JP2014154841A - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To highly accurately determine the direction of an electronic component held by a nozzle.SOLUTION: An electronic component mounting apparatus for manufacturing products by mounting electronic components onto boards comprises: a nozzle holding an electronic component for mounting it onto a board; a shape recognition part configured to measure offset from the reference position of the electronic component held by the nozzle to the predetermined portion of the electronic component; and a control part configured to determine the direction of an electronic component on the basis of a comparison between the offset measured by the shape recognition part and a threshold.

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

  An electronic component mounting apparatus for mounting an electronic component on a substrate has a head including a nozzle, holds the electronic component with the nozzle, and mounts the electronic component on the substrate. The electronic component mounting device picks up the components in the electronic component supply device by moving the head nozzle in a direction perpendicular to the surface of the substrate, and then moves the head relatively in a direction parallel to the surface of the substrate. When the picked-up component arrives at the mounting position, the picked electronic component is mounted on the substrate by moving the nozzle of the head in a direction orthogonal to the surface of the substrate and bringing it closer to the substrate.

  Here, as the electronic component to be mounted on the substrate, in addition to the mountable electronic component mounted on the substrate, the main body and the lead connected to the main body are provided, and the insertable electronic component mounted by inserting the lead into the insertion hole is is there. As an electronic component mounting apparatus for mounting an insertion type electronic component on a substrate, for example, there is an apparatus described in Patent Document 1.

  Further, Patent Document 1 includes an insertion state detection unit that applies a predetermined component insertion force to the insertion head at the time of component insertion, and detects the insertion state of the component by detecting the amount and time of movement of the insertion head. In addition, it is described that whether or not a component is inserted is detected based on whether or not a predetermined insertion amount is reached within a predetermined time.

Japanese Patent Publication No. 2-26799

  By the way, when an electronic component is mounted on a substrate, an electrode contact failure occurs if the electronic component is not mounted in the correct direction, which may result in a mounting failure. The present invention has been made in view of the above, and an object thereof is to provide an electronic component mounting apparatus and an electronic component mounting method capable of determining the direction of the electronic component held by the nozzle with high accuracy. To do.

  The present invention is an electronic component mounting apparatus for producing a product by mounting an electronic component on a substrate, the nozzle holding the electronic component for mounting on the substrate, and the electronic held by the nozzle A shape recognition unit that measures an offset from a reference position of the component to a predetermined portion of the electronic component, and a control unit that determines the direction of the electronic component based on a comparison between the offset measured by the shape recognition unit and a threshold value With.

  Here, it is preferable that the control unit updates a threshold value for determining the direction of the electronic component based on the offset measured by the shape recognition unit during production of the product.

  Moreover, it is preferable that the said control part divides | segments the said offset measured by the said shape recognition part into two groups based on the said threshold value, and sets the average intermediate value calculated for each group as a new threshold value.

  The present invention is an electronic component mounting method for mounting an electronic component on a substrate, the step of holding the electronic component by a nozzle for mounting on the substrate, and a reference position of the electronic component held by the nozzle Measuring an offset from the electronic component to a predetermined portion of the electronic component, and determining a direction of the electronic component based on a comparison between the offset and a threshold value.

  The present invention can determine the direction of the electronic component held by the nozzle with high accuracy and prevent mounting failure of the electronic component.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 6 is a diagram illustrating an example in which the gripping nozzle holds the electronic component in the forward direction. FIG. 7 is a diagram illustrating an example in which the gripping nozzle holds the electronic component in the reverse direction. FIG. 8 is a diagram illustrating an example of threshold values. FIG. 9 is a diagram illustrating an example in which the electronic component is held in a correct posture. FIG. 10 is a diagram illustrating an example in which an electronic component is tilted and held. FIG. 11 is a diagram illustrating an example in which the electronic component is tilted and held. FIG. 12 is a flowchart illustrating an example of control when the electronic component mounting apparatus mounts an electronic component. FIG. 13 is a flowchart showing details of the calibration process. FIG. 14 is a diagram illustrating a specific example of the calibration process.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of an electronic component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting apparatus of the present invention has a lead, and the lead is inserted into a board hole (insertion hole, hole) of the board to mount an electronic part to be mounted on the board, so-called insertion type electronic part. The electronic component mounting apparatus. The electronic component mounting apparatus has a function of mounting an insertion type electronic component (lead type electronic component). Here, the insertion type electronic component is mounted by inserting a lead into a hole formed in the substrate. Further, electronic components mounted on the substrate without being inserted into the insertion hole (substrate hole), for example, SOP, QFP, etc., are mounted electronic components. The electronic component mounting apparatus may have a function of mounting a mountable electronic component mounted on the substrate. The electronic component mounting apparatus 10 of the following embodiment has a function of mounting both a mountable electronic component and an insertable electronic component.

