JP2014099630A5 - - Google Patents

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Publication number
JP2014099630A5
JP2014099630A5 JP2013267265A JP2013267265A JP2014099630A5 JP 2014099630 A5 JP2014099630 A5 JP 2014099630A5 JP 2013267265 A JP2013267265 A JP 2013267265A JP 2013267265 A JP2013267265 A JP 2013267265A JP 2014099630 A5 JP2014099630 A5 JP 2014099630A5
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JP
Japan
Prior art keywords
bist
semiconductor integrated
integrated circuit
circuit
switching
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Pending
Application number
JP2013267265A
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English (en)
Japanese (ja)
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JP2014099630A (ja
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Priority to JP2013267265A priority Critical patent/JP2014099630A/ja
Priority claimed from JP2013267265A external-priority patent/JP2014099630A/ja
Publication of JP2014099630A publication Critical patent/JP2014099630A/ja
Publication of JP2014099630A5 publication Critical patent/JP2014099630A5/ja
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JP2013267265A 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法 Pending JP2014099630A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013267265A JP2014099630A (ja) 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013267265A JP2014099630A (ja) 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2008099664A Division JP5454994B2 (ja) 2008-04-07 2008-04-07 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

Publications (2)

Publication Number Publication Date
JP2014099630A JP2014099630A (ja) 2014-05-29
JP2014099630A5 true JP2014099630A5 (https=) 2014-07-10

Family

ID=50941348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013267265A Pending JP2014099630A (ja) 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

Country Status (1)

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JP (1) JP2014099630A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102458036B1 (ko) * 2015-12-18 2022-10-21 삼성전자주식회사 반도체 장치의 테스트 보드 및 이를 포함하는 테스트 시스템

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085479A (ja) * 1999-09-10 2001-03-30 Mitsubishi Electric Corp 半導体回路装置の製造方法
JP2003124275A (ja) * 2001-10-12 2003-04-25 Toshiba Corp 半導体ウェーハ
JP2003209148A (ja) * 2002-01-16 2003-07-25 Sony Corp 半導体ウェハおよび半導体ウェハの検査方法ならびに半導体装置の製造方法

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