JP2014179598A5 - - Google Patents
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- Publication number
- JP2014179598A5 JP2014179598A5 JP2014027549A JP2014027549A JP2014179598A5 JP 2014179598 A5 JP2014179598 A5 JP 2014179598A5 JP 2014027549 A JP2014027549 A JP 2014027549A JP 2014027549 A JP2014027549 A JP 2014027549A JP 2014179598 A5 JP2014179598 A5 JP 2014179598A5
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- film
- processing
- power
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003672 processing method Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 2
- 239000007789 gas Substances 0.000 claims 17
- 238000005530 etching Methods 0.000 claims 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims 5
- 229920005591 polysilicon Polymers 0.000 claims 5
- 229910052681 coesite Inorganic materials 0.000 claims 3
- 229910052906 cristobalite Inorganic materials 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 235000012239 silicon dioxide Nutrition 0.000 claims 3
- 229910052682 stishovite Inorganic materials 0.000 claims 3
- 229910052905 tridymite Inorganic materials 0.000 claims 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 2
- 229910004298 SiO 2 Inorganic materials 0.000 claims 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims 1
- 229910052786 argon Inorganic materials 0.000 claims 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims 1
- 229910052794 bromium Inorganic materials 0.000 claims 1
- 229910052801 chlorine Inorganic materials 0.000 claims 1
- 239000000460 chlorine Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 239000001301 oxygen Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 description 2
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014027549A JP6267989B2 (ja) | 2013-02-18 | 2014-02-17 | プラズマ処理方法及び容量結合型プラズマ処理装置 |
| KR1020140018594A KR102181419B1 (ko) | 2013-02-18 | 2014-02-18 | 플라즈마 처리 방법 및 플라즈마 처리 장치 |
| TW103105352A TWI606514B (zh) | 2013-02-18 | 2014-02-18 | 電漿處理方法及電漿處理裝置 |
| US14/182,707 US9653316B2 (en) | 2013-02-18 | 2014-02-18 | Plasma processing method and plasma processing apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013029298 | 2013-02-18 | ||
| JP2013029298 | 2013-02-18 | ||
| JP2014027549A JP6267989B2 (ja) | 2013-02-18 | 2014-02-17 | プラズマ処理方法及び容量結合型プラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014179598A JP2014179598A (ja) | 2014-09-25 |
| JP2014179598A5 true JP2014179598A5 (enExample) | 2016-12-22 |
| JP6267989B2 JP6267989B2 (ja) | 2018-01-24 |
Family
ID=51699207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014027549A Active JP6267989B2 (ja) | 2013-02-18 | 2014-02-17 | プラズマ処理方法及び容量結合型プラズマ処理装置 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6267989B2 (enExample) |
| KR (1) | KR102181419B1 (enExample) |
| TW (1) | TWI606514B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6449674B2 (ja) * | 2015-02-23 | 2019-01-09 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
| US11640905B2 (en) * | 2020-12-17 | 2023-05-02 | Applied Materials, Inc. | Plasma enhanced deposition of silicon-containing films at low temperature |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3531511B2 (ja) * | 1998-12-22 | 2004-05-31 | 株式会社日立製作所 | プラズマ処理装置 |
| JP2001085394A (ja) * | 1999-09-10 | 2001-03-30 | Hitachi Ltd | 表面処理方法および表面処理装置 |
| US6399507B1 (en) * | 1999-09-22 | 2002-06-04 | Applied Materials, Inc. | Stable plasma process for etching of films |
| CA2529794A1 (en) * | 2003-06-19 | 2004-12-29 | Plasma Control Systems Llc | Plasma production device and method and rf driver circuit with adjustable duty cycle |
| JP5192209B2 (ja) * | 2006-10-06 | 2013-05-08 | 東京エレクトロン株式会社 | プラズマエッチング装置、プラズマエッチング方法およびコンピュータ読取可能な記憶媒体 |
| US7786019B2 (en) * | 2006-12-18 | 2010-08-31 | Applied Materials, Inc. | Multi-step photomask etching with chlorine for uniformity control |
| JP5029089B2 (ja) | 2007-03-26 | 2012-09-19 | 東京エレクトロン株式会社 | プラズマ処理装置用の載置台及びプラズマ処理装置 |
| JP2009277770A (ja) * | 2008-05-13 | 2009-11-26 | Toshiba Corp | 不揮発性半導体記憶装置及びその製造方法 |
| JP2010118549A (ja) * | 2008-11-13 | 2010-05-27 | Tokyo Electron Ltd | プラズマエッチング方法及びプラズマエッチング装置 |
| US8658541B2 (en) * | 2010-01-15 | 2014-02-25 | Applied Materials, Inc. | Method of controlling trench microloading using plasma pulsing |
| JP5840973B2 (ja) * | 2011-03-03 | 2016-01-06 | 東京エレクトロン株式会社 | 半導体装置の製造方法及びコンピュータ記録媒体 |
| JP5893864B2 (ja) * | 2011-08-02 | 2016-03-23 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
-
2014
- 2014-02-17 JP JP2014027549A patent/JP6267989B2/ja active Active
- 2014-02-18 TW TW103105352A patent/TWI606514B/zh active
- 2014-02-18 KR KR1020140018594A patent/KR102181419B1/ko active Active
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