  Next, an electronic component mounting apparatus 10 capable of mounting both the mountable electronic component and the insertable electronic component of the present embodiment will be described with reference to FIGS. 1 to 5. The electronic component mounting apparatus 10 can mount both a mountable electronic component to be mounted by placing it on a substrate and a lead type electronic component (insertable electronic component) to be mounted by inserting a lead into an insertion hole of the substrate. It is a device that can. The electronic component mounting apparatus 10 can mount both the mounted electronic component and the lead electronic component, or can mount only one of them. That is, the electronic component mounting apparatus 10 can mount both a mounted electronic component and a lead type electronic component, and can be used for various purposes depending on the board to be manufactured and the layout of other electronic component mounting apparatuses. Can do.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at a predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8, and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided. Both the component supply units 14f and 14r of this embodiment supply lead-type electronic components having a main body and leads connected to the main body.

  FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. As shown in FIG. 2, the component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 90 and 90 a.

  Specifically, the component supply unit 14 is mounted with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and held by the electronic component holding tape. A plurality of electronic component supply devices 90 that cut the lead of the lead type electronic component at the holding position (second holding position) and can hold the lead type electronic component at the holding position by the suction nozzle or the grip nozzle provided in the head. In addition to mounting, an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body is mounted, and the mounting position of the mounted electronic component held by the electronic component holding tape (first holding) Position), the mounted electronic component at the holding position can be held by the suction nozzle or gripping nozzle provided in the head. It may comprise electronic component feeder 90a. The component supply unit 14 may install a stick feeder or a tray feeder as the other electronic component supply device 90a. A plurality of component supply apparatuses 90 and 90 a shown in FIG. 2 are held by a support base (bank) 96. Further, the support table 96 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 90 and 90a.

  The component supply unit 14 includes a plurality of types of electronic component supply devices that are different in the types of electronic components to be mounted, the mechanisms for holding the electronic components, or the supply mechanisms. 90, 90a. Further, the component supply unit 14 may include a plurality of electronic component supply devices 90 and 90a of the same type. The component supply unit 14 is preferably configured to be detachable from the apparatus main body.

  The component supply device 90 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by sticking a plurality of radial lead type electronic component leads to the tape. The component supply device 90 holds an electronic component holding tape, sends the held electronic component holding tape, and holds the radial lead type electronic component held by the nozzle of the head 15 (suction position) , Gripping position, holding position). The component supply device 90 cuts and separates the lead of the radial lead type electronic component moved to the holding region, so that the radial lead type electronic component with the lead fixed by the tape can be held in a predetermined position. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15. The component supply device 90 will be described later. The plurality of component supply apparatuses 90 may supply different types of electronic components or separate electronic components. Further, the component supply device 90 is not limited to a plurality of radial lead type electronic components on a tape, and a bowl feeder, an axial feeder, a stick feeder, a tray feeder, or the like can also be used.

  The electronic component supply device 90a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to the tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic components can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 90a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder, a tape feeder, or a bulk feeder can be used.

