JP2014143379A - 実装基板および電子部品の実装方法 - Google Patents

実装基板および電子部品の実装方法 Download PDF

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Publication number
JP2014143379A
JP2014143379A JP2013012391A JP2013012391A JP2014143379A JP 2014143379 A JP2014143379 A JP 2014143379A JP 2013012391 A JP2013012391 A JP 2013012391A JP 2013012391 A JP2013012391 A JP 2013012391A JP 2014143379 A JP2014143379 A JP 2014143379A
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JP
Japan
Prior art keywords
mounting
terminal
electrolytic capacitor
printed wiring
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013012391A
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English (en)
Japanese (ja)
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JP2014143379A5 (enrdf_load_stackoverflow
Inventor
Tatsuya Miyagi
竜也 宮城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2013012391A priority Critical patent/JP2014143379A/ja
Publication of JP2014143379A publication Critical patent/JP2014143379A/ja
Publication of JP2014143379A5 publication Critical patent/JP2014143379A5/ja
Pending legal-status Critical Current

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2013012391A 2013-01-25 2013-01-25 実装基板および電子部品の実装方法 Pending JP2014143379A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013012391A JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013012391A JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

Publications (2)

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JP2014143379A true JP2014143379A (ja) 2014-08-07
JP2014143379A5 JP2014143379A5 (enrdf_load_stackoverflow) 2016-03-10

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ID=51424430

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JP2013012391A Pending JP2014143379A (ja) 2013-01-25 2013-01-25 実装基板および電子部品の実装方法

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JP (1) JP2014143379A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020096201A1 (ko) * 2018-11-09 2020-05-14 엘지전자 주식회사 전동식 압축기
WO2022039375A1 (ko) * 2020-08-20 2022-02-24 삼성전자주식회사 커패시터 및 이를 포함하는 전자장치
WO2025165009A1 (ko) * 2024-01-29 2025-08-07 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 전자 장치

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076058U (ja) * 1983-10-28 1985-05-28 株式会社ケンウッド 電子部品の実装構造
JPS6218928U (enrdf_load_stackoverflow) * 1985-07-17 1987-02-04
JPS6365266U (enrdf_load_stackoverflow) * 1986-10-20 1988-04-30
JPH01167010U (enrdf_load_stackoverflow) * 1988-05-16 1989-11-22
JPH0329389A (ja) * 1989-06-27 1991-02-07 Mitsubishi Electric Corp プリント回路板
JPH04144055A (ja) * 1990-10-05 1992-05-18 Mitsubishi Electric Corp カード用モジユール
JPH0562067U (ja) * 1992-01-23 1993-08-13 日本精機株式会社 回路基板
JPH09219575A (ja) * 1996-02-08 1997-08-19 Nippon Telegr & Teleph Corp <Ntt> 光素子実装構造
JP2005158912A (ja) * 2003-11-25 2005-06-16 Canon Inc 回路基板
JP2008218935A (ja) * 2007-03-08 2008-09-18 Kawasaki Microelectronics Kk 半導体集積回路パッケージが装着された回路基板および半導体集積回路パッケージ

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6076058U (ja) * 1983-10-28 1985-05-28 株式会社ケンウッド 電子部品の実装構造
JPS6218928U (enrdf_load_stackoverflow) * 1985-07-17 1987-02-04
JPS6365266U (enrdf_load_stackoverflow) * 1986-10-20 1988-04-30
JPH01167010U (enrdf_load_stackoverflow) * 1988-05-16 1989-11-22
JPH0329389A (ja) * 1989-06-27 1991-02-07 Mitsubishi Electric Corp プリント回路板
JPH04144055A (ja) * 1990-10-05 1992-05-18 Mitsubishi Electric Corp カード用モジユール
JPH0562067U (ja) * 1992-01-23 1993-08-13 日本精機株式会社 回路基板
JPH09219575A (ja) * 1996-02-08 1997-08-19 Nippon Telegr & Teleph Corp <Ntt> 光素子実装構造
JP2005158912A (ja) * 2003-11-25 2005-06-16 Canon Inc 回路基板
JP2008218935A (ja) * 2007-03-08 2008-09-18 Kawasaki Microelectronics Kk 半導体集積回路パッケージが装着された回路基板および半導体集積回路パッケージ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020096201A1 (ko) * 2018-11-09 2020-05-14 엘지전자 주식회사 전동식 압축기
WO2022039375A1 (ko) * 2020-08-20 2022-02-24 삼성전자주식회사 커패시터 및 이를 포함하는 전자장치
US12406804B2 (en) 2020-08-20 2025-09-02 Samsung Electronics Co., Ltd. Capacitor and electronic device comprising same
WO2025165009A1 (ko) * 2024-01-29 2025-08-07 삼성전자주식회사 인쇄회로기판 및 이를 포함하는 전자 장치

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