JP2014095038A - 反射材用組成物及びこれを用いた光半導体発光装置 - Google Patents
反射材用組成物及びこれを用いた光半導体発光装置 Download PDFInfo
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- JP2014095038A JP2014095038A JP2012247632A JP2012247632A JP2014095038A JP 2014095038 A JP2014095038 A JP 2014095038A JP 2012247632 A JP2012247632 A JP 2012247632A JP 2012247632 A JP2012247632 A JP 2012247632A JP 2014095038 A JP2014095038 A JP 2014095038A
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- 239000011732 tocopherol Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
- GVJHHUAWPYXKBD-IEOSBIPESA-N α-tocopherol Chemical compound OC1=C(C)C(C)=C2O[C@@](CCC[C@H](C)CCC[C@H](C)CCCC(C)C)(C)CCC2=C1C GVJHHUAWPYXKBD-IEOSBIPESA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012247632A JP2014095038A (ja) | 2012-11-09 | 2012-11-09 | 反射材用組成物及びこれを用いた光半導体発光装置 |
PCT/JP2013/006590 WO2014073212A1 (fr) | 2012-11-09 | 2013-11-08 | Composition de matière réfléchissante et dispositif d'émission de lumière semi-conducteur optique l'utilisant |
TW102140827A TWI632180B (zh) | 2012-11-09 | 2013-11-08 | Composition for reflective material and optical semiconductor light-emitting device using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012247632A JP2014095038A (ja) | 2012-11-09 | 2012-11-09 | 反射材用組成物及びこれを用いた光半導体発光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014095038A true JP2014095038A (ja) | 2014-05-22 |
Family
ID=50684337
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012247632A Pending JP2014095038A (ja) | 2012-11-09 | 2012-11-09 | 反射材用組成物及びこれを用いた光半導体発光装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2014095038A (fr) |
TW (1) | TWI632180B (fr) |
WO (1) | WO2014073212A1 (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015089922A (ja) * | 2013-11-06 | 2015-05-11 | 出光興産株式会社 | 反射材用組成物及びこれを用いた光半導体発光装置 |
WO2015198580A1 (fr) * | 2014-06-23 | 2015-12-30 | 出光興産株式会社 | Composition thermodurcissable et son procédé de production |
JP2018123339A (ja) * | 2018-04-27 | 2018-08-09 | 出光興産株式会社 | 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0726121A (ja) * | 1993-07-15 | 1995-01-27 | Denki Kagaku Kogyo Kk | 光機能素子封止樹脂組成物 |
JP4019806B2 (ja) * | 2002-06-12 | 2007-12-12 | 大日本インキ化学工業株式会社 | 活性エネルギー線硬化性組成物 |
JP5080114B2 (ja) * | 2007-03-20 | 2012-11-21 | 出光興産株式会社 | 光半導体用反射材 |
JP4892380B2 (ja) * | 2007-03-26 | 2012-03-07 | 出光興産株式会社 | 光半導体用反射材 |
JP2009132763A (ja) * | 2007-11-29 | 2009-06-18 | Toyo Ink Mfg Co Ltd | 硬化性組成物 |
WO2009096253A1 (fr) * | 2008-01-29 | 2009-08-06 | Konica Minolta Opto, Inc. | Materiau composite a usage optique et dispositif optique comprenant ledit materiau |
KR101853598B1 (ko) * | 2010-03-23 | 2018-04-30 | 가부시키가이샤 아사히 러버 | 실리콘 수지제 반사 기재, 그 제조 방법, 및 그 반사 기재에 이용하는 원재료 조성물 |
US20130237660A1 (en) * | 2010-10-25 | 2013-09-12 | Idemitsu Kosan Co. Ltd | (meth)acrylate composition |
JP5683936B2 (ja) * | 2010-12-20 | 2015-03-11 | 出光興産株式会社 | 熱硬化性樹脂の射出成形方法、射出成形用金型および射出成形機 |
KR101415448B1 (ko) * | 2011-02-02 | 2014-07-04 | 세키스이가가쿠 고교가부시키가이샤 | 조화 경화물 및 적층체 |
-
2012
- 2012-11-09 JP JP2012247632A patent/JP2014095038A/ja active Pending
-
2013
- 2013-11-08 TW TW102140827A patent/TWI632180B/zh not_active IP Right Cessation
- 2013-11-08 WO PCT/JP2013/006590 patent/WO2014073212A1/fr active Application Filing
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015089922A (ja) * | 2013-11-06 | 2015-05-11 | 出光興産株式会社 | 反射材用組成物及びこれを用いた光半導体発光装置 |
WO2015198580A1 (fr) * | 2014-06-23 | 2015-12-30 | 出光興産株式会社 | Composition thermodurcissable et son procédé de production |
JP2016008230A (ja) * | 2014-06-23 | 2016-01-18 | 出光興産株式会社 | 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法 |
CN106459550A (zh) * | 2014-06-23 | 2017-02-22 | 出光兴产株式会社 | 热固性组合物、和该热固化性树脂的制造方法 |
US20170203476A1 (en) * | 2014-06-23 | 2017-07-20 | Idemitsu Kosan Co., Ltd. | Thermosetting composition, and method for manufacturing thermoset resin |
TWI639642B (zh) * | 2014-06-23 | 2018-11-01 | 日商出光興產股份有限公司 | 熱硬化性組成物及該熱硬化樹脂的製造方法 |
KR101930148B1 (ko) | 2014-06-23 | 2018-12-17 | 이데미쓰 고산 가부시키가이샤 | 열경화성 조성물 및 당해 열경화 수지의 제조 방법 |
US10668650B2 (en) | 2014-06-23 | 2020-06-02 | Idemistu Kosan Co., Ltd. | Thermosetting composition, and method for manufacturing thermoset resin |
JP2018123339A (ja) * | 2018-04-27 | 2018-08-09 | 出光興産株式会社 | 熱硬化性組成物、及び当該熱硬化性樹脂の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2014073212A1 (fr) | 2014-05-15 |
TWI632180B (zh) | 2018-08-11 |
TW201431920A (zh) | 2014-08-16 |
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