SG10201400683QA - Direct Injection Phase Change Temperature Control System - Google Patents

Direct Injection Phase Change Temperature Control System

Info

Publication number
SG10201400683QA
SG10201400683QA SG10201400683QA SG10201400683QA SG10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA SG 10201400683Q A SG10201400683Q A SG 10201400683QA
Authority
SG
Singapore
Prior art keywords
control system
temperature control
phase change
direct injection
change temperature
Prior art date
Application number
SG10201400683QA
Inventor
Christopher A Lopez
Thomas F Lemczyk
Rick A Davis
Original Assignee
Sensata Tech Massachusetts Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sensata Tech Massachusetts Inc filed Critical Sensata Tech Massachusetts Inc
Publication of SG10201400683QA publication Critical patent/SG10201400683QA/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
SG10201400683QA 2013-03-15 2014-03-14 Direct Injection Phase Change Temperature Control System SG10201400683QA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361789203P 2013-03-15 2013-03-15

Publications (1)

Publication Number Publication Date
SG10201400683QA true SG10201400683QA (en) 2014-10-30

Family

ID=50439133

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201400683QA SG10201400683QA (en) 2013-03-15 2014-03-14 Direct Injection Phase Change Temperature Control System

Country Status (7)

Country Link
US (1) US9709622B2 (en)
EP (1) EP2778696A3 (en)
JP (1) JP2014194415A (en)
KR (1) KR20140113881A (en)
CN (1) CN104048457A (en)
SG (1) SG10201400683QA (en)
TW (1) TW201506420A (en)

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US9921265B2 (en) * 2015-12-18 2018-03-20 Sensata Technologies, Inc. Thermal clutch for thermal control unit and methods related thereto
US20170248973A1 (en) * 2016-02-29 2017-08-31 Cascade Microtech, Inc. Probe systems and methods including active environmental control
US20170261547A1 (en) * 2016-03-08 2017-09-14 Temptronic Corporation Temperature Forcing System and Method with Conductive Thermal Probes
KR20170116875A (en) * 2016-04-12 2017-10-20 (주)테크윙 Handler for electric device test
WO2017210108A1 (en) 2016-06-02 2017-12-07 Kes Systems, Inc. System and methods for semiconductor burn-in test
EP3580075A4 (en) * 2017-02-12 2021-01-20 Clearmotion, Inc. Hydraulic actuator with a frequency dependent relative pressure ratio
US10677842B2 (en) * 2017-05-26 2020-06-09 Advantest Corporation DUT testing with configurable cooling control using DUT internal temperature data
US11862275B2 (en) * 2019-03-06 2024-01-02 Kingtiger Technology (Canada) Inc. System and method for verifying and analyzing memory for high performance computing systems
US11754622B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Thermal control system for an automated test system
US11867749B2 (en) 2020-10-22 2024-01-09 Teradyne, Inc. Vision system for an automated test system
US11899042B2 (en) 2020-10-22 2024-02-13 Teradyne, Inc. Automated test system
US11754596B2 (en) 2020-10-22 2023-09-12 Teradyne, Inc. Test site configuration in an automated test system
US11953519B2 (en) 2020-10-22 2024-04-09 Teradyne, Inc. Modular automated test system
US11573262B2 (en) * 2020-12-31 2023-02-07 Advantest Test Solutions, Inc. Multi-input multi-zone thermal control for device testing
US11656272B1 (en) 2022-10-21 2023-05-23 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zones
US11828795B1 (en) * 2022-10-21 2023-11-28 AEM Holdings Ltd. Test system with a thermal head comprising a plurality of adapters for independent thermal control of zones
US11693051B1 (en) 2022-10-21 2023-07-04 AEM Holdings Ltd. Thermal head for independent control of zones
US11796589B1 (en) 2022-10-21 2023-10-24 AEM Holdings Ltd. Thermal head for independent control of zones
CN116500421B (en) * 2022-11-09 2024-02-13 珠海精实测控技术股份有限公司 Temperature control testing method
US11828796B1 (en) 2023-05-02 2023-11-28 AEM Holdings Ltd. Integrated heater and temperature measurement

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US4802370A (en) * 1986-12-29 1989-02-07 Halliburton Company Transducer and sensor apparatus and method
US5198753A (en) 1990-06-29 1993-03-30 Digital Equipment Corporation Integrated circuit test fixture and method
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US20050146708A1 (en) * 2002-04-11 2005-07-07 Xunqing Shi Systems and methods for deformation measurement
US7100389B1 (en) 2002-07-16 2006-09-05 Delta Design, Inc. Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test
WO2004082349A1 (en) * 2003-03-12 2004-09-23 Fujitsu Limited Cooling structure for electronic equipment
US6975028B1 (en) * 2003-03-19 2005-12-13 Delta Design, Inc. Thermal apparatus for engaging electronic device
US7199597B2 (en) * 2004-02-16 2007-04-03 Delta Design, Inc. Dual feedback control system for maintaining the temperature of an IC-chip near a set-point
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JP4418772B2 (en) * 2005-04-28 2010-02-24 富士通マイクロエレクトロニクス株式会社 Temperature control device
KR100903182B1 (en) * 2005-09-28 2009-06-17 주식회사 엘지화학 Cooling System of Battery Pack for Vehicle
US8151872B2 (en) * 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
SG148900A1 (en) * 2007-07-06 2009-01-29 Aem Singapore Pte Ltd A heat transfer device
US8274300B2 (en) * 2008-01-18 2012-09-25 Kes Systems & Service (1993) Pte Ltd. Thermal control unit for semiconductor testing
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Also Published As

Publication number Publication date
JP2014194415A (en) 2014-10-09
EP2778696A3 (en) 2017-05-10
CN104048457A (en) 2014-09-17
US9709622B2 (en) 2017-07-18
KR20140113881A (en) 2014-09-25
EP2778696A2 (en) 2014-09-17
TW201506420A (en) 2015-02-16
US20140260333A1 (en) 2014-09-18

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