (AREA)
- Laminated Bodies (AREA)
- Position Input By Displaying (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
本体と前記本体の一側から延びるように形成される可撓性接続部材を含み、前記可撓性接続部材の幅は前記可撓性接続部材が延びる前記本体の一側の幅より小さく、前記可撓性接続部材に導通配線を設置し、前記本体は誘導領域及び前記誘導領域のエッジに位置する枠領域を含む透明基板と、
格子状を呈し、前記本体の誘導領域の一側に設置され、互いに交差する導電ワイヤを含む導電層と、
前記本体の枠領域の一側に設置され、前記導電層はそれによって前記導通配線に電気接続されるリード線電極とを含む。
前記枠領域の表面に直接に形成される。
前記リード線電極は前記枠領域に対応する前記基質層の前記透明基板から離れた表面に直接形成される。
前記第二格子凹溝は、幅が0.2μm〜5μmであり、高さが2μm〜6μmであり、前記第二格子凹溝の幅に対する高さの比が1より大きい。
20 導電層
30 リード線電極
40 基質層
110 本体
112 誘導領域
114 枠領域
120 可撓性接続部材
122 導通配線
Claims (13)
- 透明導電膜であって、
本体と前記本体の一側から延びるように形成される可撓性接続部材を含み、前記可撓性接続部材の幅は前記可撓性接続部材が延びる前記本体の一側の幅より小さく、前記可撓性接続部材に導通配線を設置し、前記本体は誘導領域及び前記誘導領域のエッジに位置する枠領域を含む透明基板と、
格子状を呈し、前記本体の誘導領域の一側に設置され、互いに交差する導電ワイヤを含む導電層と、
前記本体の枠領域の一側に設置され、前記導電層はそれによって前記導通配線に電気接続されるリード線電極とを含むことを特徴とする透明導電膜。 - 前記本体の誘導領域の表面に、前記導電層を収容する第一格子凹溝が設けられることを特徴とする請求項1に記載の透明導電膜。
- 前記本体の枠領域の表面に第二格子凹溝が設けられ、前記第二格子凹溝と第一格子凹溝はいずれも前記本体の同じ側に位置し、前記リード線電極は前記第二格子凹溝に収容されて、又は、
前記枠領域の表面に直接形成されることを特徴とする請求項2に記載の透明導電膜。 - 前記透明基板の一側に設置される基質層を更に含み、前記誘導領域に対応する前記基質層の前記透明基板から離れる表面に、前記導電層を収容する第一格子凹溝を設けることを特徴とする請求項1に記載の透明導電膜。
- 前記リード線電極は、前記枠領域に対応する前記基質層の前記透明基板から離れる表面に設けられる第二格子凹溝に収容され、又は、
前記リード線電極は前記枠領域に対応する前記基質層の前記透明基板から離れる表面に直接形成されることを特徴とする請求項4に記載の透明導電膜。 - 前記基質層の材質は硬化型接着剤、インプリント接着剤又はポリカーボネートであることを特徴とする請求項4に記載の透明導電膜。
- 前記第一格子凹溝は、幅が0.2μm〜5μmであり、高さが2μm〜6μmであり、前記第一格子凹溝の幅に対する高さの比が1より大きく、
前記第二格子凹溝は、幅が0.2μm〜5μmであり、高さが2μm〜6μmであり、前記第二格子凹溝の幅に対する高さの比が1より大きいことを特徴とする請求項3又は5に記載の透明導電膜。 - 前記第一格子凹溝の底部及び/又は前記第二格子凹溝の底部は非平面構造であることを特徴とする請求項7に記載の透明導電膜。
- 前記リード線電極は格子状又は帯状であり、格子状の前記リード線電極は、導電ワイヤを互いに交差することによって形成され、帯状の前記リード線電極は、その最小幅が10μm〜200μmであり、高さが5μm〜10μmであることを特徴とする請求項1に記載の透明導電膜。
- 前記導通配線は格子状又は帯状であり、格子状の前記導通配線は導電ワイヤを互いに交差するように形成されることを特徴とする請求項1に記載の透明導電膜。
- 前記透明基板の材質はポリエチレンテレフタレート、ポリカーボネート又はポリメチルメタアクリレートであることを特徴とする請求項1に記載の透明導電膜。
- 前記導電ワイヤの材質は導電金属、カーボンナノチューブ、グラフェンインク及び導電性高分子材料中の少なくとも一種であることを特徴とする請求項1に記載の透明導電膜。
- 前記透明基板、導電層及びリード線電極を少なくとも部分的に被覆する透明保護層をさらに含むことを特徴とする請求項1に記載の透明導電膜。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310209909.3A CN103295671B (zh) | 2013-05-30 | 2013-05-30 | 透明导电膜 |
CN201310209909.3 | 2013-05-30 |
Publications (2)
Publication Number | Publication Date |
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JP2014236007A true JP2014236007A (ja) | 2014-12-15 |
JP5983960B2 JP5983960B2 (ja) | 2016-09-06 |
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Application Number | Title | Priority Date | Filing Date |
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JP2014112507A Expired - Fee Related JP5983960B2 (ja) | 2013-05-30 | 2014-05-30 | 透明導電膜 |
Country Status (5)
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US (1) | US9516754B2 (ja) |
JP (1) | JP5983960B2 (ja) |
KR (1) | KR101648622B1 (ja) |
CN (1) | CN103295671B (ja) |
TW (1) | TWI533333B (ja) |
Cited By (3)
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JPWO2018003399A1 (ja) * | 2016-06-30 | 2018-07-05 | 株式会社コイネックス | 銅配線およびそれを用いた電子機器、タッチパッド、タッチパネル |
JP2020523233A (ja) * | 2017-07-13 | 2020-08-06 | ヒューレット−パッカード デベロップメント カンパニー エル.ピー.Hewlett‐Packard Development Company, L.P. | コーティング組成物 |
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US20140353013A1 (en) | 2014-12-04 |
TW201445585A (zh) | 2014-12-01 |
CN103295671B (zh) | 2016-08-10 |
US9516754B2 (en) | 2016-12-06 |
KR101648622B1 (ko) | 2016-08-16 |
JP5983960B2 (ja) | 2016-09-06 |
TWI533333B (zh) | 2016-05-11 |
KR20140142150A (ko) | 2014-12-11 |
CN103295671A (zh) | 2013-09-11 |
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