JP2014099630A - 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法 - Google Patents

半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法 Download PDF

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JP2014099630A
JP2014099630A JP2013267265A JP2013267265A JP2014099630A JP 2014099630 A JP2014099630 A JP 2014099630A JP 2013267265 A JP2013267265 A JP 2013267265A JP 2013267265 A JP2013267265 A JP 2013267265A JP 2014099630 A JP2014099630 A JP 2014099630A
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semiconductor integrated
integrated circuit
bist
circuit
pad
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JP2014099630A5 (https=
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Manabu Miyazaki
学 宮崎
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PS4 Luxco SARL
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PS4 Luxco SARL
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  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2013267265A 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法 Pending JP2014099630A (ja)

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JP2013267265A JP2014099630A (ja) 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

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JP2013267265A JP2014099630A (ja) 2013-12-25 2013-12-25 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

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JP2008099664A Division JP5454994B2 (ja) 2008-04-07 2008-04-07 半導体集積回路ウエハ、半導体集積回路チップ及び半導体集積回路ウエハのテスト方法

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JP2014099630A true JP2014099630A (ja) 2014-05-29
JP2014099630A5 JP2014099630A5 (https=) 2014-07-10

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170073172A (ko) * 2015-12-18 2017-06-28 삼성전자주식회사 반도체 장치의 테스트 보드 및 이를 포함하는 테스트 시스템

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085479A (ja) * 1999-09-10 2001-03-30 Mitsubishi Electric Corp 半導体回路装置の製造方法
JP2003124275A (ja) * 2001-10-12 2003-04-25 Toshiba Corp 半導体ウェーハ
JP2003209148A (ja) * 2002-01-16 2003-07-25 Sony Corp 半導体ウェハおよび半導体ウェハの検査方法ならびに半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085479A (ja) * 1999-09-10 2001-03-30 Mitsubishi Electric Corp 半導体回路装置の製造方法
JP2003124275A (ja) * 2001-10-12 2003-04-25 Toshiba Corp 半導体ウェーハ
JP2003209148A (ja) * 2002-01-16 2003-07-25 Sony Corp 半導体ウェハおよび半導体ウェハの検査方法ならびに半導体装置の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170073172A (ko) * 2015-12-18 2017-06-28 삼성전자주식회사 반도체 장치의 테스트 보드 및 이를 포함하는 테스트 시스템
KR102458036B1 (ko) 2015-12-18 2022-10-21 삼성전자주식회사 반도체 장치의 테스트 보드 및 이를 포함하는 테스트 시스템

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