JP2014086733A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2014086733A5 JP2014086733A5 JP2013218739A JP2013218739A JP2014086733A5 JP 2014086733 A5 JP2014086733 A5 JP 2014086733A5 JP 2013218739 A JP2013218739 A JP 2013218739A JP 2013218739 A JP2013218739 A JP 2013218739A JP 2014086733 A5 JP2014086733 A5 JP 2014086733A5
- Authority
- JP
- Japan
- Prior art keywords
- series
- spectrum
- spectra
- measured
- polishing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001228 spectrum Methods 0.000 claims description 122
- 238000005498 polishing Methods 0.000 claims description 40
- 238000005259 measurement Methods 0.000 claims description 22
- 238000012544 monitoring process Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000004590 computer program Methods 0.000 claims 21
- 238000011065 in-situ storage Methods 0.000 claims 8
- 230000003595 spectral effect Effects 0.000 claims 3
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/658,737 US9221147B2 (en) | 2012-10-23 | 2012-10-23 | Endpointing with selective spectral monitoring |
| US13/658,737 | 2012-10-23 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014086733A JP2014086733A (ja) | 2014-05-12 |
| JP2014086733A5 true JP2014086733A5 (enExample) | 2016-12-08 |
| JP6292819B2 JP6292819B2 (ja) | 2018-03-14 |
Family
ID=50485749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013218739A Active JP6292819B2 (ja) | 2012-10-23 | 2013-10-21 | 選択的スペクトルモニタリングを使用した終点決定 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9221147B2 (enExample) |
| JP (1) | JP6292819B2 (enExample) |
| KR (1) | KR101980921B1 (enExample) |
| TW (1) | TWI643701B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
| KR20170092522A (ko) | 2014-09-08 | 2017-08-11 | 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 | 금속 격자 및 이의 측정 방법 |
| CN107097154B (zh) * | 2017-04-28 | 2023-06-13 | 昆明理工大学 | 一种简易抛光液流量控制供给装置及其控制方法 |
| US10964609B2 (en) * | 2018-11-30 | 2021-03-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and method for detecting end point |
| CN119486839A (zh) * | 2022-06-22 | 2025-02-18 | 应用材料公司 | 用于控制抛光处理的窗口逻辑 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5747380A (en) | 1996-02-26 | 1998-05-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Robust end-point detection for contact and via etching |
| US6271047B1 (en) | 1998-05-21 | 2001-08-07 | Nikon Corporation | Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same |
| TW398036B (en) | 1998-08-18 | 2000-07-11 | Promos Technologies Inc | Method of monitoring of chemical mechanical polishing end point and uniformity |
| US6358327B1 (en) | 1999-06-29 | 2002-03-19 | Applied Materials, Inc. | Method for endpoint detection using throttle valve position |
| JP3932836B2 (ja) * | 2001-07-27 | 2007-06-20 | 株式会社日立製作所 | 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法 |
| US6618130B2 (en) | 2001-08-28 | 2003-09-09 | Speedfam-Ipec Corporation | Method and apparatus for optical endpoint detection during chemical mechanical polishing |
| US6806948B2 (en) | 2002-03-29 | 2004-10-19 | Lam Research Corporation | System and method of broad band optical end point detection for film change indication |
| JP5534672B2 (ja) * | 2005-08-22 | 2014-07-02 | アプライド マテリアルズ インコーポレイテッド | 化学機械的研磨のスペクトルに基づく監視のための装置および方法 |
| US7764377B2 (en) | 2005-08-22 | 2010-07-27 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| US8260446B2 (en) | 2005-08-22 | 2012-09-04 | Applied Materials, Inc. | Spectrographic monitoring of a substrate during processing using index values |
| US7998358B2 (en) * | 2006-10-31 | 2011-08-16 | Applied Materials, Inc. | Peak-based endpointing for chemical mechanical polishing |
| KR101678082B1 (ko) * | 2007-02-23 | 2016-11-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용 |
| WO2010062497A2 (en) * | 2008-10-27 | 2010-06-03 | Applied Materials, Inc. | Goodness of fit in spectrographic monitoring of a substrate during processing |
| US8751033B2 (en) | 2008-11-14 | 2014-06-10 | Applied Materials, Inc. | Adaptive tracking spectrum features for endpoint detection |