  The head 15 holds (sucks or grips) the electronic component held by the component supply unit 14f or the electronic component held by the component supply unit 14r with a nozzle, and the held electronic component is moved to a predetermined position by the substrate transport unit 12. It is a mechanism for mounting on the moved substrate 8. Further, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. It is a mechanism to do. The configuration of the head 15 will be described later. The chip-type electronic component (mounted electronic component) is a leadless electronic component that does not include a lead that is inserted into an insertion hole (through hole) formed in the substrate. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate without inserting the lead into the insertion hole.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and the X-axis driving unit 22 and the Y-axis driving unit 24. Have The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices of the component supply units 14f and 14r on the substrate 8 at predetermined positions (mounting position, mounting position). It becomes a transfer means to transfer to. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image so that it is adsorbed by the nozzle. Recognizes the shape of the electronic component and the electronic component holding state by the nozzle The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by holding the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the held electronic component under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation. Examples of the operation unit 40 include a keyboard, a mouse, and a touch panel. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker. Examples of the display unit 42 include a touch panel and a vision monitor. The display unit 42 displays various images based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can more efficiently mount electronic components on the substrate by moving the two substrates alternately to the electronic component mounting position by the two substrate transfer units 12 and mounting the components alternately by the two heads 15. can do.

  Next, the configuration of the head 15 will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 3 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 90 of the component supply unit 14r. As shown in FIGS. 3 and 4, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (component state detection unit, shape recognition). Part) 38.

  As shown in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  The electronic component supply device 90 is a mechanism that supplies the electronic component 80. Here, the electronic component 80 has an electronic component main body (hereinafter simply referred to as “main body”) 82 and two leads 84 arranged in the radial direction of the main body 82. Although the electronic component 80 of this embodiment has two leads 84, the number of leads 84 is not particularly limited. As the electronic component 80, an aluminum electrolytic capacitor is exemplified. In addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. In the electronic component supply device 90, the main body 82 of the electronic component 80 in which the leads 84 are held by the electronic component holding tape (radial component tape) is exposed upward. The electronic component supply apparatus 90 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component supply device 90 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. Similarly, in the case of the electronic component supply apparatus 90a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. As shown in FIG. 4, six nozzles 32 are arranged in a row in the head main body 30 of the present embodiment. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 4, the suction nozzle which adsorbs and hold | maintains the electronic component 80 is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 32a at the tip. The opening 32 a is connected to the nozzle driving unit 34 through an internal cavity and a cavity of the nozzle holding unit 33. The nozzle 32 sucks air from the opening 32a to suck and hold the electronic component 80 at the tip. The nozzle 32 can be attached to and detached from the nozzle holding portion 33, and is stored (stored) in the replacement nozzle holding mechanism 18 when the nozzle 32 is not attached to the nozzle holding portion 33. The nozzle 32 has various shapes and sizes of the opening 32a. In the present embodiment, an adsorption type nozzle having an opening for adsorbing an electronic component is shown. However, an arm that operates by air pressure is used, and a holding type nozzle is used to hold the electronic component by sandwiching it. Can do.

  The nozzle holding unit 33 is a mechanism that holds the nozzle 32 at the end (tip) on the lower side in the vertical direction. For example, the nozzle driving unit 34 is connected to the shaft that moves relative to the head support 31 and the nozzle 32. Socket. The shaft is a rod-shaped member, and is arranged extending in the Z-axis direction. The shaft supports a socket disposed at an end portion on the lower side in the vertical direction. The shaft is supported with respect to the head support 31 in a state where a portion connected to the socket is movable in the Z-axis direction and is rotatable in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane and is a direction orthogonal to the surface of the substrate 8. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit 34 moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32. A portion of the shaft connected to the socket is moved and rotated in the Z-axis direction and the θ direction by the nozzle driving unit 34.

  The nozzle driving unit 34 moves the nozzle holding unit 33 in the Z-axis direction to move the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 a of the nozzle 32. Further, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle holding unit 33 in the θ direction when the electronic component 80 is mounted.

