TW201506420A - 直接注射式相變溫度控制系統 - Google Patents

直接注射式相變溫度控制系統 Download PDF

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Publication number
TW201506420A
TW201506420A TW103109013A TW103109013A TW201506420A TW 201506420 A TW201506420 A TW 201506420A TW 103109013 A TW103109013 A TW 103109013A TW 103109013 A TW103109013 A TW 103109013A TW 201506420 A TW201506420 A TW 201506420A
Authority
TW
Taiwan
Prior art keywords
tcu
control unit
thermal control
thermal
evaporation chamber
Prior art date
Application number
TW103109013A
Other languages
English (en)
Chinese (zh)
Inventor
克里斯托弗 洛佩斯
湯瑪士 萊姆佳
雷克 戴維斯
Original Assignee
森薩塔科技麻薩諸塞公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 森薩塔科技麻薩諸塞公司 filed Critical 森薩塔科技麻薩諸塞公司
Publication of TW201506420A publication Critical patent/TW201506420A/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW103109013A 2013-03-15 2014-03-13 直接注射式相變溫度控制系統 TW201506420A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361789203P 2013-03-15 2013-03-15

Publications (1)

Publication Number Publication Date
TW201506420A true TW201506420A (zh) 2015-02-16

Family

ID=50439133

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103109013A TW201506420A (zh) 2013-03-15 2014-03-13 直接注射式相變溫度控制系統

Country Status (7)

Country Link
US (1) US9709622B2 (enExample)
EP (1) EP2778696A3 (enExample)
JP (1) JP2014194415A (enExample)
KR (1) KR20140113881A (enExample)
CN (1) CN104048457A (enExample)
SG (1) SG10201400683QA (enExample)
TW (1) TW201506420A (enExample)

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TWI623742B (zh) * 2016-02-29 2018-05-11 加斯凱德微科技公司 包含主動環境控制的探測系統和方法
TWI779042B (zh) * 2017-05-26 2022-10-01 日商愛德萬測試股份有限公司 測試設備及冷卻方法

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US20170261547A1 (en) * 2016-03-08 2017-09-14 Temptronic Corporation Temperature Forcing System and Method with Conductive Thermal Probes
KR102693821B1 (ko) * 2016-04-12 2024-08-12 (주)테크윙 전자부품 테스트용 핸들러
US11061069B2 (en) 2016-06-02 2021-07-13 Kes Systems, Inc. Burn-in test apparatus for semiconductor devices
WO2018148689A1 (en) * 2017-02-12 2018-08-16 ClearMotion, Inc. Hydraulic actuator a frequency dependent relative pressure ratio
WO2020176999A1 (en) * 2019-03-06 2020-09-10 Kingtiger Technology (Canada) Inc. System and method for verifying and analyzing memory for high performance computing systems
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11808812B2 (en) 2020-11-02 2023-11-07 Advantest Test Solutions, Inc. Passive carrier-based device delivery for slot-based high-volume semiconductor test system
US11567119B2 (en) 2020-12-04 2023-01-31 Advantest Test Solutions, Inc. Testing system including active thermal interposer device
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US12007411B2 (en) 2021-06-22 2024-06-11 Teradyne, Inc. Test socket having an automated lid
JP2023116051A (ja) * 2022-02-09 2023-08-22 株式会社アドバンテスト 電子部品ハンドリング装置、及び、電子部品試験装置
DE112023004426T5 (de) 2022-10-21 2025-09-11 Aem Singapore Pte. Ltd. Thermokopf zur unabhängigen steuerung von zonen
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
US11828795B1 (en) * 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
CN116520134B (zh) * 2022-11-09 2024-01-09 珠海精实测控技术股份有限公司 一种温控测试系统
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement

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US5198753A (en) * 1990-06-29 1993-03-30 Digital Equipment Corporation Integrated circuit test fixture and method
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
AU2002253773A1 (en) * 2002-04-11 2003-11-17 Gintic Institute Of Manufacturing Technology Systems and methods for deformation measurement
US7100389B1 (en) 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
CN1759643B (zh) * 2003-03-12 2011-06-08 富士通株式会社 电子设备的冷却结构
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JP4418772B2 (ja) 2005-04-28 2010-02-24 富士通マイクロエレクトロニクス株式会社 温度制御装置
KR100903182B1 (ko) * 2005-09-28 2009-06-17 주식회사 엘지화학 차량용 전지팩의 냉각 시스템
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US8274300B2 (en) * 2008-01-18 2012-09-25 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
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CN104345753A (zh) * 2013-07-25 2015-02-11 上海浦北信息科技有限公司 一种控温控湿测试台

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI623742B (zh) * 2016-02-29 2018-05-11 加斯凱德微科技公司 包含主動環境控制的探測系統和方法
TWI779042B (zh) * 2017-05-26 2022-10-01 日商愛德萬測試股份有限公司 測試設備及冷卻方法

Also Published As

Publication number Publication date
US9709622B2 (en) 2017-07-18
SG10201400683QA (en) 2014-10-30
CN104048457A (zh) 2014-09-17
US20140260333A1 (en) 2014-09-18
JP2014194415A (ja) 2014-10-09
EP2778696A2 (en) 2014-09-17
EP2778696A3 (en) 2017-05-10
KR20140113881A (ko) 2014-09-25

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