JP2014120522A - 搬送基台及び搬送システム - Google Patents
搬送基台及び搬送システム Download PDFInfo
- Publication number
- JP2014120522A JP2014120522A JP2012272534A JP2012272534A JP2014120522A JP 2014120522 A JP2014120522 A JP 2014120522A JP 2012272534 A JP2012272534 A JP 2012272534A JP 2012272534 A JP2012272534 A JP 2012272534A JP 2014120522 A JP2014120522 A JP 2014120522A
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- transport
- slide box
- servo motor
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004891 communication Methods 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 230000003287 optical effect Effects 0.000 abstract description 32
- 238000000034 method Methods 0.000 abstract description 25
- 235000012431 wafers Nutrition 0.000 description 48
- 230000033001 locomotion Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 4
- 238000003491 array Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】基板処理システム10は、搬送室Sと、搬送室Sの内部を移動するスライドボックス17とを備えるとともに複数のプロセスモジュール13が接続され、スライドボックス17は、ウエハWを移動させる搬送アーム21と、該搬送アーム21を駆動させるサーボモータ23と、該サーボモータ23へ供給される電力を制御するサーボモータドライバ24とを備え、サーボモータドライバ24を制御するサーボモータコントローラ25がスライドボックス17以外の場所であるトランスファモジュール12の外に配置され、サーボモータドライバ24及びサーボモータコントローラ25は光通信を行う。
【選択図】図3
Description
W ウエハ
10 基板処理システム
12 トランスファモジュール
13 プロセスモジュール
17 スライドボックス
22 センサ
23 サーボモータ
24 サーボモータドライバ
25 サーボモータコントローラ
26 第1の光通信デバイス
27 第2の光通信デバイス
28 ホストコンピュータ
29 リニアモータドライバ
30 配線
Claims (10)
- 基板を移動させる搬送アームと、該搬送アームを駆動させるモータと、該モータへ供給される電力を制御するモータドライバとを備え、搬送室内を移動する搬送基台であって、
前記モータドライバに前記モータの動作を指令する制御装置が前記搬送基台以外の場所に配置され、
前記モータドライバ及び前記制御装置は無線通信を行うことを特徴とする搬送基台。 - 前記搬送室内は減圧されていることを特徴とする請求項1記載の搬送基台。
- 搬送室と、前記搬送室内を移動する搬送基台とを備え、少なくとも1つの処理室が接続される搬送システムであって、
前記搬送基台は、基板を移動させる搬送アームと、該搬送アームを駆動させるモータと、該モータへ供給される電力を制御するモータドライバとを備え、
前記モータドライバに前記モータの動作を指令する制御装置が前記搬送基台以外の場所に配置され、
前記モータドライバ及び前記制御装置は無線通信を行うことを特徴とする搬送システム。 - ホストコンピュータをさらに備え、
前記ホストコンピュータ及び前記制御装置は有線通信を行うことを特徴とする請求項3記載の搬送システム。 - 前記搬送室は、前記移動する基板の位置を検知する少なくとも1つのセンサを有し、
前記少なくとも1つのセンサ及び前記制御装置は有線通信を行うことを特徴とする請求項3又は4記載の搬送システム。 - 前記搬送基台を移動させる移動機構と、前記搬送基台以外の場所に配置される前記移動機構のドライバとをさらに備え、
前記移動機構のドライバ及び前記制御装置は有線通信を行うことを特徴とする請求項3乃至5のいずれか1項に記載の搬送システム。 - 前記搬送室内は減圧されていることを特徴とする請求項3乃至6のいずれか1項に記載の搬送システム。
- 前記モータドライバ及び前記制御装置は無線でシリアル通信を行うことを特徴とする請求項3乃至7のいずれか1項に記載の搬送システム。
- 前記シリアル通信の通信速度は10Mbps以上であることを特徴とする請求項8記載の搬送システム。
- 前記無線通信は、電波、音波又は光を用いる無線通信であることを特徴とする請求項3乃至9のいずれか1項に記載の搬送システム。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012272534A JP5956324B2 (ja) | 2012-12-13 | 2012-12-13 | 搬送基台及び搬送システム |
KR1020157015218A KR102146143B1 (ko) | 2012-12-13 | 2013-12-12 | 반송 베이스 및 반송 시스템 |
PCT/JP2013/083999 WO2014092204A1 (ja) | 2012-12-13 | 2013-12-12 | 搬送基台及び搬送システム |
US14/650,316 US9947564B2 (en) | 2012-12-12 | 2013-12-12 | Conveyance base and conveyance system |
TW102146270A TWI583607B (zh) | 2012-12-13 | 2013-12-13 | Conveyor base and conveyor system |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012272534A JP5956324B2 (ja) | 2012-12-13 | 2012-12-13 | 搬送基台及び搬送システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014120522A true JP2014120522A (ja) | 2014-06-30 |
JP5956324B2 JP5956324B2 (ja) | 2016-07-27 |
Family
ID=50934482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012272534A Active JP5956324B2 (ja) | 2012-12-12 | 2012-12-13 | 搬送基台及び搬送システム |
Country Status (5)
Country | Link |
---|---|
US (1) | US9947564B2 (ja) |
JP (1) | JP5956324B2 (ja) |
KR (1) | KR102146143B1 (ja) |
TW (1) | TWI583607B (ja) |
WO (1) | WO2014092204A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103917337B (zh) | 2011-09-16 | 2017-12-15 | 柿子技术公司 | 低多变性机器人 |
KR20240046638A (ko) | 2014-01-21 | 2024-04-09 | 퍼시몬 테크놀로지스 코포레이션 | 기판 이송 진공 플랫폼 |
JP6727044B2 (ja) * | 2016-06-30 | 2020-07-22 | 株式会社荏原製作所 | 基板処理装置 |
CN110313060B (zh) * | 2017-02-24 | 2023-10-24 | 东京毅力科创株式会社 | 基板处理系统 |
CN108121201B (zh) * | 2017-12-18 | 2021-06-22 | 北京和利时电机技术有限公司 | 一种内部位置伺服控制方法 |
