JP2014110390A5 - - Google Patents

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Publication number
JP2014110390A5
JP2014110390A5 JP2012265471A JP2012265471A JP2014110390A5 JP 2014110390 A5 JP2014110390 A5 JP 2014110390A5 JP 2012265471 A JP2012265471 A JP 2012265471A JP 2012265471 A JP2012265471 A JP 2012265471A JP 2014110390 A5 JP2014110390 A5 JP 2014110390A5
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JP
Japan
Prior art keywords
layer
wiring
support
manufacturing
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012265471A
Other languages
English (en)
Japanese (ja)
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JP2014110390A (ja
JP6029958B2 (ja
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Publication date
Application filed filed Critical
Priority to JP2012265471A priority Critical patent/JP6029958B2/ja
Priority claimed from JP2012265471A external-priority patent/JP6029958B2/ja
Priority to US14/090,076 priority patent/US9380707B2/en
Publication of JP2014110390A publication Critical patent/JP2014110390A/ja
Publication of JP2014110390A5 publication Critical patent/JP2014110390A5/ja
Application granted granted Critical
Publication of JP6029958B2 publication Critical patent/JP6029958B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012265471A 2012-12-04 2012-12-04 配線基板の製造方法 Active JP6029958B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012265471A JP6029958B2 (ja) 2012-12-04 2012-12-04 配線基板の製造方法
US14/090,076 US9380707B2 (en) 2012-12-04 2013-11-26 Method of manufacturing wiring substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012265471A JP6029958B2 (ja) 2012-12-04 2012-12-04 配線基板の製造方法

Publications (3)

Publication Number Publication Date
JP2014110390A JP2014110390A (ja) 2014-06-12
JP2014110390A5 true JP2014110390A5 (OSRAM) 2015-12-24
JP6029958B2 JP6029958B2 (ja) 2016-11-24

Family

ID=50824001

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012265471A Active JP6029958B2 (ja) 2012-12-04 2012-12-04 配線基板の製造方法

Country Status (2)

Country Link
US (1) US9380707B2 (OSRAM)
JP (1) JP6029958B2 (OSRAM)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI566305B (zh) * 2014-10-29 2017-01-11 巨擘科技股份有限公司 製造三維積體電路的方法
TWI613781B (zh) * 2015-12-11 2018-02-01 I-Shou University 中介層結構及其製造方法
JP2017228647A (ja) * 2016-06-22 2017-12-28 富士通株式会社 樹脂インターポーザ及びそれを用いた半導体装置及び樹脂インターポーザの製造方法
US10840180B2 (en) 2016-10-06 2020-11-17 Mitsui Mining & Smelting Co., Ltd. Production method for multilayer wiring board
CN107611042B (zh) * 2017-08-24 2021-09-21 通富微电子股份有限公司 一种扇出型封装方法
CN107564880A (zh) * 2017-08-24 2018-01-09 通富微电子股份有限公司 一种扇出型封装器件
JP7052464B2 (ja) * 2018-03-22 2022-04-12 凸版印刷株式会社 微細配線層付きコアレス基板の製造方法、および半導体パッケージの製造方法
JP7202785B2 (ja) 2018-04-27 2023-01-12 新光電気工業株式会社 配線基板及び配線基板の製造方法
JP7321009B2 (ja) 2019-07-01 2023-08-04 新光電気工業株式会社 配線基板、接合型配線基板及び配線基板の製造方法
JP7398561B2 (ja) * 2019-11-18 2023-12-14 新光維医療科技（蘇州）股▲フン▼有限公司 一体化された小型溶接板構造およびその製造方法
JP7661664B2 (ja) * 2021-08-20 2025-04-15 新光電気工業株式会社 配線基板及びその製造方法
WO2025187310A1 (ja) * 2024-03-05 2025-09-12 株式会社ジャパンディスプレイ インターポーザの製造方法およびインターポーザ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716094B2 (ja) * 1986-03-31 1995-02-22 日立化成工業株式会社 配線板の製造法
US6565954B2 (en) * 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
JP2002190543A (ja) 2000-12-20 2002-07-05 Shinko Electric Ind Co Ltd 配線基板及びその製造方法
TWI312166B (en) 2001-09-28 2009-07-11 Toppan Printing Co Ltd Multi-layer circuit board, integrated circuit package, and manufacturing method for multi-layer circuit board
JP2004342988A (ja) 2003-05-19 2004-12-02 Shinko Electric Ind Co Ltd 半導体パッケージの製造方法、及び半導体装置の製造方法
JP2007036095A (ja) * 2005-07-29 2007-02-08 Toppan Printing Co Ltd 受動素子内蔵配線回路基板及びその製造方法
TWI295550B (en) * 2005-12-20 2008-04-01 Phoenix Prec Technology Corp Structure of circuit board and method for fabricating the same
KR100776248B1 (ko) * 2006-11-21 2007-11-16 삼성전기주식회사 인쇄회로기판 제조방법
KR100951449B1 (ko) * 2008-01-03 2010-04-07 삼성전기주식회사 인쇄회로기판 및 그 제조방법
KR101089986B1 (ko) * 2009-12-24 2011-12-05 삼성전기주식회사 캐리어기판, 그의 제조방법, 이를 이용한 인쇄회로기판 및 그의 제조방법

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