JP2014089162A - 検査装置及び検査方法 - Google Patents

検査装置及び検査方法 Download PDF

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Publication number
JP2014089162A
JP2014089162A JP2012240522A JP2012240522A JP2014089162A JP 2014089162 A JP2014089162 A JP 2014089162A JP 2012240522 A JP2012240522 A JP 2012240522A JP 2012240522 A JP2012240522 A JP 2012240522A JP 2014089162 A JP2014089162 A JP 2014089162A
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JP
Japan
Prior art keywords
signal
detection
unit
light
inspection apparatus
Prior art date
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Pending
Application number
JP2012240522A
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English (en)
Japanese (ja)
Other versions
JP2014089162A5 (enExample
Inventor
Masami Makuuchi
雅巳 幕内
Takahiro Jingu
孝広 神宮
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2012240522A priority Critical patent/JP2014089162A/ja
Priority to US14/440,029 priority patent/US20150293034A1/en
Priority to PCT/JP2013/078659 priority patent/WO2014069293A1/ja
Publication of JP2014089162A publication Critical patent/JP2014089162A/ja
Publication of JP2014089162A5 publication Critical patent/JP2014089162A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J2001/4238—Pulsed light
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896—Circuits specially adapted for system specific signal conditioning

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2012240522A 2012-10-31 2012-10-31 検査装置及び検査方法 Pending JP2014089162A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012240522A JP2014089162A (ja) 2012-10-31 2012-10-31 検査装置及び検査方法
US14/440,029 US20150293034A1 (en) 2012-10-31 2013-10-23 Inspection device and inspection method
PCT/JP2013/078659 WO2014069293A1 (ja) 2012-10-31 2013-10-23 検査装置及び検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012240522A JP2014089162A (ja) 2012-10-31 2012-10-31 検査装置及び検査方法

Publications (2)

Publication Number Publication Date
JP2014089162A true JP2014089162A (ja) 2014-05-15
JP2014089162A5 JP2014089162A5 (enExample) 2015-03-05

Family

ID=50627204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012240522A Pending JP2014089162A (ja) 2012-10-31 2012-10-31 検査装置及び検査方法

Country Status (3)

Country Link
US (1) US20150293034A1 (enExample)
JP (1) JP2014089162A (enExample)
WO (1) WO2014069293A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025177433A1 (ja) * 2024-02-20 2025-08-28 株式会社日立ハイテク 欠陥検査装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9985071B2 (en) * 2016-04-15 2018-05-29 Qualcomm Incorporated Active area selection for LIDAR receivers
CN113721224B (zh) * 2021-08-10 2025-07-18 桂林理工大学 一种光电倍增管选通变增益系统

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306906A (ja) * 1992-04-30 1993-11-19 Sharp Corp 移動物体検出装置
JP2000338048A (ja) * 1999-05-31 2000-12-08 Hamamatsu Photonics Kk 表面検査方法及び検査装置
JP2003130808A (ja) * 2001-10-29 2003-05-08 Hitachi Ltd 欠陥検査方法及びその装置
JP2005536732A (ja) * 2002-08-23 2005-12-02 ライカ マイクロシステムス セミコンダクタ ゲーエムベーハー 物体を検査するための装置及び方法
JP2007101227A (ja) * 2005-09-30 2007-04-19 Toshiba Corp 表面検査装置
JP2007122507A (ja) * 2005-10-28 2007-05-17 Secom Co Ltd 侵入検知装置
JP2008020359A (ja) * 2006-07-13 2008-01-31 Hitachi High-Technologies Corp 表面検査方法及び装置
JP2012132791A (ja) * 2010-12-22 2012-07-12 Hitachi High-Technologies Corp 欠陥検査方法および欠陥検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004233163A (ja) * 2003-01-29 2004-08-19 Hitachi High-Technologies Corp パターン欠陥検査方法およびその装置
JP2010048587A (ja) * 2008-08-20 2010-03-04 Hitachi High-Technologies Corp パターン欠陥検査装置および方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05306906A (ja) * 1992-04-30 1993-11-19 Sharp Corp 移動物体検出装置
JP2000338048A (ja) * 1999-05-31 2000-12-08 Hamamatsu Photonics Kk 表面検査方法及び検査装置
JP2003130808A (ja) * 2001-10-29 2003-05-08 Hitachi Ltd 欠陥検査方法及びその装置
JP2005536732A (ja) * 2002-08-23 2005-12-02 ライカ マイクロシステムス セミコンダクタ ゲーエムベーハー 物体を検査するための装置及び方法
JP2007101227A (ja) * 2005-09-30 2007-04-19 Toshiba Corp 表面検査装置
JP2007122507A (ja) * 2005-10-28 2007-05-17 Secom Co Ltd 侵入検知装置
JP2008020359A (ja) * 2006-07-13 2008-01-31 Hitachi High-Technologies Corp 表面検査方法及び装置
JP2012132791A (ja) * 2010-12-22 2012-07-12 Hitachi High-Technologies Corp 欠陥検査方法および欠陥検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025177433A1 (ja) * 2024-02-20 2025-08-28 株式会社日立ハイテク 欠陥検査装置

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Publication number Publication date
US20150293034A1 (en) 2015-10-15
WO2014069293A1 (ja) 2014-05-08

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