JP2014167987A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2014167987A JP2014167987A JP2013039377A JP2013039377A JP2014167987A JP 2014167987 A JP2014167987 A JP 2014167987A JP 2013039377 A JP2013039377 A JP 2013039377A JP 2013039377 A JP2013039377 A JP 2013039377A JP 2014167987 A JP2014167987 A JP 2014167987A
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- electrodes
- substrate
- wiring electrode
- resin layer
- esd protection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 239000010410 layer Substances 0.000 claims abstract description 106
- 239000011347 resin Substances 0.000 claims abstract description 64
- 229920005989 resin Polymers 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 239000004020 conductor Substances 0.000 claims abstract description 17
- 239000011229 interlayer Substances 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 229920005992 thermoplastic resin Polymers 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Images
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- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013039377A JP2014167987A (ja) | 2013-02-28 | 2013-02-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013039377A JP2014167987A (ja) | 2013-02-28 | 2013-02-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014167987A true JP2014167987A (ja) | 2014-09-11 |
| JP2014167987A5 JP2014167987A5 (enExample) | 2015-07-09 |
Family
ID=51617550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013039377A Pending JP2014167987A (ja) | 2013-02-28 | 2013-02-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2014167987A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017092463A (ja) * | 2015-11-10 | 2017-05-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | ファンアウト半導体パッケージ及びそれを含む電子機器 |
| JP2017130479A (ja) * | 2016-01-18 | 2017-07-27 | 株式会社村田製作所 | 電子部品 |
| JP2018056537A (ja) * | 2016-09-29 | 2018-04-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | ファン‐アウト半導体パッケージ |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004193497A (ja) * | 2002-12-13 | 2004-07-08 | Nec Electronics Corp | チップサイズパッケージおよびその製造方法 |
-
2013
- 2013-02-28 JP JP2013039377A patent/JP2014167987A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004193497A (ja) * | 2002-12-13 | 2004-07-08 | Nec Electronics Corp | チップサイズパッケージおよびその製造方法 |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017092463A (ja) * | 2015-11-10 | 2017-05-25 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | ファンアウト半導体パッケージ及びそれを含む電子機器 |
| US10128179B2 (en) | 2015-11-10 | 2018-11-13 | Samsung Electro-Mechanics Co., Ltd. | Fan-out semiconductor package and electronic device including the same |
| KR101933408B1 (ko) | 2015-11-10 | 2018-12-28 | 삼성전기 주식회사 | 전자부품 패키지 및 이를 포함하는 전자기기 |
| US10446481B2 (en) | 2015-11-10 | 2019-10-15 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package and electronic device including the same |
| US10679933B2 (en) | 2015-11-10 | 2020-06-09 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package and electronic device including the same |
| US10861784B2 (en) | 2015-11-10 | 2020-12-08 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package and electronic device including the same |
| US11626364B2 (en) | 2015-11-10 | 2023-04-11 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package and electronic device including the same |
| US12300594B2 (en) | 2015-11-10 | 2025-05-13 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package and electronic device including the same |
| JP2017130479A (ja) * | 2016-01-18 | 2017-07-27 | 株式会社村田製作所 | 電子部品 |
| JP2018056537A (ja) * | 2016-09-29 | 2018-04-05 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | ファン‐アウト半導体パッケージ |
| US10403588B2 (en) | 2016-09-29 | 2019-09-03 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package |
| US10714440B2 (en) | 2016-09-29 | 2020-07-14 | Samsung Electronics Co., Ltd. | Fan-out semiconductor package |
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Legal Events
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| A521 | Request for written amendment filed |
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