TWI643701B - 控制硏磨的方法，及其電腦程式產品和硏磨設備 - Google Patents

控制硏磨的方法，及其電腦程式產品和硏磨設備 Download PDF

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Publication number
TWI643701B
TWI643701B TW102137537A TW102137537A TWI643701B TW I643701 B TWI643701 B TW I643701B TW 102137537 A TW102137537 A TW 102137537A TW 102137537 A TW102137537 A TW 102137537A TW I643701 B TWI643701 B TW I643701B
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TW
Taiwan
Prior art keywords
spectrum
sequence
measured
spectral
measurement
Prior art date
Application number
TW102137537A
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English (en)
Chinese (zh)
Other versions
TW201422368A (zh
Inventor
錢隽
迪漢達潘尼席維庫瑪
傑瑞安班傑明
歐斯特赫德湯瑪士Ｈ
大衛傑弗瑞杜魯
敏克葛利格瑞Ｅ
史威克柏格斯勞Ａ
班尼特杜里Ｅ
Original Assignee
美商應用材料股份有限公司
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW201422368A publication Critical patent/TW201422368A/zh
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Publication of TWI643701B publication Critical patent/TWI643701B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW102137537A 2012-10-23 2013-10-17 控制硏磨的方法，及其電腦程式產品和硏磨設備 TWI643701B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/658,737 US9221147B2 (en) 2012-10-23 2012-10-23 Endpointing with selective spectral monitoring
US13/658,737 2012-10-23

Publications (2)

Publication Number Publication Date
TW201422368A TW201422368A (zh) 2014-06-16
TWI643701B true TWI643701B (zh) 2018-12-11

Family

ID=50485749

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102137537A TWI643701B (zh) 2012-10-23 2013-10-17 控制硏磨的方法，及其電腦程式產品和硏磨設備

Country Status (4)

Country Link
US (1) US9221147B2 (enExample)
JP (1) JP6292819B2 (enExample)
KR (1) KR101980921B1 (enExample)
TW (1) TWI643701B (enExample)

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US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
KR20170092522A (ko) 2014-09-08 2017-08-11 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 금속 격자 및 이의 측정 방법
CN107097154B (zh) * 2017-04-28 2023-06-13 昆明理工大学 一种简易抛光液流量控制供给装置及其控制方法
US10964609B2 (en) * 2018-11-30 2021-03-30 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for detecting end point
CN119486839A (zh) * 2022-06-22 2025-02-18 应用材料公司 用于控制抛光处理的窗口逻辑

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TW201128336A (en) * 2009-11-03 2011-08-16 Applied Materials Inc Endpoint method using peak location of spectra contour plots versus time
TW201213050A (en) * 2010-08-05 2012-04-01 Applied Materials Inc Spectrographic monitoring using index tracking after detection of layer clearing
TW201228772A (en) * 2010-10-20 2012-07-16 Applied Materials Inc Multiple matching reference spectra for in-situ optical monitoring

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US6271047B1 (en) 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
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TW201022870A (en) * 2008-10-27 2010-06-16 Applied Materials Inc Goodness of fit in spectrographic monitoring of a substrate during processing
US20110081829A1 (en) * 2009-10-06 2011-04-07 Shinrou Ohta Polishing endpoint detection method and polishing endpoint detection apparatus
TW201128336A (en) * 2009-11-03 2011-08-16 Applied Materials Inc Endpoint method using peak location of spectra contour plots versus time
TW201213050A (en) * 2010-08-05 2012-04-01 Applied Materials Inc Spectrographic monitoring using index tracking after detection of layer clearing
TW201228772A (en) * 2010-10-20 2012-07-16 Applied Materials Inc Multiple matching reference spectra for in-situ optical monitoring

Also Published As

Publication number Publication date
JP2014086733A (ja) 2014-05-12
JP6292819B2 (ja) 2018-03-14
KR101980921B1 (ko) 2019-05-21
US20140113524A1 (en) 2014-04-24
KR20140051798A (ko) 2014-05-02
US9221147B2 (en) 2015-12-29
TW201422368A (zh) 2014-06-16

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