JP2014110243A - プリント回路基板、プリント回路基板を含む照明装置及びバックライトユニット - Google Patents
プリント回路基板、プリント回路基板を含む照明装置及びバックライトユニット Download PDFInfo
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- JP2014110243A JP2014110243A JP2013247875A JP2013247875A JP2014110243A JP 2014110243 A JP2014110243 A JP 2014110243A JP 2013247875 A JP2013247875 A JP 2013247875A JP 2013247875 A JP2013247875 A JP 2013247875A JP 2014110243 A JP2014110243 A JP 2014110243A
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- printed circuit
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
- F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/0102—Constructional details, not otherwise provided for in this subclass
- G02F1/0105—Illuminating devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/1336—Illuminating devices
- G02F1/133602—Direct backlight
- G02F1/133612—Electrical details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Liquid Crystal (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Structure Of Printed Boards (AREA)
Abstract
【解決手段】本発明は、発光素子が実装される第1領域及び前記第1領域から延長された第2領域を含む支持基板と、前記第1領域と前記第2領域との間が折り曲げられる折り曲げ部と、前記折り曲げ部を貫通する貫通孔と、前記発光素子と接続されて前記折り曲げ部上に配置される接続配線と、前記接続配線と接続される配線と、を含んで構成される。
【選択図】図2
Description
絶縁基板20は前記支持基板10上に形成される。
貫通孔80は、接続配線90を形成する領域に形成されるものであるので、接続配線90の位置に相応して配置される。
図4を参照すると、本発明の他の実施例によるプリント回路基板100は、支持基板10、折り曲げ部70、接続配線90、配線60を含んで構成され、絶縁基板20、25及びパッド部50をさらに含んで構成されても良い。
このとき、前記接続配線90は、パッド部50によって前記発光素子40と接続することができる。
10 支持基板
20 絶縁基板、第1絶縁基板
25 第2絶縁基板
40 発光素子
50 パッド部
60 配線
70 折り曲げ部
80 貫通孔
90 接続配線
Claims (14)
- 発光素子が実装される第1領域及び前記第1領域から延長された第2領域を含む支持基板と、
前記第1領域と前記第2領域との間が折り曲げられる折り曲げ部と、
前記折り曲げ部を貫通する貫通孔と、
前記発光素子と接続されて前記折り曲げ部上に配置される接続配線と、
前記接続配線と接続される配線と、
を含むプリント回路基板。 - 前記発光素子と前記接続配線を接続するパッド部をさらに含む、請求項1に記載のプリント回路基板。
- 前記配線は、
前記第2領域上に配置される、請求項1に記載のプリント回路基板。 - 前記支持基板上に絶縁基板をさらに含む、請求項1に記載のプリント回路基板。
- 前記配線は、
前記絶縁基板上に構成される、請求項4に記載のプリント回路基板。 - 請求項1〜5のいずれか一項に記載のプリント回路基板を含む照明装置。
- 請求項1〜5のいずれか一項に記載のプリント回路基板を含むバックライトユニット。
- 発光素子が実装される第1領域と前記第1領域から延長された第2領域を含む支持基板と、
前記第1領域と前記第2領域との間が折り曲げられる折り曲げ部と、
前記発光素子と接続されて前記第1領域の折り曲げ部が構成される一側端に対応する他側端に配置される接続配線と、
前記接続配線と接続される配線と、
を含むプリント回路基板。 - 前記第1領域の一面上の前記支持基板に配置される第1絶縁基板と、
前記第1領域の他面上の前記支持基板に配置される第2絶縁基板と、
をさらに含む、請求項8に記載のプリント回路基板。 - 前記発光素子は、
前記第1絶縁基板上に実装される、請求項9に記載のプリント回路基板。 - 前記第1絶縁基板上に配置されて前記発光素子と前記接続配線とを接続するパッド部をさらに含む、請求項9に記載のプリント回路基板。
- 前記配線は、
前記第2絶縁基板上に配置される、請求項9に記載のプリント回路基板。 - 請求項8〜12のいずれか一項に記載のプリント回路基板を含む照明装置。
- 請求項8〜12のいずれか一項に記載のプリント回路基板を含むバックライトユニット。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0138165 | 2012-11-30 | ||
KR1020120138165A KR102099934B1 (ko) | 2012-11-30 | 2012-11-30 | 인쇄회로기판, 상기 인쇄회로기판을 포함하는 조명장치 및 백라이트 유닛 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014110243A true JP2014110243A (ja) | 2014-06-12 |
JP5890379B2 JP5890379B2 (ja) | 2016-03-22 |
Family
ID=49667079
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013247875A Expired - Fee Related JP5890379B2 (ja) | 2012-11-30 | 2013-11-29 | プリント回路基板、プリント回路基板を含む照明装置及びバックライトユニット |