  The nozzle driving unit 34 includes a mechanism having a Z-axis motor 34a, specifically, a linear motion linear motor whose driving direction is the Z-axis direction as a mechanism for moving the nozzle 32 in the Z-axis direction. The nozzle drive unit 34 moves the shaft of the opening 32a at the tip of the nozzle 32 in the Z-axis direction by moving the nozzle 32 in the Z-axis direction together with the nozzle holding unit 33 by the Z-axis motor 34a. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft of the nozzle holding unit 33 as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle driving unit 34 transmits the driving force output from the motor to the shaft of the nozzle holding unit 33 by a transmission element, and rotates the shaft in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 32a of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 32a of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether to suck air from the opening 32a by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks (holds) the electronic component 80 in the opening 32a by sucking air from the opening 32a, and closes the electromagnetic valve and sucks air in the opening 32a by not sucking air from the opening 32a. The electronic component 80 that has been released is released, that is, the electronic component 80 is not sucked (not held) by the opening 32a.

  The head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component. As with the suction nozzle, the gripping nozzle can release and hold the air from the upper side by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. Further, the height sensor 37 detects the height of the facing part, specifically, the electronic component by processing the distance from the facing part using its own position at the time of measurement and the position of the substrate. . The process of detecting the height of the electronic component based on the measurement result of the distance to the electronic component may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 3, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the operation of sucking (holding) / releasing the electronic components of the nozzle 32 and the rotation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, distance sensors). Controls movement and movement in the Z-axis direction.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each of the electronic component supply devices 90 and 90a or may control all the electronic component supply devices 90 and 90a. For example, the component supply control unit 64 controls an electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the electronic component supply device 90. In addition, when the component supply unit 14 includes the electronic component supply device 90a, the component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation) by the electronic component supply device 90a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  Here, in the above embodiment, the case where the suction nozzle is used as the nozzle mounted on the head has been described, but the present invention is not limited to this. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 5 is a diagram illustrating an example of a gripping nozzle (gripper nozzle). A nozzle 201 illustrated in FIG. 5 includes a fixed arm 202 and a movable arm 204. The nozzle 201 is fixed in a state in which the fulcrum 205 of the movable arm 204 is rotatable on the main body of the nozzle 201, and the movable arm 204 has a portion facing the fixed arm 202 with the fulcrum 205 as an axis close to the fixed arm 202. It is possible to move in the direction away from the direction and in the reverse direction. The movable arm 204 is connected to a drive unit 206 on a side opposite to a portion of the main body of the nozzle 201 and a portion approaching or moving away from the fixed arm 202 via a fulcrum 205. The drive unit 206 is built in the nozzle body, and is moved in and out in the longitudinal direction by a drive source (air pressure) that drives the gripping nozzle. The movable arm 204 moves to the gripping position by moving the drive unit 206 from the open position shown in FIG. 5 in the direction approaching the fixed arm 202 away from the direction away from the fixed arm 202.

  The nozzle 201 can grip the electronic component 80 by reducing the distance between the fixed arm 202 and the movable arm 204 in a state where the electronic component 80 is between the fixed arm 202 and the movable arm 204.

  The gripping nozzle is not limited to the nozzle 201 and can have various shapes. The gripping nozzle can have various values for the distance between the fixed arm and the movable arm and the movable range. As described above, the gripping nozzle has different shapes of electronic components that can be gripped for each shape of the nozzle.

  The electronic component mounting apparatus 10 can appropriately hold the electronic component by selecting the type of nozzle that holds the electronic component according to the type of electronic component to be held. Specifically, one electronic component can be mounted by selecting whether to use a suction nozzle or a gripping nozzle according to the electronic component to be held, and switching which nozzle to use among each type of nozzle. More kinds of electronic components can be mounted on the device.

  Next, the determination of the direction (orientation) of the electronic component by the electronic component mounting apparatus 10 will be described with reference to FIGS. The electronic component mounting apparatus 10 uses the laser recognition device 38 to determine whether the nozzle holds the electronic component in the correct direction before mounting the electronic component. In particular, when the component supply device 90 is a bowl feeder, the direction of the electronic component supplied by the component supply device 90 is different at random, so it is important to determine whether the direction of the electronic component is correct.

