JP2014138049A - 電子回路、光源装置、電子回路の製造方法 - Google Patents
電子回路、光源装置、電子回路の製造方法 Download PDFInfo
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- JP2014138049A JP2014138049A JP2013005136A JP2013005136A JP2014138049A JP 2014138049 A JP2014138049 A JP 2014138049A JP 2013005136 A JP2013005136 A JP 2013005136A JP 2013005136 A JP2013005136 A JP 2013005136A JP 2014138049 A JP2014138049 A JP 2014138049A
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- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims description 36
- 239000000758 substrate Substances 0.000 claims abstract description 91
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 238000005452 bending Methods 0.000 claims description 22
- 238000005476 soldering Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims description 3
- 238000004599 local-density approximation Methods 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 8
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000037237 body shape Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/47—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light
- B41J2/471—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror
- B41J2/473—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using the combination of scanning and modulation of light using dot sequential main scanning by means of a light deflector, e.g. a rotating polygonal mirror using multiple light beams, wavelengths or colours
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09072—Hole or recess under component or special relationship between hole and component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09645—Patterning on via walls; Plural lands around one hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
- Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】 基板10上に電子部品20が実装された電子回路1であって、電子部品20は、基板10上の配線と電気的に接続するリードピン21を複数有し、基板10には、複数のリードピン21間の最大距離を上回る寸法の孔11が設けられ、リードピン21は、リードピン21の先端側から孔11に挿入され、複数の屈曲部23,24で屈曲して基板に半田31で固定されている。
【選択図】図3
Description
には、スルーホールの孔径を大きく取ることでリードピンを通し易くすることが考えられる。
まず、本発明に係る電子回路の実施の形態について説明する。
次に、本発明に係る電子回路の別の実施の形態について、先に説明した実施の形態との相違点を中心に説明する。
次に、本発明に係る電子回路の別の実施の形態について、先に説明した実施の形態との相違点を中心に説明する。
次に、本発明に係る電子回路の別の実施の形態について、先に説明した実施の形態との相違点を中心に説明する。
次に、本発明に係る光源装置の実施の形態について説明する。以下の説明では、本発明に係る光源装置を備える光走査装置を例に説明する。
次に、本発明に係る電子回路の製造方法の実施の形態について説明する。
10 :基板
11 :大孔
12 :小孔
13 :ランド
20 :LDA
21 :リードピン
22 :パッケージ
23 :第1屈曲部
24 :第2屈曲部
25 :第3屈曲部
30 :半田フィレット
40 :治具ビット
40a :先端部
40b :中間部
40c :基端部
41 :フォーミング治具
Claims (10)
- 基板上に電子部品が実装された電子回路であって、
前記電子部品は、前記基板上の配線と電気的に接続するリードピンを複数有し、
前記基板には、前記複数のリードピン間の最大距離を上回る寸法の孔が設けられ、
前記リードピンは、前記リードピンの先端側から前記孔に挿入され、複数の屈曲部で屈曲して前記基板に半田で固定されている、
ことを特徴とする電子回路。 - 前記複数の屈曲部のうち、前記リードピンの先端から最も遠い側の屈曲部での屈曲方向は、前記複数のリードピンそれぞれが離れる方向である、
請求項1記載の電子回路。 - 前記複数の屈曲部のうち、前記リードピンの最も先端側の屈曲部での屈曲方向は、前記複数のリードピンそれぞれが近づく方向である、
請求項1または2記載の電子回路。 - 前記孔には、前記複数のリードピンごとの位置決め用の切欠が設けられている、
請求項1乃至3のいずれかに記載の電子回路。 - 前記屈曲部には、第1屈曲部と第2屈曲部とが含まれ、
前記第2屈曲部は、前記第1屈曲部よりも前記リードピンの先端側であり、
前記リードピンは、前記第1屈曲部と前記第2屈曲部との間の部分が前記基板に接触する、
請求項1乃至4のいずれかに記載の電子回路。 - 前記半田は、前記第1屈曲部と前記第2屈曲部との間でフィレットを形成する、
請求項1乃至5のいずれかに記載の電子回路。 - 前記電子部品は、前記基板上に複数個実装される、
請求項1乃至6のいずれかに記載の電子回路。 - 基板上に電子部品が実装される電子回路を有してなる光源装置であって、
前記電子回路は、請求項1乃至7のいずれかに記載の電子回路である、
ことを特徴とする光源装置。 - 基板上に電子部品が実装された電子回路の製造方法であって、
前記基板には、前記複数のリードピン間の最大距離を上回る寸法の孔が設けられ、
前記孔に前記複数のリードピンを挿入する工程と、
前記リードピンに複数の屈曲部を形成する工程と、
前記リードピンを前記基板に半田付けする工程と、
