JP2014095038A - 反射材用組成物及びこれを用いた光半導体発光装置 - Google Patents

反射材用組成物及びこれを用いた光半導体発光装置 Download PDF

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Publication number
JP2014095038A
JP2014095038A JP2012247632A JP2012247632A JP2014095038A JP 2014095038 A JP2014095038 A JP 2014095038A JP 2012247632 A JP2012247632 A JP 2012247632A JP 2012247632 A JP2012247632 A JP 2012247632A JP 2014095038 A JP2014095038 A JP 2014095038A
Authority
JP
Japan
Prior art keywords
meth
acrylate
composition
mass
group
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012247632A
Other languages
English (en)
Japanese (ja)
Inventor
Takeshi Iwasaki
猛 岩崎
Haruhiko Mori
晴彦 森
Daichi Ogawa
大地 小川
Hiroshi Obata
寛 小幡
Tomoyoshi Murakami
友良 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemitsu Kosan Co Ltd
Original Assignee
Idemitsu Kosan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idemitsu Kosan Co Ltd filed Critical Idemitsu Kosan Co Ltd
Priority to JP2012247632A priority Critical patent/JP2014095038A/ja
Priority to PCT/JP2013/006590 priority patent/WO2014073212A1/fr
Priority to TW102140827A priority patent/TWI632180B/zh
Publication of JP2014095038A publication Critical patent/JP2014095038A/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0058Processes relating to semiconductor body packages relating to optical field-shaping elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2012247632A 2012-11-09 2012-11-09 反射材用組成物及びこれを用いた光半導体発光装置 Pending JP2014095038A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012247632A JP2014095038A (ja) 2012-11-09 2012-11-09 反射材用組成物及びこれを用いた光半導体発光装置
PCT/JP2013/006590 WO2014073212A1 (fr) 2012-11-09 2013-11-08 Composition de matière réfléchissante et dispositif d'émission de lumière semi-conducteur optique l'utilisant
TW102140827A TWI632180B (zh) 2012-11-09 2013-11-08 Composition for reflective material and optical semiconductor light-emitting device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012247632A JP2014095038A (ja) 2012-11-09 2012-11-09 反射材用組成物及びこれを用いた光半導体発光装置

Publications (1)

Publication Number Publication Date
JP2014095038A true JP2014095038A (ja) 2014-05-22

Family

ID=50684337

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012247632A Pending JP2014095038A (ja) 2012-11-09 2012-11-09 反射材用組成物及びこれを用いた光半導体発光装置

Country Status (3)

Country Link
JP (1) JP2014095038A (fr)
TW (1) TWI632180B (fr)
WO (1) WO2014073212A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015089922A (ja) * 2013-11-06 2015-05-11 出光興産株式会社 反射材用組成物及びこれを用いた光半導体発光装置
WO2015198580A1 (fr) * 2014-06-23 2015-12-30 出光興産株式会社 Composition thermodurcissable et son procédé de production
JP2018123339A (ja) * 2018-04-27 2018-08-09 出光興産株式会社 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0726121A (ja) * 1993-07-15 1995-01-27 Denki Kagaku Kogyo Kk 光機能素子封止樹脂組成物
JP4019806B2 (ja) * 2002-06-12 2007-12-12 大日本インキ化学工業株式会社 活性エネルギー線硬化性組成物
JP5080114B2 (ja) * 2007-03-20 2012-11-21 出光興産株式会社 光半導体用反射材
JP4892380B2 (ja) * 2007-03-26 2012-03-07 出光興産株式会社 光半導体用反射材
JP2009132763A (ja) * 2007-11-29 2009-06-18 Toyo Ink Mfg Co Ltd 硬化性組成物
WO2009096253A1 (fr) * 2008-01-29 2009-08-06 Konica Minolta Opto, Inc. Materiau composite a usage optique et dispositif optique comprenant ledit materiau
KR101853598B1 (ko) * 2010-03-23 2018-04-30 가부시키가이샤 아사히 러버 실리콘 수지제 반사 기재, 그 제조 방법, 및 그 반사 기재에 이용하는 원재료 조성물
US20130237660A1 (en) * 2010-10-25 2013-09-12 Idemitsu Kosan Co. Ltd (meth)acrylate composition
JP5683936B2 (ja) * 2010-12-20 2015-03-11 出光興産株式会社 熱硬化性樹脂の射出成形方法、射出成形用金型および射出成形機
KR101415448B1 (ko) * 2011-02-02 2014-07-04 세키스이가가쿠 고교가부시키가이샤 조화 경화물 및 적층체

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015089922A (ja) * 2013-11-06 2015-05-11 出光興産株式会社 反射材用組成物及びこれを用いた光半導体発光装置
WO2015198580A1 (fr) * 2014-06-23 2015-12-30 出光興産株式会社 Composition thermodurcissable et son procédé de production
JP2016008230A (ja) * 2014-06-23 2016-01-18 出光興産株式会社 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法
CN106459550A (zh) * 2014-06-23 2017-02-22 出光兴产株式会社 热固性组合物、和该热固化性树脂的制造方法
US20170203476A1 (en) * 2014-06-23 2017-07-20 Idemitsu Kosan Co., Ltd. Thermosetting composition, and method for manufacturing thermoset resin
TWI639642B (zh) * 2014-06-23 2018-11-01 日商出光興產股份有限公司 熱硬化性組成物及該熱硬化樹脂的製造方法
KR101930148B1 (ko) 2014-06-23 2018-12-17 이데미쓰 고산 가부시키가이샤 열경화성 조성물 및 당해 열경화 수지의 제조 방법
US10668650B2 (en) 2014-06-23 2020-06-02 Idemistu Kosan Co., Ltd. Thermosetting composition, and method for manufacturing thermoset resin
JP2018123339A (ja) * 2018-04-27 2018-08-09 出光興産株式会社 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法

Also Published As

Publication number Publication date
WO2014073212A1 (fr) 2014-05-15
TWI632180B (zh) 2018-08-11
TW201431920A (zh) 2014-08-16

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