  FIG. 6 is a diagram illustrating an example in which the gripping nozzle holds the electronic component in the forward direction. In the example shown in FIG. 6, the two leads 84 of the electronic component 80 are positioned so as to overlap when viewed from the laser recognition device 38. The electronic component mounting apparatus 10 measures the offset (distance) from the reference position to a predetermined portion of the electronic component 80 using the laser recognition device 38 in the shape recognition of the electronic component 80 held by the nozzle 201. In the example illustrated in FIG. 6, the reference position is the center 201 </ b> C of the nozzle 201. In the present embodiment, the offset becomes a larger positive value as it moves away from the reference position in one direction, and becomes a smaller negative value as it moves away from the reference position in the opposite direction.

  The predetermined portion of the electronic component 80 is a portion having a different position as viewed from the laser recognition device 38 when the electronic component 80 is in the forward direction and when the electronic component 80 is in the reverse direction. The predetermined part of the electronic component 80 is preferably a part that can be easily recognized. In the example shown in FIG. 6, the predetermined portion of the electronic component 80 is a lead 84. When the nozzle 201 holds the electronic component 80 in the correct posture and in the positive direction, the electronic component mounting apparatus 10 obtains a value of 500 μm as an offset from the center 201C of the nozzle 201 to the center of the lead 84.

  FIG. 7 is a diagram illustrating an example in which the gripping nozzle holds the electronic component in the reverse direction. When the nozzle 201 holds the electronic component 80 in the correct posture and in the reverse direction, the electronic component mounting apparatus 10 obtains a value of −4500 μm as an offset from the center 201C of the nozzle 201 to the center of the lead 84.

  By the way, in the case of a gripping nozzle in which the distance between the fixed arm and the movable arm is long as shown in FIG. 6, depending on the electronic component, the lead 84 is positioned more than the reference position regardless of whether it is gripped in the forward direction or the reverse direction. In some cases, the electronic component may be positioned on the negative side of the left side, and the electronic component cannot be discriminated forward or backward depending on whether the lead position is right or left with respect to the reference position. Therefore, the threshold is adopted as follows.

  The electronic component mounting apparatus 10 determines whether the nozzle holds the electronic component 80 in the forward direction by comparing the offset from the reference position to a predetermined portion of the electronic component 80 with a threshold value. FIG. 8 is a diagram illustrating an example of threshold values used for determination. The threshold value is set between the offset to a predetermined portion when the electronic component 80 is held in the forward direction and the offset to the predetermined portion when the electronic component 80 is held in the reverse direction.

  In the example shown in FIG. 8, the threshold value TH for determining whether the nozzle 201 holds the electronic component 80 in the positive direction is set to −2000 μm ((500 μm−4500 μm) / 2) from the reference position. When the offset from the center 201C of the nozzle 201 to the center of the lead 84 is −2000 μm or more, the electronic component mounting apparatus 10 determines that the nozzle 201 holds the electronic component 80 in the positive direction. On the other hand, when the offset from the center 201C of the nozzle 201 to the center of the lead 84 is smaller than −2000 μm, it is determined that the nozzle 201 holds the electronic component 80 in the reverse direction.

  By the way, the electronic component 80 is not necessarily held in the correct posture by the nozzle 201 as shown in FIG. 9, but may be held by the nozzle 201 in an inclined manner as shown in FIGS. Such inclination is caused by, for example, a difference in lots of the electronic components 80. When the electronic component 80 is tilted and held, the offset from the reference position to a predetermined portion of the electronic component 80 varies. The variation of the offset affects the accuracy of the determination of the direction of the electronic component by the electronic component mounting apparatus 10. In particular, in an electronic component having a small difference in offset between the forward direction and the reverse direction, the influence of the variation in offset on the determination of the direction of the electronic component is large.

  Therefore, the electronic component mounting apparatus 10 executes a calibration process during production and updates a threshold value for determining the direction of the electronic component. In this way, by updating the threshold value by the calibration process during production, the influence of the offset variation on the determination of the direction of the electronic component can be reduced.

  Next, an example of control when the electronic component mounting apparatus 10 mounts an electronic component will be described with reference to FIGS. FIG. 12 is a flowchart illustrating an example of control when the electronic component mounting apparatus 10 mounts an electronic component. The control shown in FIG. 12 is executed for each electronic component mounted on the board. The control shown in FIG. 12 is realized by a control unit such as the control device 20.

