JP6292819B2 - 選択的スペクトルモニタリングを使用した終点決定 - Google Patents

選択的スペクトルモニタリングを使用した終点決定 Download PDF

Info

Publication number
JP6292819B2
JP6292819B2 JP2013218739A JP2013218739A JP6292819B2 JP 6292819 B2 JP6292819 B2 JP 6292819B2 JP 2013218739 A JP2013218739 A JP 2013218739A JP 2013218739 A JP2013218739 A JP 2013218739A JP 6292819 B2 JP6292819 B2 JP 6292819B2
Authority
JP
Japan
Prior art keywords
series
spectra
spectrum
measured
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013218739A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014086733A (ja
JP2014086733A5 (enExample
Inventor
チュン チェン，
チュン チェン，
シヴァクマール ダンダパーニ，
シヴァクマール ダンダパーニ，
ベンジャミン シェリアン，
ベンジャミン シェリアン，
トーマス エイチ． オスターヘルド，
トーマス エイチ． オスターヘルド，
ジェフリー ドリュー デーヴィッド，
ジェフリー ドリュー デーヴィッド，
グレゴリー イー． メンク，
グレゴリー イー． メンク，
ボグスロー エー． スウェデク，
ボグスロー エー． スウェデク，
ドイル イー． ベネット，
ドイル イー． ベネット，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2014086733A publication Critical patent/JP2014086733A/ja
Publication of JP2014086733A5 publication Critical patent/JP2014086733A5/ja
Application granted granted Critical
Publication of JP6292819B2 publication Critical patent/JP6292819B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2013218739A 2012-10-23 2013-10-21 選択的スペクトルモニタリングを使用した終点決定 Active JP6292819B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/658,737 US9221147B2 (en) 2012-10-23 2012-10-23 Endpointing with selective spectral monitoring
US13/658,737 2012-10-23

Publications (3)

Publication Number Publication Date
JP2014086733A JP2014086733A (ja) 2014-05-12
JP2014086733A5 JP2014086733A5 (enExample) 2016-12-08
JP6292819B2 true JP6292819B2 (ja) 2018-03-14

Family

ID=50485749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013218739A Active JP6292819B2 (ja) 2012-10-23 2013-10-21 選択的スペクトルモニタリングを使用した終点決定

Country Status (4)

Country Link
US (1) US9221147B2 (enExample)
JP (1) JP6292819B2 (enExample)
KR (1) KR101980921B1 (enExample)
TW (1) TWI643701B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9248544B2 (en) * 2012-07-18 2016-02-02 Applied Materials, Inc. Endpoint detection during polishing using integrated differential intensity
KR20170092522A (ko) 2014-09-08 2017-08-11 더 리서치 파운데이션 포 더 스테이트 유니버시티 오브 뉴욕 금속 격자 및 이의 측정 방법
CN107097154B (zh) * 2017-04-28 2023-06-13 昆明理工大学 一种简易抛光液流量控制供给装置及其控制方法
US10964609B2 (en) * 2018-11-30 2021-03-30 Taiwan Semiconductor Manufacturing Company, Ltd. Apparatus and method for detecting end point
CN119486839A (zh) * 2022-06-22 2025-02-18 应用材料公司 用于控制抛光处理的窗口逻辑

