JP2014194415A - 直接噴射相転移温度制御システム - Google Patents

直接噴射相転移温度制御システム Download PDF

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Publication number
JP2014194415A
JP2014194415A JP2014049579A JP2014049579A JP2014194415A JP 2014194415 A JP2014194415 A JP 2014194415A JP 2014049579 A JP2014049579 A JP 2014049579A JP 2014049579 A JP2014049579 A JP 2014049579A JP 2014194415 A JP2014194415 A JP 2014194415A
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JP
Japan
Prior art keywords
temperature control
control unit
tcu
temperature
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014049579A
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English (en)
Japanese (ja)
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JP2014194415A5 (enExample
Inventor
a lopez Christopher
エー ロペス クリストファー
F Lemczyk Thomas
エフ レムジーク トーマス
A Davis Rick
エー デーヴィス リック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sensata Technologies Massachusetts Inc
Original Assignee
Sensata Technologies Massachusetts Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Technologies Massachusetts Inc filed Critical Sensata Technologies Massachusetts Inc
Publication of JP2014194415A publication Critical patent/JP2014194415A/ja
Publication of JP2014194415A5 publication Critical patent/JP2014194415A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2014049579A 2013-03-15 2014-03-13 直接噴射相転移温度制御システム Pending JP2014194415A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361789203P 2013-03-15 2013-03-15
US61/789,203 2013-03-15

Publications (2)

Publication Number Publication Date
JP2014194415A true JP2014194415A (ja) 2014-10-09
JP2014194415A5 JP2014194415A5 (enExample) 2017-04-13

Family

ID=50439133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014049579A Pending JP2014194415A (ja) 2013-03-15 2014-03-13 直接噴射相転移温度制御システム

Country Status (7)

Country Link
US (1) US9709622B2 (enExample)
EP (1) EP2778696A3 (enExample)
JP (1) JP2014194415A (enExample)
KR (1) KR20140113881A (enExample)
CN (1) CN104048457A (enExample)
SG (1) SG10201400683QA (enExample)
TW (1) TW201506420A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019513978A (ja) * 2016-03-08 2019-05-30 テンプトロニック コーポレイション 伝導性熱プローブによる温度強制システム及び方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9921265B2 (en) * 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
US20170248973A1 (en) * 2016-02-29 2017-08-31 Cascade Microtech, Inc. Probe systems and methods including active environmental control
KR102693821B1 (ko) * 2016-04-12 2024-08-12 (주)테크윙 전자부품 테스트용 핸들러
US11061069B2 (en) 2016-06-02 2021-07-13 Kes Systems, Inc. Burn-in test apparatus for semiconductor devices
WO2018148689A1 (en) * 2017-02-12 2018-08-16 ClearMotion, Inc. Hydraulic actuator a frequency dependent relative pressure ratio
US10677842B2 (en) * 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
WO2020176999A1 (en) * 2019-03-06 2020-09-10 Kingtiger Technology (Canada) Inc. System and method for verifying and analyzing memory for high performance computing systems
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
JP2023116051A (ja) * 2022-02-09 2023-08-22 株式会社アドバンテスト 電子部品ハンドリング装置、及び、電子部品試験装置
DE112023004426T5 (de) 2022-10-21 2025-09-11 Aem Singapore Pte. Ltd. Thermokopf zur unabhängigen steuerung von zonen
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11828795B1 (en) * 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
CN116520134B (zh) * 2022-11-09 2024-01-09 珠海精实测控技术股份有限公司 一种温控测试系统
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004527764A (ja) * 2001-05-31 2004-09-09 クライオテック インコーポレイテッド 電子デバイスの温度制御装置及び温度制御方法
US7100389B1 (en) * 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
JP2006523838A (ja) * 2003-03-19 2006-10-19 デルタ デザイン インコーポレーティッド 電子デバイスに係合するサーマル装置
JP2006310631A (ja) * 2005-04-28 2006-11-09 Fujitsu Ltd 温度制御方法及び温度制御装置
JP2007526636A (ja) * 2004-02-16 2007-09-13 デルタ デザイン インコーポレーティッド Ｉｃチップの温度を設定温度近くに維持するためのデュアルフィードバック制御システム
US7373967B1 (en) * 2004-06-28 2008-05-20 Delta Design, Inc. Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
US20090183866A1 (en) * 2008-01-18 2009-07-23 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
JP2010532918A (ja) * 2007-07-06 2010-10-14 ティオ ウイ、キム 熱伝達装置
US20110226442A1 (en) * 2010-03-17 2011-09-22 Delta Design, Inc. Alignment mechanism
JP2012185184A (ja) * 2012-07-02 2012-09-27 Seiko Epson Corp 電子部品の温度制御装置並びにハンドラ装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802370A (en) * 1986-12-29 1989-02-07 Halliburton Company Transducer and sensor apparatus and method
US5198753A (en) * 1990-06-29 1993-03-30 Digital Equipment Corporation Integrated circuit test fixture and method
AU2002253773A1 (en) * 2002-04-11 2003-11-17 Gintic Institute Of Manufacturing Technology Systems and methods for deformation measurement
CN1759643B (zh) * 2003-03-12 2011-06-08 富士通株式会社 电子设备的冷却结构
SG145539A1 (en) * 2004-03-09 2008-09-29 Micron Technology Inc Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
KR100903182B1 (ko) * 2005-09-28 2009-06-17 주식회사 엘지화학 차량용 전지팩의 냉각 시스템
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
CN202929508U (zh) * 2012-11-30 2013-05-08 河南省电力公司驻马店供电公司 无人值班变电站控制室环境智能管理装置
CN104345753A (zh) * 2013-07-25 2015-02-11 上海浦北信息科技有限公司 一种控温控湿测试台

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004527764A (ja) * 2001-05-31 2004-09-09 クライオテック インコーポレイテッド 電子デバイスの温度制御装置及び温度制御方法
US7100389B1 (en) * 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
JP2006523838A (ja) * 2003-03-19 2006-10-19 デルタ デザイン インコーポレーティッド 電子デバイスに係合するサーマル装置
JP2007526636A (ja) * 2004-02-16 2007-09-13 デルタ デザイン インコーポレーティッド Ｉｃチップの温度を設定温度近くに維持するためのデュアルフィードバック制御システム
US7373967B1 (en) * 2004-06-28 2008-05-20 Delta Design, Inc. Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
JP2006310631A (ja) * 2005-04-28 2006-11-09 Fujitsu Ltd 温度制御方法及び温度制御装置
JP2010532918A (ja) * 2007-07-06 2010-10-14 ティオ ウイ、キム 熱伝達装置
US20090183866A1 (en) * 2008-01-18 2009-07-23 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
US20110226442A1 (en) * 2010-03-17 2011-09-22 Delta Design, Inc. Alignment mechanism
JP2012185184A (ja) * 2012-07-02 2012-09-27 Seiko Epson Corp 電子部品の温度制御装置並びにハンドラ装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019513978A (ja) * 2016-03-08 2019-05-30 テンプトロニック コーポレイション 伝導性熱プローブによる温度強制システム及び方法

Also Published As

Publication number Publication date
US9709622B2 (en) 2017-07-18
SG10201400683QA (en) 2014-10-30
TW201506420A (zh) 2015-02-16
CN104048457A (zh) 2014-09-17
US20140260333A1 (en) 2014-09-18
EP2778696A2 (en) 2014-09-17
EP2778696A3 (en) 2017-05-10
KR20140113881A (ko) 2014-09-25

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