SG11202103055QA (en) * | 2018-09-27 | 2021-04-29 | Murata Machinery Ltd | Control method, transport system, and communication device |
US11964831B2 (en) | 2019-02-14 | 2024-04-23 | Persimmon Technologies Corporation | Magnetically guided material handling robot |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134587A (ja) * | 2000-10-26 | 2002-05-10 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
JP2004265894A (ja) * | 2003-01-17 | 2004-09-24 | Tokyo Electron Ltd | 基板処理装置 |
JP2007012720A (ja) * | 2005-06-28 | 2007-01-18 | Tokyo Electron Ltd | 基板処理装置,搬送装置,搬送装置の制御方法 |
JP2011077334A (ja) * | 2009-09-30 | 2011-04-14 | Murata Mfg Co Ltd | 搬送装置の支持構造 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6707545B1 (en) * | 1999-09-07 | 2004-03-16 | Applied Materials, Inc. | Optical signal routing method and apparatus providing multiple inspection collection points on semiconductor manufacturing systems |
JP4363064B2 (ja) * | 2003-03-07 | 2009-11-11 | 株式会社安川電機 | 真空内駆動装置およびこれを用いた基板搬送装置 |
US20070282480A1 (en) * | 2003-11-10 | 2007-12-06 | Pannese Patrick D | Methods and systems for controlling a semiconductor fabrication process |
US7458763B2 (en) * | 2003-11-10 | 2008-12-02 | Blueshift Technologies, Inc. | Mid-entry load lock for semiconductor handling system |
CN1219240C (zh) * | 2003-11-13 | 2005-09-14 | 上海交通大学 | 集成电路光刻设备的磁悬浮精密工件台 |
SE531329C2 (sv) * | 2005-06-20 | 2009-02-24 | Yaskawa Denki Seisakusho Kk | Automatiskt maskinsystem och metod för att kontrollera dess kommunikation |
JP2010040946A (ja) * | 2008-08-07 | 2010-02-18 | Sinfonia Technology Co Ltd | 真空処理装置 |
JP2010080469A (ja) * | 2008-09-24 | 2010-04-08 | Tokyo Electron Ltd | 真空処理装置及び真空搬送装置 |
WO2011155040A1 (ja) * | 2010-06-10 | 2011-12-15 | ムラテックオートメーション株式会社 | 搬送システム及び搬送システム内での通信方法 |
JP5276137B2 (ja) | 2011-04-13 | 2013-08-28 | 太陽誘電株式会社 | 積層型コンデンサ |
JP2013243312A (ja) | 2012-05-22 | 2013-12-05 | Tokyo Electron Ltd | 搬送装置 |
-
2012
- 2012-12-13 JP JP2012272534A patent/JP5956324B2/ja active Active
-
2013
- 2013-12-12 WO PCT/JP2013/083999 patent/WO2014092204A1/ja active Application Filing
- 2013-12-12 KR KR1020157015218A patent/KR102146143B1/ko active IP Right Grant
- 2013-12-12 US US14/650,316 patent/US9947564B2/en active Active
- 2013-12-13 TW TW102146270A patent/TWI583607B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002134587A (ja) * | 2000-10-26 | 2002-05-10 | Tokyo Electron Ltd | 被処理体の搬送機構及び処理システム |
JP2004265894A (ja) * | 2003-01-17 | 2004-09-24 | Tokyo Electron Ltd | 基板処理装置 |
JP2007012720A (ja) * | 2005-06-28 | 2007-01-18 | Tokyo Electron Ltd | 基板処理装置,搬送装置,搬送装置の制御方法 |
JP2011077334A (ja) * | 2009-09-30 | 2011-04-14 | Murata Mfg Co Ltd | 搬送装置の支持構造 |
Also Published As
Publication number | Publication date |
---|---|
US9947564B2 (en) | 2018-04-17 |
TW201433529A (zh) | 2014-09-01 |
US20150318197A1 (en) | 2015-11-05 |
KR20150093691A (ko) | 2015-08-18 |
JP5956324B2 (ja) | 2016-07-27 |
WO2014092204A1 (ja) | 2014-06-19 |
KR102146143B1 (ko) | 2020-08-19 |
TWI583607B (zh) | 2017-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5956324B2 (ja) | 搬送基台及び搬送システム | |
US11769680B2 (en) | Substrate transport vacuum platform | |
US20210114238A1 (en) | Robot Linear Drive Heat Transfer | |
CN110073589B (zh) | 用于受控地相对定子输送运输体的具有定子的输送装置 | |
TWI732285B (zh) | 半導體處理設備 | |
US11476139B2 (en) | Substrate process apparatus | |
CN112236851A (zh) | 用于运送至少一个晶片的运送装置 | |
KR20160135338A (ko) | 객체의 파지, 위치 결정 및/또는 이동 장치 | |
WO2013176025A1 (ja) | 搬送装置 | |
JP2012099656A (ja) | 基板搬送装置、基板搬送方法及び記憶媒体 | |
TWI809187B (zh) | 無線閥箱 | |
JP2010040947A (ja) | 真空処理装置 | |
JP2014049560A (ja) | 搬送基台及び搬送装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20150406 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160517 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160616 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5956324 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |