KR20140113881A - 직접 주입 상변화 온도 제어 장치 - Google Patents

직접 주입 상변화 온도 제어 장치 Download PDF

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Publication number
KR20140113881A
KR20140113881A KR1020140030200A KR20140030200A KR20140113881A KR 20140113881 A KR20140113881 A KR 20140113881A KR 1020140030200 A KR1020140030200 A KR 1020140030200A KR 20140030200 A KR20140030200 A KR 20140030200A KR 20140113881 A KR20140113881 A KR 20140113881A
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KR
South Korea
Prior art keywords
control unit
thermal control
thermal
tcu
test
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020140030200A
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English (en)
Korean (ko)
Inventor
크리스토퍼 에이 로페즈
토마스 에프 렘지크
릭 에이 다비스
Original Assignee
센사타 테크놀로지스 매사추세츠, 인크.
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Application filed by 센사타 테크놀로지스 매사추세츠, 인크. filed Critical 센사타 테크놀로지스 매사추세츠, 인크.
Publication of KR20140113881A publication Critical patent/KR20140113881A/ko
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sustainable Development (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020140030200A 2013-03-15 2014-03-14 직접 주입 상변화 온도 제어 장치 Ceased KR20140113881A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361789203P 2013-03-15 2013-03-15
US61/789,203 2013-03-15

Publications (1)

Publication Number Publication Date
KR20140113881A true KR20140113881A (ko) 2014-09-25

Family

ID=50439133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140030200A Ceased KR20140113881A (ko) 2013-03-15 2014-03-14 직접 주입 상변화 온도 제어 장치

Country Status (7)

Country Link
US (1) US9709622B2 (enExample)
EP (1) EP2778696A3 (enExample)
JP (1) JP2014194415A (enExample)
KR (1) KR20140113881A (enExample)
CN (1) CN104048457A (enExample)
SG (1) SG10201400683QA (enExample)
TW (1) TW201506420A (enExample)

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US9921265B2 (en) 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
US20170248973A1 (en) * 2016-02-29 2017-08-31 Cascade Microtech, Inc. Probe systems and methods including active environmental control
US20170261547A1 (en) * 2016-03-08 2017-09-14 Temptronic Corporation Temperature Forcing System and Method with Conductive Thermal Probes
KR102693821B1 (ko) * 2016-04-12 2024-08-12 (주)테크윙 전자부품 테스트용 핸들러
US11061069B2 (en) 2016-06-02 2021-07-13 Kes Systems, Inc. Burn-in test apparatus for semiconductor devices
WO2018148689A1 (en) * 2017-02-12 2018-08-16 ClearMotion, Inc. Hydraulic actuator a frequency dependent relative pressure ratio
US10677842B2 (en) * 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
US11862275B2 (en) * 2019-03-06 2024-01-02 Kingtiger Technology (Canada) Inc. System and method for verifying and analyzing memory for high performance computing systems
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11609266B2 (en) 2020-12-04 2023-03-21 Advantest Test Solutions, Inc. Active thermal interposer device
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
JP2023116051A (ja) * 2022-02-09 2023-08-22 株式会社アドバンテスト 電子部品ハンドリング装置、及び、電子部品試験装置
TWI886546B (zh) 2022-10-21 2025-06-11 新加坡商永科控股有限公司 用於獨立控制若干區域的熱能頭
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11828795B1 (en) * 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
CN116520134B (zh) * 2022-11-09 2024-01-09 珠海精实测控技术股份有限公司 一种温控测试系统
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement

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US4802370A (en) * 1986-12-29 1989-02-07 Halliburton Company Transducer and sensor apparatus and method
US5198753A (en) 1990-06-29 1993-03-30 Digital Equipment Corporation Integrated circuit test fixture and method
US6668570B2 (en) 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
AU2002253773A1 (en) * 2002-04-11 2003-11-17 Gintic Institute Of Manufacturing Technology Systems and methods for deformation measurement
US7100389B1 (en) * 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
WO2004082349A1 (ja) * 2003-03-12 2004-09-23 Fujitsu Limited 電子機器の冷却構造
US6975028B1 (en) * 2003-03-19 2005-12-13 Delta Design, Inc. Thermal apparatus for engaging electronic device
US7199597B2 (en) * 2004-02-16 2007-04-03 Delta Design, Inc. Dual feedback control system for maintaining the temperature of an IC-chip near a set-point
SG145539A1 (en) * 2004-03-09 2008-09-29 Micron Technology Inc Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof
US7373967B1 (en) * 2004-06-28 2008-05-20 Delta Design, Inc. Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits
JP4418772B2 (ja) 2005-04-28 2010-02-24 富士通マイクロエレクトロニクス株式会社 温度制御装置
KR100903182B1 (ko) * 2005-09-28 2009-06-17 주식회사 엘지화학 차량용 전지팩의 냉각 시스템
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
SG148900A1 (en) 2007-07-06 2009-01-29 Aem Singapore Pte Ltd A heat transfer device
US8274300B2 (en) * 2008-01-18 2012-09-25 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
US9500701B2 (en) 2010-03-17 2016-11-22 Delta Design, Inc. Alignment mechanism
JP2012185184A (ja) 2012-07-02 2012-09-27 Seiko Epson Corp 電子部品の温度制御装置並びにハンドラ装置
CN202929508U (zh) * 2012-11-30 2013-05-08 河南省电力公司驻马店供电公司 无人值班变电站控制室环境智能管理装置
CN104345753A (zh) * 2013-07-25 2015-02-11 上海浦北信息科技有限公司 一种控温控湿测试台

Also Published As

Publication number Publication date
EP2778696A3 (en) 2017-05-10
SG10201400683QA (en) 2014-10-30
JP2014194415A (ja) 2014-10-09
US20140260333A1 (en) 2014-09-18
TW201506420A (zh) 2015-02-16
EP2778696A2 (en) 2014-09-17
US9709622B2 (en) 2017-07-18
CN104048457A (zh) 2014-09-17

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