SG10201400683QA - Direct Injection Phase Change Temperature Control System - Google Patents
Direct Injection Phase Change Temperature Control SystemInfo
- Publication number
- SG10201400683QA SG10201400683QA SG10201400683QA SG10201400683QA SG10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA
- Authority
- SG
- Singapore
- Prior art keywords
- control system
- temperature control
- phase change
- direct injection
- change temperature
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361789203P | 2013-03-15 | 2013-03-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201400683QA true SG10201400683QA (en) | 2014-10-30 |
Family
ID=50439133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201400683QA SG10201400683QA (en) | 2013-03-15 | 2014-03-14 | Direct Injection Phase Change Temperature Control System |
Country Status (7)
Country | Link |
---|---|
US (1) | US9709622B2 (en) |
EP (1) | EP2778696A3 (en) |
JP (1) | JP2014194415A (en) |
KR (1) | KR20140113881A (en) |
CN (1) | CN104048457A (en) |
SG (1) | SG10201400683QA (en) |
TW (1) | TW201506420A (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9921265B2 (en) * | 2015-12-18 | 2018-03-20 | Sensata Technologies, Inc. | Thermal clutch for thermal control unit and methods related thereto |
US20170248973A1 (en) * | 2016-02-29 | 2017-08-31 | Cascade Microtech, Inc. | Probe systems and methods including active environmental control |
US20170261547A1 (en) * | 2016-03-08 | 2017-09-14 | Temptronic Corporation | Temperature Forcing System and Method with Conductive Thermal Probes |
KR20170116875A (en) * | 2016-04-12 | 2017-10-20 | (주)테크윙 | Handler for electric device test |
WO2017210108A1 (en) | 2016-06-02 | 2017-12-07 | Kes Systems, Inc. | System and methods for semiconductor burn-in test |
EP3580075A4 (en) * | 2017-02-12 | 2021-01-20 | Clearmotion, Inc. | Hydraulic actuator with a frequency dependent relative pressure ratio |
US10677842B2 (en) * | 2017-05-26 | 2020-06-09 | Advantest Corporation | DUT testing with configurable cooling control using DUT internal temperature data |
US11862275B2 (en) * | 2019-03-06 | 2024-01-02 | Kingtiger Technology (Canada) Inc. | System and method for verifying and analyzing memory for high performance computing systems |
US11754622B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Thermal control system for an automated test system |
US11867749B2 (en) | 2020-10-22 | 2024-01-09 | Teradyne, Inc. | Vision system for an automated test system |
US11899042B2 (en) | 2020-10-22 | 2024-02-13 | Teradyne, Inc. | Automated test system |
US11754596B2 (en) | 2020-10-22 | 2023-09-12 | Teradyne, Inc. | Test site configuration in an automated test system |
US11953519B2 (en) | 2020-10-22 | 2024-04-09 | Teradyne, Inc. | Modular automated test system |
US11573262B2 (en) * | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11656272B1 (en) | 2022-10-21 | 2023-05-23 | AEM Holdings Ltd. | Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones |
US11828795B1 (en) * | 2022-10-21 | 2023-11-28 | AEM Holdings Ltd. | Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones |
US11693051B1 (en) | 2022-10-21 | 2023-07-04 | AEM Holdings Ltd. | Thermal head for independent control of zones |
US11796589B1 (en) | 2022-10-21 | 2023-10-24 | AEM Holdings Ltd. | Thermal head for independent control of zones |
CN116500421B (en) * | 2022-11-09 | 2024-02-13 | 珠海精实测控技术股份有限公司 | Temperature control testing method |
US11828796B1 (en) | 2023-05-02 | 2023-11-28 | AEM Holdings Ltd. | Integrated heater and temperature measurement |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4802370A (en) * | 1986-12-29 | 1989-02-07 | Halliburton Company | Transducer and sensor apparatus and method |
US5198753A (en) | 1990-06-29 | 1993-03-30 | Digital Equipment Corporation | Integrated circuit test fixture and method |
US6668570B2 (en) * | 2001-05-31 | 2003-12-30 | Kryotech, Inc. | Apparatus and method for controlling the temperature of an electronic device under test |
US20050146708A1 (en) * | 2002-04-11 | 2005-07-07 | Xunqing Shi | Systems and methods for deformation measurement |
US7100389B1 (en) | 2002-07-16 | 2006-09-05 | Delta Design, Inc. | Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test |
WO2004082349A1 (en) * | 2003-03-12 | 2004-09-23 | Fujitsu Limited | Cooling structure for electronic equipment |
US6975028B1 (en) * | 2003-03-19 | 2005-12-13 | Delta Design, Inc. | Thermal apparatus for engaging electronic device |
US7199597B2 (en) * | 2004-02-16 | 2007-04-03 | Delta Design, Inc. | Dual feedback control system for maintaining the temperature of an IC-chip near a set-point |
SG145539A1 (en) * | 2004-03-09 | 2008-09-29 | Micron Technology Inc | Integrated circuit (ic) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereof |
US7373967B1 (en) | 2004-06-28 | 2008-05-20 | Delta Design, Inc. | Mechanical assembly, for regulating the temperature of an IC-Chip, having a gimbaled heat-exchanger with coiled springy conduits |
JP4418772B2 (en) * | 2005-04-28 | 2010-02-24 | 富士通マイクロエレクトロニクス株式会社 | Temperature control device |
KR100903182B1 (en) * | 2005-09-28 | 2009-06-17 | 주식회사 엘지화학 | Cooling System of Battery Pack for Vehicle |
US8151872B2 (en) * | 2007-03-16 | 2012-04-10 | Centipede Systems, Inc. | Method and apparatus for controlling temperature |
SG148900A1 (en) * | 2007-07-06 | 2009-01-29 | Aem Singapore Pte Ltd | A heat transfer device |
US8274300B2 (en) * | 2008-01-18 | 2012-09-25 | Kes Systems & Service (1993) Pte Ltd. | Thermal control unit for semiconductor testing |
US9500701B2 (en) | 2010-03-17 | 2016-11-22 | Delta Design, Inc. | Alignment mechanism |
JP2012185184A (en) | 2012-07-02 | 2012-09-27 | Seiko Epson Corp | Temperature control apparatus of electronic component, and handler apparatus |
CN202929508U (en) * | 2012-11-30 | 2013-05-08 | 河南省电力公司驻马店供电公司 | Unattended substation control room environment intelligent management apparatus |
CN104345753A (en) * | 2013-07-25 | 2015-02-11 | 上海浦北信息科技有限公司 | Humiture control test station |
-
2014
- 2014-03-13 TW TW103109013A patent/TW201506420A/en unknown
- 2014-03-13 US US14/210,084 patent/US9709622B2/en active Active
- 2014-03-13 JP JP2014049579A patent/JP2014194415A/en active Pending
- 2014-03-14 CN CN201410175361.XA patent/CN104048457A/en active Pending
- 2014-03-14 KR KR1020140030200A patent/KR20140113881A/en not_active Application Discontinuation
- 2014-03-14 EP EP14160006.4A patent/EP2778696A3/en not_active Withdrawn
- 2014-03-14 SG SG10201400683QA patent/SG10201400683QA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2014194415A (en) | 2014-10-09 |
EP2778696A3 (en) | 2017-05-10 |
CN104048457A (en) | 2014-09-17 |
US9709622B2 (en) | 2017-07-18 |
KR20140113881A (en) | 2014-09-25 |
EP2778696A2 (en) | 2014-09-17 |
TW201506420A (en) | 2015-02-16 |
US20140260333A1 (en) | 2014-09-18 |
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