JP2014145426A - 成膜装置、及び真空チャンバの開閉機構 - Google Patents

成膜装置、及び真空チャンバの開閉機構 Download PDF

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Publication number
JP2014145426A
JP2014145426A JP2013014654A JP2013014654A JP2014145426A JP 2014145426 A JP2014145426 A JP 2014145426A JP 2013014654 A JP2013014654 A JP 2013014654A JP 2013014654 A JP2013014654 A JP 2013014654A JP 2014145426 A JP2014145426 A JP 2014145426A
Authority
JP
Japan
Prior art keywords
cylinder
valve body
lever
hole
sealing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013014654A
Other languages
English (en)
Japanese (ja)
Inventor
Itsushi Iio
逸史 飯尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP2013014654A priority Critical patent/JP2014145426A/ja
Priority to TW102141037A priority patent/TW201430256A/zh
Priority to CN201310581049.6A priority patent/CN103966568A/zh
Priority to KR1020130139850A priority patent/KR20140096967A/ko
Publication of JP2014145426A publication Critical patent/JP2014145426A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C23C14/0036—Reactive sputtering
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K1/00—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces
    • F16K1/16—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members
    • F16K1/18—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps
    • F16K1/20—Lift valves or globe valves, i.e. cut-off apparatus with closure members having at least a component of their opening and closing motion perpendicular to the closing faces with pivoted closure-members with pivoted discs or flaps with axis of rotation arranged externally of valve member
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/44—Mechanical actuating means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
    • F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sliding Valves (AREA)
  • Lift Valve (AREA)
  • Mechanically-Actuated Valves (AREA)
  • Details Of Valves (AREA)
JP2013014654A 2013-01-29 2013-01-29 成膜装置、及び真空チャンバの開閉機構 Pending JP2014145426A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013014654A JP2014145426A (ja) 2013-01-29 2013-01-29 成膜装置、及び真空チャンバの開閉機構
TW102141037A TW201430256A (zh) 2013-01-29 2013-11-12 成膜裝置、以及真空腔室之開閉機構
CN201310581049.6A CN103966568A (zh) 2013-01-29 2013-11-18 成膜装置及真空腔室的开闭机构
KR1020130139850A KR20140096967A (ko) 2013-01-29 2013-11-18 성막장치, 및 진공챔버의 개폐기구

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013014654A JP2014145426A (ja) 2013-01-29 2013-01-29 成膜装置、及び真空チャンバの開閉機構

Publications (1)

Publication Number Publication Date
JP2014145426A true JP2014145426A (ja) 2014-08-14

Family

ID=51236561

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013014654A Pending JP2014145426A (ja) 2013-01-29 2013-01-29 成膜装置、及び真空チャンバの開閉機構

Country Status (4)

Country Link
JP (1) JP2014145426A (zh)
KR (1) KR20140096967A (zh)
CN (1) CN103966568A (zh)
TW (1) TW201430256A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107604315B (zh) * 2017-09-21 2023-10-27 京东方科技集团股份有限公司 一种密闭式坩埚和使用该坩埚的蒸镀方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3244344B2 (ja) * 1993-05-28 2002-01-07 株式会社日立国際電気 半導体製造装置
CN201397808Y (zh) * 2009-05-20 2010-02-03 北京金盛微纳科技有限公司 旋转式真空锁
JP5118216B2 (ja) * 2011-01-24 2013-01-16 Ｃｋｄ株式会社 真空圧力制御システム及び真空圧力制御プログラム
CN202380076U (zh) * 2011-12-09 2012-08-15 汉能科技有限公司 一种气相沉积反应腔室门阀装置

Also Published As

Publication number Publication date
KR20140096967A (ko) 2014-08-06
TW201430256A (zh) 2014-08-01
CN103966568A (zh) 2014-08-06

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