JP2014150103A5 - - Google Patents

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Publication number
JP2014150103A5
JP2014150103A5 JP2013016678A JP2013016678A JP2014150103A5 JP 2014150103 A5 JP2014150103 A5 JP 2014150103A5 JP 2013016678 A JP2013016678 A JP 2013016678A JP 2013016678 A JP2013016678 A JP 2013016678A JP 2014150103 A5 JP2014150103 A5 JP 2014150103A5
Authority
JP
Japan
Prior art keywords
insulating layer
layer
wiring
secondary battery
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013016678A
Other languages
English (en)
Japanese (ja)
Other versions
JP6144058B2 (ja
JP2014150103A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2013016678A priority Critical patent/JP6144058B2/ja
Priority claimed from JP2013016678A external-priority patent/JP6144058B2/ja
Priority to US14/167,280 priority patent/US9224684B2/en
Publication of JP2014150103A publication Critical patent/JP2014150103A/ja
Publication of JP2014150103A5 publication Critical patent/JP2014150103A5/ja
Application granted granted Critical
Publication of JP6144058B2 publication Critical patent/JP6144058B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013016678A 2013-01-31 2013-01-31 配線基板及び配線基板の製造方法 Active JP6144058B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013016678A JP6144058B2 (ja) 2013-01-31 2013-01-31 配線基板及び配線基板の製造方法
US14/167,280 US9224684B2 (en) 2013-01-31 2014-01-29 Wiring board and method of manufacturing wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013016678A JP6144058B2 (ja) 2013-01-31 2013-01-31 配線基板及び配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2014150103A JP2014150103A (ja) 2014-08-21
JP2014150103A5 true JP2014150103A5 (enExample) 2016-01-21
JP6144058B2 JP6144058B2 (ja) 2017-06-07

Family

ID=51221711

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013016678A Active JP6144058B2 (ja) 2013-01-31 2013-01-31 配線基板及び配線基板の製造方法

Country Status (2)

Country Link
US (1) US9224684B2 (enExample)
JP (1) JP6144058B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6332672B2 (ja) 2014-04-16 2018-05-30 新光電気工業株式会社 電池内蔵基板及びその製造方法
DE102015113324A1 (de) 2015-08-12 2017-02-16 Schweizer Electronic Ag Leiterstrukturelement mit einlaminiertem Innenlagensubstrat und Verfahren zu dessen Herstellung
CN107241850A (zh) * 2016-03-29 2017-10-10 中兴通讯股份有限公司 一种电路板及终端
US10660208B2 (en) * 2016-07-13 2020-05-19 General Electric Company Embedded dry film battery module and method of manufacturing thereof
DE102017111970A1 (de) 2017-05-31 2018-12-06 Epcos Ag Leiterplatte mit Stromversorgung, elektrisches Bauelement mit Leiterplatte und Verfahren zur Herstellung einer Leiterplatte
JP2019016653A (ja) * 2017-07-04 2019-01-31 大日本印刷株式会社 導電基板、電子部品搭載基板および導電基板の製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0263497B1 (en) * 1986-10-07 1994-05-18 Canon Kabushiki Kaisha Image reading device
US5673127A (en) * 1993-12-01 1997-09-30 Matsushita Electric Industrial Co., Ltd. Display panel and display device using a display panel
JPH11274735A (ja) * 1998-03-25 1999-10-08 Toshiba Battery Co Ltd 多層印刷配線板
JP3813402B2 (ja) 2000-01-31 2006-08-23 新光電気工業株式会社 半導体装置の製造方法
KR100333627B1 (ko) * 2000-04-11 2002-04-22 구자홍 다층 인쇄회로기판 및 그 제조방법
US20020175402A1 (en) * 2001-05-23 2002-11-28 Mccormack Mark Thomas Structure and method of embedding components in multi-layer substrates
US7045246B2 (en) * 2003-04-22 2006-05-16 The Aerospace Corporation Integrated thin film battery and circuit module
US7624499B2 (en) * 2004-02-26 2009-12-01 Hei, Inc. Flexible circuit having an integrally formed battery
JP2006120935A (ja) * 2004-10-22 2006-05-11 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
JP4838068B2 (ja) * 2005-09-01 2011-12-14 日本特殊陶業株式会社 配線基板
JP4509972B2 (ja) * 2005-09-01 2010-07-21 日本特殊陶業株式会社 配線基板、埋め込み用セラミックチップ
US7808799B2 (en) * 2006-04-25 2010-10-05 Ngk Spark Plug Co., Ltd. Wiring board
TWI407870B (zh) * 2006-04-25 2013-09-01 日本特殊陶業股份有限公司 配線基板之製造方法
US8072732B2 (en) * 2007-04-10 2011-12-06 Ngk Spark Plug Co., Ltd. Capacitor and wiring board including the capacitor
CN101822132B (zh) * 2007-10-16 2012-12-26 住友电木株式会社 搭载半导体元件的基板
US20090186169A1 (en) * 2008-01-17 2009-07-23 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including battery and related methods
US8778124B2 (en) * 2008-01-17 2014-07-15 Harris Corporation Method for making three-dimensional liquid crystal polymer multilayer circuit boards
US9117602B2 (en) * 2008-01-17 2015-08-25 Harris Corporation Three-dimensional liquid crystal polymer multilayer circuit board including membrane switch and related methods
US8363861B2 (en) * 2009-03-20 2013-01-29 Brian Hughes Entertainment system for use during the operation of a magnetic resonance imaging device
JPWO2010134511A1 (ja) * 2009-05-20 2012-11-12 日本電気株式会社 半導体装置及び半導体装置の製造方法
JP5524715B2 (ja) * 2009-06-01 2014-06-18 日本特殊陶業株式会社 セラミックコンデンサ、配線基板
JP5535765B2 (ja) * 2009-06-01 2014-07-02 日本特殊陶業株式会社 セラミックコンデンサの製造方法
US8613671B2 (en) * 2009-06-08 2013-12-24 Cfph, Llc Data transfer and control among multiple computer devices in a gaming environment
JP5548855B2 (ja) * 2010-09-27 2014-07-16 日本電気株式会社 配線基板及びその製造方法
JP2012146843A (ja) * 2011-01-13 2012-08-02 Murata Mfg Co Ltd モジュール基板及びモジュール基板の製造方法

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