を行うことを特徴とする電子回路の製造方法。 - 前記孔には、前記複数のリードピンごとの位置決め用の切欠が設けられ、
前記屈曲部を形成する工程では、前記リードピンを前記切欠の周壁に当接させる、
請求項9記載の電子回路の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013005136A JP2014138049A (ja) | 2013-01-16 | 2013-01-16 | 電子回路、光源装置、電子回路の製造方法 |
US14/138,673 US9332655B2 (en) | 2013-01-16 | 2013-12-23 | Electronic circuit, light source device, and method of manufacturing electronic circuit |
CN201410021542.7A CN103929881B (zh) | 2013-01-16 | 2014-01-16 | 电子电路、光源装置以及电子电路的制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013005136A JP2014138049A (ja) | 2013-01-16 | 2013-01-16 | 電子回路、光源装置、電子回路の製造方法 |
Publications (1)
Publication Number | Publication Date |
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JP2014138049A true JP2014138049A (ja) | 2014-07-28 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2013005136A Pending JP2014138049A (ja) | 2013-01-16 | 2013-01-16 | 電子回路、光源装置、電子回路の製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US9332655B2 (ja) |
JP (1) | JP2014138049A (ja) |
CN (1) | CN103929881B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102017116936A1 (de) * | 2017-07-26 | 2019-01-31 | Ledvance Gmbh | Verbindung eines elektrischen Leitelements mit einer Leiterplatte eines Leuchtmittels |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55160492A (en) * | 1979-05-31 | 1980-12-13 | Fumio Okamoto | Method of mounting lead wire part to printed board |
JPS5773968U (ja) * | 1980-10-21 | 1982-05-07 | ||
JPS6177377A (ja) * | 1984-09-21 | 1986-04-19 | Dx Antenna Co Ltd | 発光ダイオ−ドの取付方法 |
JPH0223540A (ja) * | 1988-07-12 | 1990-01-25 | Matsushita Electric Ind Co Ltd | 光ピックアップ |
JP2006072136A (ja) * | 2004-09-03 | 2006-03-16 | Canon Inc | 光源装置及び走査光学装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07154046A (ja) | 1993-11-26 | 1995-06-16 | Sankyo Seiki Mfg Co Ltd | 電気部品取付構造 |
JPH10107378A (ja) | 1996-09-30 | 1998-04-24 | Ricoh Co Ltd | マルチビーム出射装置およびその組立方法 |
JP4906081B2 (ja) | 2005-10-27 | 2012-03-28 | 株式会社リコー | 光ビーム走査装置 |
US7635213B2 (en) * | 2008-02-07 | 2009-12-22 | Ching-Liang Lee | Vehicle light assembly |
CN201243410Y (zh) * | 2008-07-11 | 2009-05-20 | 上海阿卡得电子有限公司 | 功率晶体管在印制电路板上的固定焊接结构 |
CN201243409Y (zh) * | 2008-07-11 | 2009-05-20 | 上海阿卡得电子有限公司 | 变压器在印制电路板上的固定焊接结构 |
TWI368007B (en) * | 2009-06-26 | 2012-07-11 | Delta Electronics Inc | Assembled structure of electronic device and supporting device thereof |
JP5737252B2 (ja) * | 2012-09-25 | 2015-06-17 | 株式会社村田製作所 | 回路装置とその製造方法 |
-
2013
- 2013-01-16 JP JP2013005136A patent/JP2014138049A/ja active Pending
- 2013-12-23 US US14/138,673 patent/US9332655B2/en not_active Expired - Fee Related
-
2014
- 2014-01-16 CN CN201410021542.7A patent/CN103929881B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55160492A (en) * | 1979-05-31 | 1980-12-13 | Fumio Okamoto | Method of mounting lead wire part to printed board |
JPS5773968U (ja) * | 1980-10-21 | 1982-05-07 | ||
JPS6177377A (ja) * | 1984-09-21 | 1986-04-19 | Dx Antenna Co Ltd | 発光ダイオ−ドの取付方法 |
JPH0223540A (ja) * | 1988-07-12 | 1990-01-25 | Matsushita Electric Ind Co Ltd | 光ピックアップ |
JP2006072136A (ja) * | 2004-09-03 | 2006-03-16 | Canon Inc | 光源装置及び走査光学装置 |
Also Published As
Publication number | Publication date |
---|---|
US20140198469A1 (en) | 2014-07-17 |
CN103929881B (zh) | 2017-03-01 |
CN103929881A (zh) | 2014-07-16 |
US9332655B2 (en) | 2016-05-03 |
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