| US20100316962A1 (en) | 2009-06-10 | 2010-12-16 | Heidi Elise Newell | Method for embodying an incense-coated template in variety of ornate and complex designs or patterns |
| JP5583946B2 (ja) * | 2009-10-06 | 2014-09-03 | 株式会社荏原製作所 | 研磨終点検知方法および研磨終点検知装置 |
| WO2011056485A2 (en) * | 2009-11-03 | 2011-05-12 | Applied Materials, Inc. | Endpoint method using peak location of spectra contour plots versus time |
| US8834229B2 (en) * | 2010-05-05 | 2014-09-16 | Applied Materials, Inc. | Dynamically tracking spectrum features for endpoint detection |
| US20110282477A1 (en) * | 2010-05-17 | 2011-11-17 | Applied Materials, Inc. | Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing |
| US8930013B2 (en) * | 2010-06-28 | 2015-01-06 | Applied Materials, Inc. | Adaptively tracking spectrum features for endpoint detection |
| TWI478259B (zh) * | 2010-07-23 | 2015-03-21 | Applied Materials Inc | 用於終點偵測之二維光譜特徵追蹤 |
| US20120034844A1 (en) * | 2010-08-05 | 2012-02-09 | Applied Materials, Inc. | Spectrographic monitoring using index tracking after detection of layer clearing |
| US8694144B2 (en) * | 2010-08-30 | 2014-04-08 | Applied Materials, Inc. | Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing |
| US20120100781A1 (en) * | 2010-10-20 | 2012-04-26 | Jimin Zhang | Multiple matching reference spectra for in-situ optical monitoring |
| US8825988B2 (en) * | 2010-11-12 | 2014-09-02 | Advanced Micro Devices, Inc. | Matrix algorithm for scheduling operations |
| US20120278028A1 (en) | 2011-04-28 | 2012-11-01 | Jeffrey Drue David | Generating model based spectra library for polishing |
| KR101892914B1 (ko) | 2012-03-08 | 2018-08-29 | 어플라이드 머티어리얼스, 인코포레이티드 | 측정된 스펙트럼에 대한 광학 모델의 피팅 |
| US8563335B1 (en) | 2012-04-23 | 2013-10-22 | Applied Materials, Inc. | Method of controlling polishing using in-situ optical monitoring and fourier transform |
| US20140020829A1 (en) | 2012-07-18 | 2014-01-23 | Applied Materials, Inc. | Sensors in Carrier Head of a CMP System |
| US8808059B1 (en) * | 2013-02-27 | 2014-08-19 | Applied Materials, Inc. | Spectraphic monitoring based on pre-screening of theoretical library |
-
2012
- 2012-10-23 US US13/658,737 patent/US9221147B2/en active Active
-
2013
- 2013-10-17 TW TW102137537A patent/TWI643701B/zh active
- 2013-10-21 JP JP2013218739A patent/JP6292819B2/ja active Active
- 2013-10-22 KR KR1020130126070A patent/KR101980921B1/ko active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2010519771A5 (enExample) | ||
| JP7561817B2 (ja) | ニューラルネットワークを使用する分光モニタリング | |
| KR102741434B1 (ko) | 분광 모니터링을 위한 기계 학습 시스템을 위한 훈련 스펙트럼 생성 | |
| JP2014086733A5 (enExample) | ||
| JP6336982B2 (ja) | その場測定のための光計測 | |
| JP2015528569A5 (enExample) | ||
| JP2011520264A5 (enExample) | ||
| JP6562916B2 (ja) | 予測フィルタを用いた基板研磨中の研磨速度の調整 | |
| JP2012238882A5 (enExample) | ||
| JP2014512690A5 (enExample) | ||
| IL274834B2 (en) | A method for determining information about a printing procedure, a method for reducing errors in measurement data, a method for calibrating a metrology process, a method for selecting metrological targets | |
| JP2017515307A5 (enExample) | ||
| US8992286B2 (en) | Weighted regression of thickness maps from spectral data | |
| JP2009004442A (ja) | 半導体ウェハの研磨方法 | |
| TR201903671T4 (tr) | Bir taşıyıcı plaka üzerinde düzenlenen en az bir aşınma katmanının abrazyon dayanımının belirlenmesine yönelik yöntem. | |
| US11110565B2 (en) | Polishing apparatus, polishing method, and polishing control apparatus | |
| FI3363946T3 (fi) | Anturitelaan ja vastatelaan liittyvä menetelmä ja järjestelmä telatietojen keräämiseen | |
| Moghtadaiee et al. | Determining the best vector distance measure for use in location fingerprinting | |
| US10955359B2 (en) | Method for quantification of process non uniformity using model-based metrology | |
| CN102873632B (zh) | 用于确定抛光机的抛光垫的厚度度量的方法和设备 | |
| CN115099386A (zh) | 用于标记用于摄谱监测的机器学习系统的训练光谱的原位监测 | |
| JP6292819B2 (ja) | 選択的スペクトルモニタリングを使用した終点決定 | |
| MX360263B (es) | Sistemas y metodos para analisis de textura de una superficie revestida utilizando geometrias multi-dimensionales. | |
| KR20150005642A (ko) | 폴리싱 엔드포인트 검출에서의 데이터 시퀀스들을 위한 사용자 입력 함수들 | |
| JP5274105B2 (ja) | 研磨終点検出方法 |