JP2014206467A5 - - Google Patents
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- Publication number
- JP2014206467A5 JP2014206467A5 JP2013084298A JP2013084298A JP2014206467A5 JP 2014206467 A5 JP2014206467 A5 JP 2014206467A5 JP 2013084298 A JP2013084298 A JP 2013084298A JP 2013084298 A JP2013084298 A JP 2013084298A JP 2014206467 A5 JP2014206467 A5 JP 2014206467A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- film thickness
- estimated
- film
- index
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001228 spectrum Methods 0.000 claims description 43
- 238000004381 surface treatment Methods 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 18
- 238000000034 method Methods 0.000 claims description 14
- 238000005259 measurement Methods 0.000 claims description 13
- 239000012528 membrane Substances 0.000 claims description 13
- 238000012806 monitoring device Methods 0.000 claims description 8
- 238000012544 monitoring process Methods 0.000 claims description 8
- 238000013215 result calculation Methods 0.000 claims description 7
- 230000007423 decrease Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000003595 spectral effect Effects 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000006185 dispersion Substances 0.000 claims description 3
- 238000004364 calculation method Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 239000013307 optical fiber Substances 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013084298A JP6107353B2 (ja) | 2013-04-12 | 2013-04-12 | 表面処理状況モニタリング装置 |
| US14/250,100 US9460973B2 (en) | 2013-04-12 | 2014-04-10 | Surface processing progress monitoring system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013084298A JP6107353B2 (ja) | 2013-04-12 | 2013-04-12 | 表面処理状況モニタリング装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014206467A JP2014206467A (ja) | 2014-10-30 |
| JP2014206467A5 true JP2014206467A5 (https=) | 2016-06-02 |
| JP6107353B2 JP6107353B2 (ja) | 2017-04-05 |
Family
ID=51686594
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013084298A Expired - Fee Related JP6107353B2 (ja) | 2013-04-12 | 2013-04-12 | 表面処理状況モニタリング装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9460973B2 (https=) |
| JP (1) | JP6107353B2 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6544171B2 (ja) * | 2015-09-16 | 2019-07-17 | 株式会社島津製作所 | 表面処理状況モニタリング装置 |
| US10734340B2 (en) * | 2018-05-15 | 2020-08-04 | Camtek Ltd. | Height measurements of conductive structural elements that are surrounded by a photoresist layer |
| CN114442435B (zh) * | 2022-01-24 | 2024-06-28 | 芯达半导体设备(苏州)有限公司 | 一种光刻胶喷雾式涂胶薄膜厚度计算方法 |
| CN116841126A (zh) * | 2022-03-25 | 2023-10-03 | 台湾积体电路制造股份有限公司 | 光罩护膜检测方法及其系统 |
| CN118335642B (zh) * | 2024-06-14 | 2024-09-27 | 北京特思迪半导体设备有限公司 | 薄膜厚度确定方法及设备 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5333049A (en) * | 1991-12-06 | 1994-07-26 | Hughes Aircraft Company | Apparatus and method for interferometrically measuring the thickness of thin films using full aperture irradiation |
| US5555472A (en) * | 1993-12-22 | 1996-09-10 | Integrated Process Equipment Corp. | Method and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signatures |
| US5729343A (en) * | 1995-11-16 | 1998-03-17 | Nikon Precision Inc. | Film thickness measurement apparatus with tilting stage and method of operation |
| US5982496A (en) * | 1996-03-11 | 1999-11-09 | Vlsi Technology, Inc. | Thin film thickness and optimal focus measuring using reflectivity |
| US5717490A (en) * | 1996-10-17 | 1998-02-10 | Lsi Logic Corporation | Method for identifying order skipping in spectroreflective film measurement equipment |
| JPH10325708A (ja) * | 1997-03-27 | 1998-12-08 | Toshiba Corp | エッチング深さ測定方法及びその装置 |
| US5798837A (en) * | 1997-07-11 | 1998-08-25 | Therma-Wave, Inc. | Thin film optical measurement system and method with calibrating ellipsometer |
| EP1111333A4 (en) * | 1999-06-29 | 2002-08-28 | Omron Tateisi Electronics Co | LIGHT SOURCE DEVICE, SPECTROSCOPE COMPRISING THE LIGHT SOURCE DEVICE AND LAYER THICKNESS SENSOR |
| ATE396497T1 (de) * | 2000-01-21 | 2008-06-15 | Hamamatsu Photonics Kk | Dickenmessvorrichtung, dickenmessverfahren und nassätzvorrichtung und nassätzverfahren, die diese verwenden |
| JP3946470B2 (ja) * | 2001-03-12 | 2007-07-18 | 株式会社デンソー | 半導体層の膜厚測定方法及び半導体基板の製造方法 |
| US6972848B2 (en) * | 2003-03-04 | 2005-12-06 | Hitach High-Technologies Corporation | Semiconductor fabricating apparatus with function of determining etching processing state |
| EP1611411A2 (en) * | 2003-03-26 | 2006-01-04 | Southwest Sciences Incorporated | Method and apparatus for imaging internal structures of transparent and translucent materials |
| US6999180B1 (en) * | 2003-04-02 | 2006-02-14 | Kla-Tencor Technologies Corporation | Optical film topography and thickness measurement |
| EP1962080B1 (de) * | 2007-02-21 | 2011-06-01 | Agfa HealthCare N.V. | System zur optischen Kohärenztomographie |
| JP5387450B2 (ja) * | 2010-03-04 | 2014-01-15 | 信越半導体株式会社 | Ｓｏｉウェーハの設計方法及び製造方法 |
| GB2478590A (en) * | 2010-03-12 | 2011-09-14 | Precitec Optronik Gmbh | Apparatus and method for monitoring a thickness of a silicon wafer |
| US8954186B2 (en) * | 2010-07-30 | 2015-02-10 | Applied Materials, Inc. | Selecting reference libraries for monitoring of multiple zones on a substrate |
| JP2013048183A (ja) * | 2011-08-29 | 2013-03-07 | Shimadzu Corp | エッチングモニタリング装置 |
-
2013
- 2013-04-12 JP JP2013084298A patent/JP6107353B2/ja not_active Expired - Fee Related
-
2014
- 2014-04-10 US US14/250,100 patent/US9460973B2/en not_active Expired - Fee Related
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