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5747380A (en) 1996-02-26 1998-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. Robust end-point detection for contact and via etching
US6271047B1 (en) 1998-05-21 2001-08-07 Nikon Corporation Layer-thickness detection methods and apparatus for wafers and the like, and polishing apparatus comprising same
TW398036B (en) 1998-08-18 2000-07-11 Promos Technologies Inc Method of monitoring of chemical mechanical polishing end point and uniformity
US6358327B1 (en) 1999-06-29 2002-03-19 Applied Materials, Inc. Method for endpoint detection using throttle valve position
JP3932836B2 (ja) * 2001-07-27 2007-06-20 株式会社日立製作所 薄膜の膜厚計測方法及びその装置並びにそれを用いたデバイスの製造方法
US6618130B2 (en) 2001-08-28 2003-09-09 Speedfam-Ipec Corporation Method and apparatus for optical endpoint detection during chemical mechanical polishing
US6806948B2 (en) 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP5534672B2 (ja) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
US7764377B2 (en) 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US8260446B2 (en) 2005-08-22 2012-09-04 Applied Materials, Inc. Spectrographic monitoring of a substrate during processing using index values
US7998358B2 (en) * 2006-10-31 2011-08-16 Applied Materials, Inc. Peak-based endpointing for chemical mechanical polishing
KR101678082B1 (ko) * 2007-02-23 2016-11-21 어플라이드 머티어리얼스, 인코포레이티드 연마 엔드포인트들을 결정하기 위한 스펙트럼 사용
WO2010062497A2 (en) * 2008-10-27 2010-06-03 Applied Materials, Inc. Goodness of fit in spectrographic monitoring of a substrate during processing
US8751033B2 (en) 2008-11-14 2014-06-10 Applied Materials, Inc. Adaptive tracking spectrum features for endpoint detection
US20100316962A1 (en) 2009-06-10 2010-12-16 Heidi Elise Newell Method for embodying an incense-coated template in variety of ornate and complex designs or patterns
JP5583946B2 (ja) * 2009-10-06 2014-09-03 株式会社荏原製作所 研磨終点検知方法および研磨終点検知装置
WO2011056485A2 (en) * 2009-11-03 2011-05-12 Applied Materials, Inc. Endpoint method using peak location of spectra contour plots versus time
US8834229B2 (en) * 2010-05-05 2014-09-16 Applied Materials, Inc. Dynamically tracking spectrum features for endpoint detection
US20110282477A1 (en) * 2010-05-17 2011-11-17 Applied Materials, Inc. Endpoint control of multiple substrates with multiple zones on the same platen in chemical mechanical polishing
US8930013B2 (en) * 2010-06-28 2015-01-06 Applied Materials, Inc. Adaptively tracking spectrum features for endpoint detection
TWI478259B (zh) * 2010-07-23 2015-03-21 Applied Materials Inc 用於終點偵測之二維光譜特徵追蹤
US20120034844A1 (en) * 2010-08-05 2012-02-09 Applied Materials, Inc. Spectrographic monitoring using index tracking after detection of layer clearing
US8694144B2 (en) * 2010-08-30 2014-04-08 Applied Materials, Inc. Endpoint control of multiple substrates of varying thickness on the same platen in chemical mechanical polishing
US20120100781A1 (en) * 2010-10-20 2012-04-26 Jimin Zhang Multiple matching reference spectra for in-situ optical monitoring
US8825988B2 (en) * 2010-11-12 2014-09-02 Advanced Micro Devices, Inc. Matrix algorithm for scheduling operations
US20120278028A1 (en) 2011-04-28 2012-11-01 Jeffrey Drue David Generating model based spectra library for polishing
KR101892914B1 (ko) 2012-03-08 2018-08-29 어플라이드 머티어리얼스, 인코포레이티드 측정된 스펙트럼에 대한 광학 모델의 피팅
US8563335B1 (en) 2012-04-23 2013-10-22 Applied Materials, Inc. Method of controlling polishing using in-situ optical monitoring and fourier transform
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
US8808059B1 (en) * 2013-02-27 2014-08-19 Applied Materials, Inc. Spectraphic monitoring based on pre-screening of theoretical library

Also Published As

Publication number Publication date
TWI643701B (zh) 2018-12-11
JP2014086733A (ja) 2014-05-12
KR101980921B1 (ko) 2019-05-21
US20140113524A1 (en) 2014-04-24
KR20140051798A (ko) 2014-05-02
US9221147B2 (en) 2015-12-29
TW201422368A (zh) 2014-06-16

Similar Documents

Publication Publication Date Title
TWI546524B (zh) 用於將光學模型擬合至測量光譜的方法及電腦程式產品
KR101944325B1 (ko) 다중 스펙트럼들을 이용한 화학 기계적 연마에서의 종료점 검출
KR101918803B1 (ko) 푸리에 변환을 이용한 막 두께의 측정
US8992286B2 (en) Weighted regression of thickness maps from spectral data
US9011202B2 (en) Fitting of optical model with diffraction effects to measured spectrum
JP6292819B2 (ja) 選択的スペクトルモニタリングを使用した終点決定
TW201213050A (en) Spectrographic monitoring using index tracking after detection of layer clearing
JP2017515307A (ja) 終点検出のための連続特徴トラッキング
JP5774482B2 (ja) 処理中の基板の分光モニタリングにおける適合度
CN104849218B (zh) 分组来自抛光基板的光谱数据
KR102108709B1 (ko) 폴리싱 엔드포인트 검출에서의 데이터 시퀀스들을 위한 사용자 입력 함수들
US9248544B2 (en) Endpoint detection during polishing using integrated differential intensity
TWI726847B (zh) 製造基板的方法，及其電腦程式產品和積體電路製造系統
US9679823B2 (en) Metric for recognizing correct library spectrum

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161021

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161021

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170807

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170815

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20171114

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180116

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180213

R150 Certificate of patent or registration of utility model

Ref document number: 6292819

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250