Country Status (5)
Country | Link |
---|---|
US (1) | US9874335B2 (ja) |
EP (1) | EP2739127A3 (ja) |
JP (1) | JP5890379B2 (ja) |
KR (1) | KR102099934B1 (ja) |
CN (1) | CN103857185B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102109752B1 (ko) | 2013-10-02 | 2020-05-12 | 엘지이노텍 주식회사 | 회로기판 및 상기 회로기판을 포함하는 조명장치 |
KR102170480B1 (ko) * | 2013-12-09 | 2020-10-28 | 엘지이노텍 주식회사 | 인쇄회로기판 |
KR102355280B1 (ko) * | 2014-08-20 | 2022-01-25 | 엘지이노텍 주식회사 | 인쇄회로기판 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0353861U (ja) * | 1989-09-29 | 1991-05-24 | ||
JPH07240599A (ja) * | 1994-02-28 | 1995-09-12 | Sony Corp | 部品配線装置 |
JPH09326575A (ja) * | 1996-06-05 | 1997-12-16 | Dx Antenna Co Ltd | Led支持構造 |
JP2006201215A (ja) * | 2005-01-18 | 2006-08-03 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、電子機器 |
JP2010238540A (ja) * | 2009-03-31 | 2010-10-21 | Renesas Electronics Corp | 発光モジュールおよびその製造方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2621774B1 (fr) | 1987-10-12 | 1990-02-16 | Dav | Plaque circuit pour courants eleves et procede de preparation |
JPH0353861A (ja) | 1989-07-21 | 1991-03-07 | Kisaku Suzuki | パック詰め米飯食品 |
CN1154403C (zh) * | 1994-09-27 | 2004-06-16 | 精工爱普生株式会社 | 印刷电路板及其制造方法和电子装置 |
US20050184372A1 (en) * | 2004-02-20 | 2005-08-25 | Matsushita Electric Industrial Co., Ltd. | Three-dimensional mounting structure and method for producing the same |
KR101004994B1 (ko) * | 2005-07-29 | 2011-01-04 | 교에이 덴시 가부시키가이샤 | 굴곡식 리지드 프린트 배선판 및 그 제조 방법 |
JP4095082B2 (ja) * | 2005-08-31 | 2008-06-04 | Tdk株式会社 | 磁気ヘッドアッセンブリのフレキシブル配線板 |
KR101412755B1 (ko) * | 2008-01-21 | 2014-07-01 | 삼성디스플레이 주식회사 | 표시 장치 |
DE102009018447A1 (de) * | 2009-04-22 | 2010-11-04 | Automotive Lighting Reutlingen Gmbh | Leiterplatte |
-
2012
- 2012-11-30 KR KR1020120138165A patent/KR102099934B1/ko active IP Right Grant
-
2013
- 2013-11-26 CN CN201310611193.XA patent/CN103857185B/zh not_active Expired - Fee Related
- 2013-11-27 US US14/091,755 patent/US9874335B2/en active Active
- 2013-11-29 EP EP13195004.0A patent/EP2739127A3/en not_active Withdrawn
- 2013-11-29 JP JP2013247875A patent/JP5890379B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0353861U (ja) * | 1989-09-29 | 1991-05-24 | ||
JPH07240599A (ja) * | 1994-02-28 | 1995-09-12 | Sony Corp | 部品配線装置 |
JPH09326575A (ja) * | 1996-06-05 | 1997-12-16 | Dx Antenna Co Ltd | Led支持構造 |
JP2006201215A (ja) * | 2005-01-18 | 2006-08-03 | Seiko Epson Corp | 電気光学装置、電気光学装置の製造方法、電子機器 |
JP2010238540A (ja) * | 2009-03-31 | 2010-10-21 | Renesas Electronics Corp | 発光モジュールおよびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20140070092A (ko) | 2014-06-10 |
KR102099934B1 (ko) | 2020-04-10 |
CN103857185A (zh) | 2014-06-11 |
US9874335B2 (en) | 2018-01-23 |
EP2739127A3 (en) | 2014-11-05 |
EP2739127A2 (en) | 2014-06-04 |
US20140153221A1 (en) | 2014-06-05 |
CN103857185B (zh) | 2017-06-23 |
JP5890379B2 (ja) | 2016-03-22 |
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