JP2014129431A5 - - Google Patents
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- JP2014129431A5 JP2014129431A5 JP2012286365A JP2012286365A JP2014129431A5 JP 2014129431 A5 JP2014129431 A5 JP 2014129431A5 JP 2012286365 A JP2012286365 A JP 2012286365A JP 2012286365 A JP2012286365 A JP 2012286365A JP 2014129431 A5 JP2014129431 A5 JP 2014129431A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- processed
- substrate
- adhesive layer
- treated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004519 manufacturing process Methods 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 18
- 239000000758 substrate Substances 0.000 claims description 18
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 239000000178 monomer Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 239000007870 radical polymerization initiator Substances 0.000 claims description 6
- 125000002723 alicyclic group Chemical group 0.000 claims description 4
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 239000011241 protective layer Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000013032 Hydrocarbon resin Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229920006270 hydrocarbon resin Polymers 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 125000005647 linker group Chemical group 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 239000003505 polymerization initiator Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012286365A JP6140441B2 (ja) | 2012-12-27 | 2012-12-27 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012286365A JP6140441B2 (ja) | 2012-12-27 | 2012-12-27 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014129431A JP2014129431A (ja) | 2014-07-10 |
| JP2014129431A5 true JP2014129431A5 (enrdf_load_stackoverflow) | 2015-06-11 |
| JP6140441B2 JP6140441B2 (ja) | 2017-05-31 |
Family
ID=51408108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012286365A Expired - Fee Related JP6140441B2 (ja) | 2012-12-27 | 2012-12-27 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6140441B2 (enrdf_load_stackoverflow) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5826238B2 (ja) * | 2013-12-03 | 2015-12-02 | デンカ株式会社 | 仮固定用接着剤組成物、それを用いた構造体及び部材の仮固定方法 |
| KR101930721B1 (ko) * | 2015-02-20 | 2018-12-19 | 후지필름 가부시키가이샤 | 가접착용 적층체, 적층체 및 키트 |
| TWI671831B (zh) * | 2015-09-30 | 2019-09-11 | 日商富士軟片股份有限公司 | 半導體元件的製造方法 |
| JP6610510B2 (ja) | 2015-11-26 | 2019-11-27 | 信越化学工業株式会社 | ウエハ積層体及びその製造方法 |
| JP6612683B2 (ja) * | 2016-06-13 | 2019-11-27 | 東京応化工業株式会社 | 積層体の製造方法、及びその利用 |
| JP6614090B2 (ja) | 2016-10-11 | 2019-12-04 | 信越化学工業株式会社 | ウエハ積層体及びその製造方法 |
| KR102181860B1 (ko) | 2017-09-22 | 2020-11-23 | 주식회사 엘지화학 | 접착제 조성물, 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
| KR102172568B1 (ko) * | 2017-09-22 | 2020-11-02 | 주식회사 엘지화학 | 접착제 조성물 및 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
| KR102181849B1 (ko) | 2017-09-22 | 2020-11-23 | 주식회사 엘지화학 | 접착제 조성물, 이를 이용하여 형성된 접착제층을 포함하는 편광판 |
| JP7154955B2 (ja) * | 2018-11-01 | 2022-10-18 | 株式会社東芝 | 剥離液、剥離方法、及び電子部品の製造方法 |
| CN117242146A (zh) * | 2021-04-26 | 2023-12-15 | 电化株式会社 | 组合物 |
| CN118922914A (zh) * | 2022-04-06 | 2024-11-08 | 日东电工株式会社 | 表面保护用组合物、表面保护片以及电子部件装置的制造方法 |
| WO2024190671A1 (ja) * | 2023-03-10 | 2024-09-19 | デンカ株式会社 | 板状基材の加工方法 |
| TW202517743A (zh) * | 2023-09-22 | 2025-05-01 | 日商日東電工股份有限公司 | 光學黏著片材 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3923023A1 (de) * | 1989-07-12 | 1991-01-24 | Siemens Ag | Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren |
| JP4312419B2 (ja) * | 2002-05-09 | 2009-08-12 | リンテック株式会社 | 半導体ウエハの加工方法 |
| JP2009188010A (ja) * | 2008-02-04 | 2009-08-20 | Lintec Corp | 脆質部材用支持体および脆質部材の処理方法 |
| JP5466477B2 (ja) * | 2009-10-23 | 2014-04-09 | 電気化学工業株式会社 | 仮固定用接着剤組成物 |
| JP5674332B2 (ja) * | 2010-04-14 | 2015-02-25 | 電気化学工業株式会社 | 接着剤組成物及びそれを用いた部材の仮固定方法 |
| JP5941043B2 (ja) * | 2011-05-24 | 2016-06-29 | デンカ株式会社 | 仮固定用接着剤組成物 |
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2012
- 2012-12-27 JP JP2012286365A patent/JP6140441B2/ja not_active Expired - Fee Related