  The electronic component mounting apparatus 10 sets an initial value as a threshold value in step S101. The initial value is set based on, for example, a result obtained by measuring in advance the offset when the nozzle holds the electronic component in the forward direction and the offset when the nozzle holds the electronic component in the reverse direction. The The initial value may be a value obtained by calibration processing during the previous production of a product on which the same component is mounted. The electronic component mounting apparatus 10 initializes a counter to 0 as step S102.

  Subsequently, in step S103, the electronic component mounting apparatus 10 holds the electronic component with the nozzle, and in step S104, measures the dimensions of the electronic component held by the nozzle by shape recognition using the laser recognition device. At this time, the electronic component mounting apparatus 10 obtains an offset (an offset for direction determination) from the reference position to a predetermined portion of the electronic component. In step S105, the electronic component mounting apparatus 10 determines whether the electronic component is held in the positive direction based on the comparison between the offset and the threshold value.

  If the electronic component is not held in the forward direction (No at Step S106), the electronic component mounting apparatus 10 proceeds to Step S107. In step S107, the electronic component mounting apparatus 10 changes the direction of the electronic component to the positive direction by rotating the nozzle. When the electronic component is held in the forward direction (step S106, Yes), the electronic component mounting apparatus 10 does not execute step S107.

  Subsequently, as step S108, the electronic component mounting apparatus 10 stores the direction determination offset obtained in step S104 in the storage unit. In step S109, the electronic component mounting apparatus 10 mounts the electronic component on the substrate, and in step S110, adds 1 to the counter.

  Subsequently, the electronic component mounting apparatus 10 determines whether the counter is N as step S111. N is a value for adjusting the frequency with which the calibration process is executed. N is an integer of 1 or more. The larger N is, the lower the frequency with which the calibration process is executed. In order to improve the accuracy of the threshold value obtained by the calibration process, N may be set in accordance with a cycle in which the tendency of the inclination (posture) of the electronic component held by the nozzle changes. For example, the number of electronic component lots may be set to N in order to match the cycle in which the inclination (posture) of the electronic component changes.

  When the counter is N (step S111, Yes), the electronic component mounting apparatus 10 proceeds to step S112. The electronic component mounting apparatus 10 performs a calibration process as step S112. In the calibration process, the electronic component mounting apparatus 10 updates the threshold based on the offset stored in the storage unit. Thereafter, the electronic component mounting apparatus 10 initializes the counter to 0 in step S113, and proceeds to step S114.

  When the counter is not N (No at Step S111), the electronic component mounting apparatus 10 proceeds to Step S114 without executing Step S112 and Step S113.

  In step S114, the electronic component mounting apparatus 10 determines whether to end production. When the production is not finished (No at Step S114), the electronic component mounting apparatus 10 returns to Step S103 and mounts the next electronic component. When the production is finished (step S114, Yes), the electronic component mounting apparatus 10 finishes the control shown in FIG.

  FIG. 13 is a flowchart showing details of the calibration process executed in step S112 of FIG. In the calibration process, the electronic component mounting apparatus 10 acquires one offset stored in the storage unit as step S201. Then, in step S202, the electronic component mounting apparatus 10 determines whether the threshold is larger than the offset.

  When the threshold value is larger than the offset (step S202, Yes), the electronic component mounting apparatus 10 proceeds to step S203. In step S203, the electronic component mounting apparatus 10 allocates the offset to the first group. If the threshold is not greater than the offset (No at Step S202), the electronic component mounting apparatus 10 proceeds to Step S204. In step S204, the electronic component mounting apparatus 10 allocates the offset to the second group. The electronic component mounting apparatus 10 may sort the offset into the first group or the second group when storing the offset in the storage unit.

  Subsequently, in step S205, the electronic component mounting apparatus 10 determines whether all offsets that are not used in the calibration process among the offsets stored in the storage unit are allocated to the first group or the second group. . When all the offsets have not been allocated (No at Step S205), the electronic component mounting apparatus 10 returns to Step S201.

