JP2013247353A5 - - Google Patents

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Publication number
JP2013247353A5
JP2013247353A5 JP2012122588A JP2012122588A JP2013247353A5 JP 2013247353 A5 JP2013247353 A5 JP 2013247353A5 JP 2012122588 A JP2012122588 A JP 2012122588A JP 2012122588 A JP2012122588 A JP 2012122588A JP 2013247353 A5 JP2013247353 A5 JP 2013247353A5
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JP
Japan
Prior art keywords
electronic component
insulating layer
core material
layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2012122588A
Other languages
English (en)
Japanese (ja)
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JP6009228B2 (ja
JP2013247353A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2012122588A priority Critical patent/JP6009228B2/ja
Priority claimed from JP2012122588A external-priority patent/JP6009228B2/ja
Priority to KR1020130060110A priority patent/KR102032171B1/ko
Priority to US13/904,447 priority patent/US9247646B2/en
Publication of JP2013247353A publication Critical patent/JP2013247353A/ja
Publication of JP2013247353A5 publication Critical patent/JP2013247353A5/ja
Application granted granted Critical
Publication of JP6009228B2 publication Critical patent/JP6009228B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2012122588A 2012-05-30 2012-05-30 電子部品内蔵基板の製造方法 Active JP6009228B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012122588A JP6009228B2 (ja) 2012-05-30 2012-05-30 電子部品内蔵基板の製造方法
KR1020130060110A KR102032171B1 (ko) 2012-05-30 2013-05-28 전자 부품 내장 기판 및 그 제조 방법
US13/904,447 US9247646B2 (en) 2012-05-30 2013-05-29 Electronic component built-in substrate and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012122588A JP6009228B2 (ja) 2012-05-30 2012-05-30 電子部品内蔵基板の製造方法

Publications (3)

Publication Number Publication Date
JP2013247353A JP2013247353A (ja) 2013-12-09
JP2013247353A5 true JP2013247353A5 (OSRAM) 2015-07-02
JP6009228B2 JP6009228B2 (ja) 2016-10-19

Family

ID=49668866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012122588A Active JP6009228B2 (ja) 2012-05-30 2012-05-30 電子部品内蔵基板の製造方法

Country Status (3)

Country Link
US (1) US9247646B2 (OSRAM)
JP (1) JP6009228B2 (OSRAM)
KR (1) KR102032171B1 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9711392B2 (en) * 2012-07-25 2017-07-18 Infineon Technologies Ag Field emission devices and methods of making thereof
TWI610606B (zh) * 2013-02-21 2018-01-01 味之素股份有限公司 零件內建配線基板之製造方法及半導體裝置
JP2015035497A (ja) * 2013-08-09 2015-02-19 イビデン株式会社 電子部品内蔵配線板
JP6350093B2 (ja) * 2013-12-16 2018-07-04 味の素株式会社 部品内蔵基板の製造方法および半導体装置
KR102281468B1 (ko) 2014-07-16 2021-07-27 삼성전기주식회사 칩 내장형 기판 및 이의 제조 방법
US9420693B2 (en) * 2014-09-18 2016-08-16 Intel Corporation Integration of embedded thin film capacitors in package substrates
JP6428164B2 (ja) * 2014-10-31 2018-11-28 日立化成株式会社 半導体装置及びその製造方法
KR102356810B1 (ko) * 2015-01-22 2022-01-28 삼성전기주식회사 전자부품내장형 인쇄회로기판 및 그 제조방법
JP6712764B2 (ja) 2015-05-25 2020-06-24 パナソニックＩｐマネジメント株式会社 伸縮性フレキシブル基板およびその製造方法
JP6639934B2 (ja) * 2016-02-08 2020-02-05 新光電気工業株式会社 配線基板、半導体装置及び配線基板の製造方法
US11270920B2 (en) * 2018-08-14 2022-03-08 Medtronic, Inc. Integrated circuit package and method of forming same
US10903169B2 (en) * 2019-04-30 2021-01-26 Advanced Semiconductor Engineering, Inc. Conductive structure and wiring structure including the same
US11018083B2 (en) * 2019-07-17 2021-05-25 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and manufacturing method thereof
CN112026329B (zh) * 2020-09-15 2021-05-11 福建鑫宏华机械有限公司 一种铝基覆铜板制作方法
JP6899027B1 (ja) * 2020-10-13 2021-07-07 株式会社 ゼンショーホールディングス 可溶化物の製造方法
KR20220130916A (ko) * 2021-03-19 2022-09-27 삼성전기주식회사 전자부품 내장기판
JP2024521250A (ja) * 2021-05-14 2024-05-30 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 埋め込み可能な半導体ベースのキャパシタ
JP2024518330A (ja) 2021-05-14 2024-05-01 キョーセラ・エーブイエックス・コンポーネンツ・コーポレーション 埋め込み可能な半導体ベースのキャパシタ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4551468B2 (ja) * 2007-09-05 2010-09-29 太陽誘電株式会社 電子部品内蔵型多層基板
US8130507B2 (en) * 2008-03-24 2012-03-06 Ngk Spark Plug Co., Ltd. Component built-in wiring board
US8120158B2 (en) * 2009-11-10 2012-02-21 Infineon Technologies Ag Laminate electronic device
KR101084252B1 (ko) * 2010-03-05 2011-11-17 삼성전기주식회사 전자소자 내장형 인쇄회로기판 및 그 제조방법
JP5001395B2 (ja) 2010-03-31 2012-08-15 イビデン株式会社 配線板及び配線板の製造方法

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