  When all the offsets are distributed (step S205, Yes), the electronic component mounting apparatus 10 proceeds to step S206. In step S206, the electronic component mounting apparatus 10 calculates an average of the offsets assigned to the first group. Further, the electronic component mounting apparatus 10 calculates the average of the offsets distributed to the second group as step S207.

  In step S208, the electronic component mounting apparatus 10 adds the two averages thus obtained and divides by two to calculate an average intermediate value, and sets the average intermediate value as a threshold value. Then, the electronic component mounting apparatus 10 ends the calibration process. When ending the calibration process, the electronic component mounting apparatus 10 may clear the offset stored in the storage unit.

  FIG. 14 is a diagram illustrating a specific example of the calibration process. When N is 10, ten offsets (V0) are stored in the storage unit at the start of the calibration process. By the distribution based on the threshold value, six offsets (V1a) are distributed to the first group, and four offsets (V2a) are distributed to the second group. By adding 7983 (V1b), which is the average of the offset allocated to the first group, and 3250 (V2b), which is the average of the offset allocated to the second group, and dividing by 2, 5616.5 (V3) is obtained. can get. 5616.5 (V3) is set to a new threshold value.

  In this way, by updating the threshold value by the calibration process during production, the accuracy of the direction determination of the electronic component held by the nozzle is improved.

  In the above-described embodiment, the example in which the insertion type electronic component held by the gripping nozzle is determined to be in the positive direction has been described. However, the types of the nozzle and the electronic component are not limited thereto. The above technique can be used to determine whether the electronic component held by the suction type nozzle is in the positive direction. The above technique can be used to determine whether the mounted electronic component held by the nozzle is in the positive direction.

  In the above embodiment, the example in which the center of the nozzle body is used as the reference position for measuring the offset of the electronic component has been described, but the reference position is not limited to this. The reference position may be, for example, the center of the electronic component, the side surface of the electronic component main body, the fixed arm of the nozzle, or other part.

  In the above-described embodiment, the example in which the leads of the electronic components are positioned so as to overlap with each other when viewed from the laser recognition device 38 has been described. For example, when there are a plurality of electronic component leads as viewed from the laser recognition device 38, the lead at a predetermined position may be set as the predetermined portion. The lead at a predetermined position is, for example, the lead located on the leftmost side or the lead located on the rightmost side.

  In the above embodiment, the example in which the lead of the electronic component is used as the predetermined portion for measuring the offset of the electronic component has been described, but the predetermined portion is not limited to this. The predetermined portion may be a convex portion or a concave portion of the electronic component main body.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 replacement nozzle holding mechanism, 19 component storage unit, 20 control device, 22 X-axis drive unit, 24 Y-axis drive unit, 30 head body, 31 head support, 32 nozzles, 34 nozzle drive unit, 34a Z-axis motor, 38 laser recognition device, 40 operation unit, 42 display unit , 60 control unit, 62 head control unit, 64 component supply control unit, 80 electronic component, 82 main body (electronic component main body), 84 lead, 90, 90a electronic component supply device, 96 support base

Claims (4)

An electronic component mounting apparatus for producing a product by mounting an electronic component on a substrate,
A nozzle for holding the electronic component for mounting on the substrate;
A shape recognition unit for measuring an offset from a reference position of the electronic component held by the nozzle to a predetermined portion of the electronic component;
An electronic component mounting apparatus comprising: a control unit that determines a direction of the electronic component based on a comparison between the offset measured by the shape recognition unit and a threshold value.   2. The electronic component mounting apparatus according to claim 1, wherein the control unit updates a threshold for determining a direction of the electronic component based on the offset measured by the shape recognition unit during the production of the product. .   The control unit divides the offset measured by the shape recognition unit into two groups based on the threshold value, and sets an average intermediate value calculated for each group as a new threshold value. The electronic component mounting apparatus described. An electronic component mounting method for mounting an electronic component on a substrate,
Holding the electronic component by a nozzle for mounting on the substrate;
Measuring an offset from a reference position of the electronic component held by the nozzle to a predetermined portion of the electronic component;
A method of determining a direction of the electronic component based on a comparison between the offset and a threshold value.

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